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SPC564A80L7CFBR

STMicroelectronics

SPC564A80L7CFBR by STMicroelectronics

STMicroelectronics SPC564A80L7CFBR is a 32-bit microcontroller with 176 terminals, operating at up to 40 MHz. It features 34 ADC channels, 64 DMA peripherals, and supports CAN, FLEXRAY, LIN connectivity. Ideal for automotive applications due to its wide temperature range of -40 °C to 125°C and flash ROM programmability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,695 parts In-Stock

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2,695

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Anansix

USA . 2,527 parts In-Stock

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2,527

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Vyrian

USA . 2,501 parts In-Stock

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2,501

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$9.904

100+ parts

$9.013

1k+ parts

$8.121

10k+ parts

-

150

$9.904

$9.013

$8.121

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AZTECH Wire

Italy . 740 parts In-Stock

1+ parts

$12.480

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-

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740

$12.480

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Vigor

Singapore . 1,258 parts In-Stock

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$18.710

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1,258

$18.710

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Microchip USA

USA . 2,296 parts In-Stock

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$23.870

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2,296

$23.870

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IDEA Electronic Components Group

UK . 821 parts In-Stock

1+ parts

$74.454

100+ parts

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$67.008

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821

$74.454

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$67.008

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MKK Technologies

India . 2,315 parts In-Stock

1+ parts

$140.005

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2,315

$140.005

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DigiPath Technology Company

USA . 2,315 parts In-Stock

1+ parts

$140.005

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2,315

$140.005

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Component Stockers USA

USA . 134 parts In-Stock

1+ parts

$353.330

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134

$353.330

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Corphita

USA . 1,328 parts In-Stock

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1,328

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Parana Technologies

USA . 481 parts In-Stock

1+ parts

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$89.021

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481

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$89.021

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Overview

Experience unparalleled performance and reliability with the SPC564A80L7CFBR microcontroller by STMicroelectronics. As a trusted industry leader, STMicroelectronics delivers cutting-edge technology that meets the highest standards in the automotive sector. This versatile microcontroller offers a wide range of applications, from CAN connectivity to ADC channels, providing customers with endless possibilities for their projects. With advanced features such as PWM channels and DMA support, this product ensures seamless integration and exceptional functionality. Elevate your designs with the SPC564A80L7CFBR and unlock a world of opportunities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 1.32 V

The microcontroller can handle higher supply voltages, allowing for flexibility in power supply options.

Address Bus Width: 32

Wide address bus width allows for efficient memory access and data transfer operations.

Bit Size: 32

32-bit architecture enables the microcontroller to process data and instructions in larger chunks, improving overall performance.

Power Supplies (V): 1.2,3.3,5

Support for multiple power supply voltages caters to different power requirements of various parts of the system.

ROM Words: 1048576

Large ROM capacity allows for storing a significant amount of program data, resulting in versatile functionality.

RAM Bytes: 196608

Generous RAM size provides ample space for temporary data storage and efficient multitasking capabilities.

ADC Channels: YES

Integrated Analog to Digital Converters allow for easy interfacing with analog sensors and signals, expanding the range of applications.

DMA Channels: YES

Direct Memory Access channels enhance data transfer efficiency between peripherals and memory, optimizing performance.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it offers a wide range of integrated peripherals and features for complete system control.

Technical Specifications

Microcontrollers SPC564A80L7CFBR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e3

Length:

24 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

120

No. of Terminals:

176

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3,5

Qualification:

Not Qualified

RAM Bytes:

196608

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

120 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

445 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(3), FLEXRAY, LIN, SCI(3), SPI(3)

Peripherals:

DMA(64), POR, TIMER(10)

Analog To Digital Convertors:

34-Ch 12-Bit

Trade Compliance

SPC564A80L7CFBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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