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SPC564B64L7C9E0X

STMicroelectronics

SPC564B64L7C9E0X by STMicroelectronics

SPC564B64L7C9E0X by STMicroelectronics is a 32-bit microcontroller with 176 terminals, operating at up to 40 MHz. Ideal for automotive applications, it features 27-Ch 10-Bit ADCs, CAN(6) connectivity, and low power mode for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,706 parts In-Stock

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7,706

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Digiode

USA . 2,911 parts In-Stock

1+ parts

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2,911

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Anansix

USA . 1,643 parts In-Stock

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1,643

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Chip Stock

USA . 624 parts In-Stock

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624

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,496 parts In-Stock

1+ parts

$13.600

100+ parts

-

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-

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-

1,496

$13.600

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AZTECH Wire

Italy . 291 parts In-Stock

1+ parts

$14.370

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-

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291

$14.370

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Microchip USA

USA . 2,014 parts In-Stock

1+ parts

$43.949

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2,014

$43.949

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IDEA Electronic Components Group

UK . 1,008 parts In-Stock

1+ parts

$49.009

100+ parts

-

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$44.108

10k+ parts

-

1,008

$49.009

-

$44.108

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MKK Technologies

India . 619 parts In-Stock

1+ parts

$92.159

100+ parts

-

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619

$92.159

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DigiPath Technology Company

USA . 619 parts In-Stock

1+ parts

$92.159

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619

$92.159

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Component Stockers USA

USA . 779 parts In-Stock

1+ parts

$190.240

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779

$190.240

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Corphita

USA . 1,611 parts In-Stock

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1,611

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Parana Technologies

USA . 213 parts In-Stock

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$58.598

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213

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$58.598

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Overview

Unleash the power of cutting-edge technology with the SPC564B64L7C9E0X microcontroller by STMicroelectronics. This top-of-the-line product offers unparalleled quality and reliability, making it the perfect choice for a wide range of applications. With a focus on innovation and precision, STMicroelectronics has created a product that delivers exceptional value to customers. Experience seamless connectivity, advanced features, and superior performance with the SPC564B64L7C9E0X microcontroller - your gateway to the future of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

Supports a higher voltage range for flexibility in power requirements.

Bit Size: 32

32-bit processing capability provides higher performance and efficiency for complex tasks.

No. of Terminals: 176

Offers a wide range of I/O options for connecting peripherals and external components.

Minimum Supply Voltage: 3 V

Supports low power operation while maintaining stable performance.

Maximum Operating Temperature: 125 °C

Allows for reliable operation in high-temperature environments, such as automotive applications.

CPU Family: E200Z4

Part of a well-established and reliable CPU family, ensuring compatibility and support.

No. of External Interrupts: 24

Enables efficient handling of external events and interrupts for real-time responsiveness.

ADC Channels: YES

Built-in Analog to Digital Converters provide the ability to interface with analog sensors and signals.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce CPU workload.

ROM Words: 1572864

Large amount of on-chip memory for storing program instructions and data.

Maximum Clock Frequency: 40 MHz

High clock frequency supports fast processing and real-time operation.

RAM Bytes: 131072

Ample amount of Random Access Memory for storing data and intermediate results during operation.

Connectivity: CAN(6), I2C, SCI(10), SPI(8)

Multiple communication interfaces broaden the range of devices and systems the microcontroller can interact with.

Technical Specifications

Microcontrollers SPC564B64L7C9E0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 5V NOMINAL SUPPLY, ALSO HAVING SHARED 19-CHANNELS OF ADC

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

E200Z4

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of DMA Channels:

32

No. of External Interrupts:

24

No. of I/O Lines:

147

No. of Terminals:

176

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

131072

ROM Words:

1572864

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Maximum Supply Current:

300 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(6), I2C, SCI(10), SPI(8)

Peripherals:

DMA(32), RTC, TIMER(12), WDT

Analog To Digital Convertors:

27-Ch 10-Bit; 5-Ch 12-Bit

Trade Compliance

SPC564B64L7C9E0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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