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SPC564L54L5CBFSR

STMicroelectronics

SPC564L54L5CBFSR by STMicroelectronics

SPC564L54L5CBFSR by STMicroelectronics is a 32-bit microcontroller with 3.3V power supply, 64-bit external data bus width, and 40MHz max clock frequency. Ideal for automotive applications due to its FLASH ROM programmability, ADC and DMA channels, and operating temperature range of -40 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,477 parts In-Stock

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5,477

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Digiode

USA . 4,746 parts In-Stock

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4,746

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Anansix

USA . 255 parts In-Stock

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255

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 64 parts In-Stock

1+ parts

$10.850

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-

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64

$10.850

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Vigor

Singapore . 1,714 parts In-Stock

1+ parts

$12.690

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-

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1,714

$12.690

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Microchip USA

USA . 3,144 parts In-Stock

1+ parts

$43.083

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3,144

$43.083

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IDEA Electronic Components Group

UK . 2,091 parts In-Stock

1+ parts

$64.318

100+ parts

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$57.886

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2,091

$64.318

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$57.886

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MKK Technologies

India . 636 parts In-Stock

1+ parts

$120.946

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636

$120.946

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DigiPath Technology Company

USA . 636 parts In-Stock

1+ parts

$120.946

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636

$120.946

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Corphita

USA . 4,127 parts In-Stock

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4,127

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Parana Technologies

USA . 934 parts In-Stock

1+ parts

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$76.902

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934

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$76.902

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Overview

Unlock a world of possibilities with the SPC564L54L5CBFSR microcontroller from STMicroelectronics. As a leader in the industry, STMicroelectronics ensures top-notch quality and reliability. This microcontroller is perfect for automotive applications, offering high performance and efficiency. With features like ADC channels, DMA channels, and PWM channels, this product provides unmatched value and benefits to customers looking for cutting-edge technology. Experience the advantages of the SPC564L54L5CBFSR and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and resistant to wear and tear.

Surface Mount: YES

Surface mount technology makes it easy to integrate the microcontroller into a variety of electronic devices, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.63 V

The high maximum supply voltage allows for flexibility in power supply options while ensuring reliable performance.

Address Bus Width: 32

A wide address bus width enables the microcontroller to access a large memory capacity efficiently, enhancing overall performance.

Package Shape: SQUARE

The square package shape helps in easy handling and placement on circuit boards, contributing to a streamlined design.

Bit Size: 32

The 32-bit size allows for high-speed processing and efficient handling of data, making the microcontroller suitable for a wide range of applications.

Power Supplies (V): 3.3

The 3.3V power supply is a common standard in electronics, providing compatibility and interoperability with other components.

No. of Terminals: 144

Having a large number of terminals increases connectivity options and allows for the integration of multiple peripherals, enhancing versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact form factor, making the microcontroller suitable for space-constrained applications while enabling high-density PCB designs.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power consumption and can be used in applications where power efficiency is crucial.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes the microcontroller suitable for use in harsh environments or applications requiring extended temperature ranges.

CPU Family: SPC56

Being part of the SPC56 CPU family signifies high performance, reliability, and compatibility with software and development tools specific to this family.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microcontroller to function reliably in extreme cold conditions, making it suitable for a wide range of applications.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, facilitating sensor interfacing and data acquisition in various applications.

DMA Channels: YES

DMA channels help in efficient data transfer between peripherals and memory, improving overall system performance and freeing up the CPU for other tasks.

Terminal Position: QUAD

The quad terminal position allows for easy placement and soldering on the circuit board, enhancing stability and reliability.

ROM Words: 786432

The large ROM capacity enables storing a significant amount of program code and data, making the microcontroller suitable for complex applications.

Width: 20 mm

The compact width of the microcontroller contributes to space-saving designs, ideal for applications where size constraints are critical.

External Data Bus Width: 64

A wide external data bus width facilitates high-speed data transfer and processing, enhancing system performance and efficiency.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency allows for fast and efficient operation, suitable for real-time processing and high-speed applications.

Length: 20 mm

The compact length of the microcontroller contributes to a smaller overall footprint, making it suitable for compact electronic devices and PCB designs.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliable operation in automotive applications, withstanding harsh environmental conditions and temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller implies that the product integrates various peripherals and interfaces, making it a complete solution for embedded system designs.

RAM Bytes: 98304

The ample RAM capacity allows for efficient data storage and retrieval, supporting multitasking and complex algorithms in diverse applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

The gull-wing terminal form provides secure solder connections and ease of assembly, ensuring reliable electrical connections in the application.

Maximum Supply Current: 311.6 mA

The moderate maximum supply current allows for efficient power consumption while providing sufficient current for various peripherals and components.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3V ensures compatibility with standard power sources and other components, making integration easier.

PWM Channels: YES

The presence of PWM channels enables precise control of pulse-width modulation signals, essential for motor control, lighting, and other applications.

ROM Programmability: FLASH

The ability to programm the ROM using flash technology allows for easy updates, modifications, and customization of firmware, enhancing flexibility.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density mounting on PCBs, increasing the number of connections in a limited space and improving design flexibility.

Speed: 120 rpm

With a speed of 120 rpm, the microcontroller can handle tasks quickly and efficiently, suitable for applications requiring rapid processing.

No. of I/O Lines: 16

Having 16 I/O lines provides sufficient connectivity for interfacing with external devices and peripherals, enhancing the versatility and functionality of the microcontroller.

Technical Specifications

Microcontrollers SPC564L54L5CBFSR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

SPC56

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

16

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

786432

ROM Programmability:

FLASH

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

311.6 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SPC564L54L5CBFSR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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