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SPC564B74L7C8E0X

STMicroelectronics

SPC564B74L7C8E0X by STMicroelectronics

STMicroelectronics SPC564B74L7C8E0X is a 32-bit microcontroller with 176 terminals, operating at up to 40 MHz. Ideal for automotive applications, it features 27 ADC channels, 32 DMA channels, and peripherals like PWM and RTC. With a low power mode and boundary scan support, it offers high performance in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,663 parts In-Stock

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5,663

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Digiode

USA . 3,793 parts In-Stock

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3,793

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Anansix

USA . 264 parts In-Stock

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264

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Distributors (Availability)

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AZTECH Wire

Italy . 1,116 parts In-Stock

1+ parts

$13.610

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1,116

$13.610

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Vigor

Singapore . 2,000 parts In-Stock

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$14.470

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2,000

$14.470

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Ampacity Inc.

Singapore . 1,570 parts In-Stock

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$18.000

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1,570

$18.000

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Microchip USA

USA . 2,434 parts In-Stock

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$46.754

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2,434

$46.754

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IDEA Electronic Components Group

UK . 742 parts In-Stock

1+ parts

$50.337

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$45.303

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742

$50.337

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$45.303

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Corohmni

South Africa . 317 parts In-Stock

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$61.237

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317

$61.237

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MKK Technologies

India . 1,595 parts In-Stock

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$94.655

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1,595

$94.655

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DigiPath Technology Company

USA . 1,595 parts In-Stock

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$94.655

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1,595

$94.655

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Continental Prestige Electronics

USA . 2,725 parts In-Stock

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2,725

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Argo Parts USA

USA . 1,506 parts In-Stock

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Corphita

USA . 634 parts In-Stock

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Parana Technologies

USA . 511 parts In-Stock

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$60.185

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511

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$60.185

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Netroflash

USA . 100 parts In-Stock

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100

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Overview

Unleash the power of innovation with the SPC564B74L7C8E0X microcontroller by STMicroelectronics. Crafted with precision and expertise, this cutting-edge device offers unparalleled performance and reliability for a wide range of applications. Whether you're designing automotive systems, industrial controls, or consumer electronics, this microcontroller is sure to exceed your expectations. Experience seamless connectivity, advanced peripherals, and low power modes that optimize efficiency without compromising speed. Elevate your projects and unlock endless possibilities with the SPC564B74L7C8E0X microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V makes this microcontroller compatible with a wide range of power sources.

Package Shape: SQUARE

Square package shape ensures efficient use of board space and easy routing of connections.

Bit Size: 32

32-bit architecture provides high processing power and performance for demanding applications.

No. of Terminals: 176

With 176 terminals, this microcontroller offers ample connectivity options for interfacing with external devices and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch style ensures easy installation and minimizes the overall footprint on the PCB.

Minimum Supply Voltage: 3 V

Support for a minimum supply voltage of 3V ensures compatibility with lower power sources, increasing flexibility in design.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C allows the microcontroller to withstand harsh environmental conditions.

CPU Family: E200Z4

The E200Z4 CPU family offers powerful processing capabilities and rich features for versatile applications.

No. of External Interrupts: 24

Having 24 external interrupts allows the microcontroller to respond quickly to external events or signals.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures reliable performance in cold environments.

ADC Channels: YES

Integrated ADC channels enable analog data acquisition and processing, expanding the range of applications this microcontroller can be used for.

DMA Channels: YES

DMA channels improve data transfer efficiency by offloading data movement tasks from the CPU, optimizing performance.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and routing, enhancing ease of assembly and reducing design complexity.

ROM Words: 3145728

Large ROM capacity of 3145728 words allows for storing extensive program code and data, catering to complex application requirements.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6mm saves space on the PCB and enables compact designs.

Width: 24 mm

Compact width of 24mm facilitates integration into small form factor devices without sacrificing functionality.

Data EEPROM Size: 64K

Generous data EEPROM size of 64K allows for non-volatile data storage, critical for persistent data retention in power-off situations.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging during manufacturing and maintenance processes, ensuring product quality and reliability.

Peripherals: DMA(32), PWM, RTC, TIMER(12), WDT

The inclusion of various peripherals such as DMA, PWM, RTC, and timers enhances the microcontroller's capability to handle diverse tasks efficiently.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency of 40MHz enables fast data processing and response times, suitable for real-time applications.

Length: 24 mm

The compact length of 24mm complements the small width, making this microcontroller a space-saving choice for compact designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature grade ensures reliable operation in extreme temperature conditions, making it suitable for automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers efficient and streamlined instruction processing for optimized performance.

RAM Bytes: 196608

Ample RAM capacity of 196608 bytes allows for temporary data storage and efficient multitasking, enhancing the microcontroller's performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, making this microcontroller energy-efficient and versatile.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and enhances mechanical strength, ensuring reliable connections for stable operation.

Analog To Digital Convertors: 27-Ch 10-Bit, 5-Ch 12-Bit

The integrated analog-to-digital converters with varied resolutions enable accurate and efficient conversion of analog signals, expanding the range of applications this microcontroller can support.

Maximum Supply Current: 300 mA

Support for a maximum supply current of 300mA ensures efficient power consumption and compatibility with power sources, contributing to overall energy efficiency.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V provides stability and compatibility with standard voltage levels, ensuring reliable operation in various applications.

No. of DMA Channels: 32

Having 32 DMA channels offers enhanced data transfer capabilities, optimizing system performance by reducing CPU load and improving overall efficiency.

PWM Channels: YES

Support for PWM channels allows for precise control of output signals, making this microcontroller suitable for applications requiring accurate pulse width modulation.

Connectivity: CAN(6); I2C; SPI(8); UART(10)

A variety of connectivity options including CAN, I2C, SPI, and UART enable seamless communication with external devices and interfaces, enhancing the versatility of this microcontroller.

ROM Programmability: FLASH

Flash ROM programmability offers flexibility in updating firmware and software, allowing for easy and efficient development and maintenance of applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density integration and precise connection on the PCB, enabling compact and reliable designs.

Format: FIXED POINT

Fixed-point format simplifies mathematical operations and ensures consistent precision, critical for accurate data processing in various applications.

Speed: 120 rpm

Support for a speed of 120rpm meets the requirements of applications demanding precise timing and control, making this microcontroller a reliable choice for such applications.

Low Power Mode: YES

Low power mode capability enhances energy efficiency and extends battery life, making this microcontroller suitable for battery-powered and energy-conscious applications.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 bits allows for efficient storage and retrieval of program code, contributing to faster execution and optimized performance.

No. of I/O Lines: 147

With 147 I/O lines, this microcontroller offers extensive connectivity options for interfacing with peripherals, sensors, and external devices, enhancing its versatility in various applications.

Technical Specifications

Microcontrollers SPC564B74L7C8E0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 5 V

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

32

No. of External Interrupts:

24

No. of I/O Lines:

147

No. of Terminals:

176

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

196608

ROM Words:

3145728

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

300 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(6); I2C; SPI(8); UART(10)

Peripherals:

DMA(32), PWM, RTC, TIMER(12), WDT

Analog To Digital Convertors:

27-Ch 10-Bit, 5-Ch 12-Bit

Trade Compliance

SPC564B74L7C8E0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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