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SPC564A70L7COBY

STMicroelectronics

SPC564A70L7COBY by STMicroelectronics

SPC564A70L7COBY by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 1.32V and operates at up to 40 MHz. It features ADC, DMA, and PWM channels, making it ideal for automotive applications. Its compact FLATPACK design ensures efficient space utilization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,443 parts In-Stock

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10,443

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Digiode

USA . 3,709 parts In-Stock

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3,709

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Anansix

USA . 349 parts In-Stock

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349

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Distributors (Availability)

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Vigor

Singapore . 3,467 parts In-Stock

1+ parts

$13.910

100+ parts

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3,467

$13.910

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AZTECH Wire

Italy . 988 parts In-Stock

1+ parts

$18.850

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988

$18.850

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Ampacity Inc.

Singapore . 261 parts In-Stock

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$19.000

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261

$19.000

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IDEA Electronic Components Group

UK . 2,055 parts In-Stock

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$37.814

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$34.032

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2,055

$37.814

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$34.032

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Microchip USA

USA . 2,958 parts In-Stock

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$47.525

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2,958

$47.525

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MKK Technologies

India . 178 parts In-Stock

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$71.106

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178

$71.106

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DigiPath Technology Company

USA . 178 parts In-Stock

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$71.106

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178

$71.106

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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Corphita

USA . 3,527 parts In-Stock

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3,527

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Parana Technologies

USA . 1,062 parts In-Stock

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$45.212

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1,062

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$45.212

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Overview

Unlock unmatched performance and reliability with the SPC564A70L7COBY microcontroller from STMicroelectronics. Renowned for their innovative technology, STMicroelectronics delivers a versatile solution perfect for automotive and industrial applications. With low power consumption and high processing capabilities, this microcontroller ensures efficient operation while enhancing your designs. Elevate your projects with superior quality and performance that only STMicroelectronics can provide!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact designs and makes the assembly process easier and more efficient.

Maximum Supply Voltage: 1.32 V

A maximum supply voltage of 1.32 V ensures low power consumption, which is crucial for battery-operated or energy-sensitive applications.

Address Bus Width: 32

A 32-bit address bus width allows the microcontroller to efficiently handle larger amounts of memory and more complex operations.

Package Shape: SQUARE

The square package shape simplifies layout and design on PCB, making it easier to integrate into various applications.

Bit Size: 32

The 32-bit architecture enhances processing abilities, allowing for more sophisticated applications and higher performance operations.

No. of Terminals: 176

With 176 terminals, this microcontroller allows for extensive connectivity options to peripherals and interfaces.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack style is ideal for space-constrained designs and offers lower profile installations, enhancing versatility in applications.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage allows for compatibility with a wider range of power sources and enhances the product's flexibility.

ADC Channels: YES

The inclusion of ADC channels enables the microcontroller to interact with the analog world, which is essential for sensor integration.

DMA Channels: YES

Direct Memory Access channels allow for efficient data transfer with minimal CPU intervention, improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning offers improved connectivity and allows for more flexible routing options on the PCB.

Width: 24 mm

A compact width of 24 mm facilitates integration into tight spaces without compromising performance.

External Data Bus Width: 64

A 64-bit external data bus width enhances the data throughput capabilities and supports high-bandwidth applications.

Maximum Clock Frequency: 40 MHz

A maximum clock frequency of 40 MHz ensures that the microcontroller can handle demanding tasks and real-time processing efficiently.

Length: 24 mm

A length of 24 mm contributes to a compact design, making it suitable for a variety of applications with limited space.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture is optimized for high performance, enabling rapid processing and efficient instruction execution.

Terminal Form: GULL WING

Gull wing terminals provide good soldering characteristics and improve mechanical strength in various mounting environments.

Nominal Supply Voltage: 1.2 V

The nominal voltage of 1.2 V is suitable for low-power applications, contributing to overall efficiency and conservation.

PWM Channels: YES

PWM channels allow for precise control of motor speed and intensity for applications such as motor drivers and audio applications.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch facilitates a compact layout and can help in doubling the number of terminals available in a given area.

Speed: 120 rpm

A speed rating of 120 rpm supports applications such as motors, enabling effective control and automation.

No. of I/O Lines: 112

With 112 I/O lines, this microcontroller offers extensive interfacing capabilities, suited for complex designs and multiple peripheral attachments.

Technical Specifications

Microcontrollers SPC564A70L7COBY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

64

Length:

24 mm

No. of I/O Lines:

112

No. of Terminals:

176

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Trade Compliance

SPC564A70L7COBY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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