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SPC563M64L7COAR

STMicroelectronics

SPC563M64L7COAR by STMicroelectronics

SPC563M64L7COAR by STMicroelectronics is a 32-bit microcontroller designed for automotive applications, featuring a max supply voltage of 5.25V and operating temp range from -40 °C to 125°C. It supports up to 80 MHz clock speed, with 176 terminals and ADC/DMA channels. Ideal for high-performance tasks, it offers robust functionality in compact designs.

Median Price

$11.427

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 18,000 parts In-Stock

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18,000

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IBS Electronics

USA . 5,500 parts In-Stock

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$11.427

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5,500

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$11.427

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Digiode

USA . 4,288 parts In-Stock

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4,288

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Vyrian

USA . 3,061 parts In-Stock

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3,061

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Sensible Micro Corp

USA . 1,779 parts In-Stock

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1,779

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Anansix

USA . 353 parts In-Stock

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353

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Distributors (Availability)

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AZTECH Wire

Italy . 884 parts In-Stock

1+ parts

$10.240

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-

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884

$10.240

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Vigor

Singapore . 2,000 parts In-Stock

1+ parts

$10.290

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2,000

$10.290

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IDEA Electronic Components Group

UK . 2,274 parts In-Stock

1+ parts

$61.532

100+ parts

-

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$55.379

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2,274

$61.532

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$55.379

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MKK Technologies

India . 1,512 parts In-Stock

1+ parts

$115.708

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1,512

$115.708

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DigiPath Technology Company

USA . 1,512 parts In-Stock

1+ parts

$115.708

100+ parts

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1,512

$115.708

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Perfect Parts

USA . 32,187 parts In-Stock

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GreenTree Electronics

Israel . 16,500 parts In-Stock

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16,500

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QUARKTWIN TECHNOLOGY LTD

USA . 11,948 parts In-Stock

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11,948

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Kepictronics

USA . 5,000 parts In-Stock

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Corphita

USA . 2,456 parts In-Stock

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2,456

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Microchip USA

USA . 2,356 parts In-Stock

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2,356

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Alle Elektronik GmbH

Germany . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,144 parts In-Stock

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$73.571

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1,144

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$73.571

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Metaverse IC Inc.

Canada . 389 parts In-Stock

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389

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Overview

Unlock unparalleled performance with the SPC563M64L7COAR microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for automotive applications, its robust architecture ensures reliability in extreme conditions, while offering impressive power efficiency and adaptability. Experience seamless integration with advanced features that enhance your projects, empowering you to achieve exceptional results and drive success in your designs. Choose quality, choose STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and effective protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space, ideal for modern electronics.

Maximum Supply Voltage: 5.25 V

A higher maximum supply voltage provides flexibility in power supply choices, accommodating a range of applications.

Address Bus Width: 32

A 32-bit address bus enables access to a larger memory space, enhancing the microcontroller's capability for complex tasks.

Package Shape: SQUARE

The square shape helps optimize space on the PCB, making it easier to design dense layouts.

Bit Size: 32

A 32-bit architecture allows for better performance and handling of more complex data types.

Power Supplies (V): 1.2, 3.3, 5

Support for multiple supply voltages increases versatility and compatibility with various systems.

No. of Terminals: 176

With 176 terminals, this microcontroller offers extensive connectivity options for peripheral devices.

Package Style (Meter): FLATPACK

Flatpack packaging is beneficial for automated assembly processes, improving production efficiency.

Minimum Supply Voltage: 4.5 V

A lower minimum supply voltage range allows operation in battery-powered applications, enhancing energy efficiency.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliable performance in demanding environments, such as automotive applications.

Minimum Operating Temperature: -40 °C

Extended temperature ranges make this microcontroller suitable for extreme conditions, ensuring reliability in various climates.

Terminal Finish: TIN

Tin terminal finish provides good solderability and resistance to corrosion, enhancing longevity and reliability.

ADC Channels: YES

Inclusion of ADC channels allows for precise analog signal processing, which is critical for sensor applications.

DMA Channels: YES

DMA channels facilitate efficient data transfer between peripherals, reducing CPU load and improving performance.

Terminal Position: QUAD

Quad terminal positioning provides better accessibility and layout flexibility on the PCB.

ROM Words: 1,572,864

A significant ROM capacity supports complex applications and firmware, allowing for extensive program storage.

Maximum Seated Height: 1.6 mm

The low seated height contributes to a compact design, beneficial for space-constrained applications.

Width: 24 mm

A standardized width allows for easier integration into existing designs and enclosures.

External Data Bus Width: 64

The 64-bit external data bus allows for high-speed data transfer, improving overall system performance.

Maximum Clock Frequency: 80 MHz

A high clock frequency facilitates faster processing capabilities, enabling the handling of more complex operations.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures compatibility with standard PCB assembly processes for reliable soldering.

Peak Reflow Temperature °C: 260

The ability to withstand high reflow temperatures enhances solder joint reliability in demanding applications.

Length: 24 mm

The compact length aids in fitting the microcontroller into tight spaces, suitable for a wide range of designs.

Temperature Grade: AUTOMOTIVE

Having an automotive temperature grade ensures the microcontroller meets stringent industry standards for reliability and durability.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, this product is designed for handle specific tasks with efficiency and optimized performance.

RAM Bytes: 96,256

Ample RAM allows for the execution of larger and more sophisticated applications, enhancing functionality.

Technology: CMOS

CMOS technology provides low power consumption, making it ideal for battery-powered and energy-sensitive applications.

Terminal Form: GULL WING

The gull wing form factor promotes easy soldering and effective thermal management, benefiting assembly processes.

Maximum Supply Current: 195 mA

The maximum current rating ensures the microcontroller can support demanding applications without performance degradation.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V makes the microcontroller compatible with many traditional systems, simplifying integration.

PWM Channels: YES

PWM channels allow for effective control of motors and other devices, expanding the application areas of the microcontroller.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of firmware, enhancing the product's lifecycle and adaptability.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch enables denser designs and high-performance routing on PCBs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates suitable precautions are needed during handling, ensuring the microcontroller is protected from moisture damage.

Speed: 80 RPM

A maximum operational speed of 80 RPM enhances processing capabilities, benefiting applications requiring quick responses.

No. of I/O Lines: 80

With 80 I/O lines, this microcontroller provides substantial connectivity options for interfacing with various peripherals and sensors.

Technical Specifications

Microcontrollers SPC563M64L7COAR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e3

Length:

24 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

80

No. of Terminals:

176

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3,5

Qualification:

Not Qualified

RAM Bytes:

96256

ROM Words:

1572864

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

195 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

SPC563M64L7COAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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