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SPC563M64L5COBY

STMicroelectronics

SPC563M64L5COBY by STMicroelectronics

SPC563M64L5COBY by STMicroelectronics is a 32-bit automotive microcontroller with a max supply voltage of 5.25V and operates b/w -40 °C to 125°C. It features 144 terminals, supports ADC and PWM channels, making it ideal for automotive applications. Its robust design ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,187 parts In-Stock

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6,187

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Digiode

USA . 4,084 parts In-Stock

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4,084

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Anansix

USA . 677 parts In-Stock

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677

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 755 parts In-Stock

1+ parts

$9.000

100+ parts

-

1k+ parts

-

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755

$9.000

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Microchip USA

USA . 1,557 parts In-Stock

1+ parts

$15.308

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-

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10k+ parts

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1,557

$15.308

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AZTECH Wire

Italy . 641 parts In-Stock

1+ parts

$20.720

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-

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641

$20.720

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IDEA Electronic Components Group

UK . 1,655 parts In-Stock

1+ parts

$28.969

100+ parts

-

1k+ parts

$26.072

10k+ parts

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1,655

$28.969

-

$26.072

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MKK Technologies

India . 907 parts In-Stock

1+ parts

$54.474

100+ parts

-

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907

$54.474

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DigiPath Technology Company

USA . 907 parts In-Stock

1+ parts

$54.474

100+ parts

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907

$54.474

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Vigor

Singapore . 5,000 parts In-Stock

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5,000

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Corphita

USA . 2,792 parts In-Stock

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2,792

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Parana Technologies

USA . 2,336 parts In-Stock

1+ parts

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$34.637

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2,336

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$34.637

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Overview

Unlock the future of innovation with the SPC563M64L5COBY from STMicroelectronics—a trusted leader in microcontroller solutions. Designed for versatility, this powerful 32-bit microcontroller excels in automotive applications and beyond, delivering unmatched reliability in extreme conditions. With robust performance, extensive I/O options, and superior energy efficiency, it empowers engineers to create smarter, more efficient systems, ensuring your projects are built on quality and excellence. Experience the benefits of top-tier technology that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body material enhances the longevity and reliability of the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and is ideal for modern electronics, enabling easier assembly on circuit boards.

Maximum Supply Voltage: 5.25 V

A higher maximum supply voltage provides flexibility in power supply options, accommodating diverse project requirements.

Address Bus Width: 32

The 32-bit address bus width supports a large memory address space, enabling the microcontroller to handle complex applications efficiently.

Package Shape: SQUARE

The square package shape aids in uniform thermal distribution and is space-efficient on PCB layouts.

Bit Size: 32

A 32-bit architecture ensures high performance and capability to process larger data types, making it suitable for advanced applications.

Power Supplies (V): 1.2, 3.3, 5

Multiple voltage supply options make this microcontroller versatile and adaptable for various system designs.

No. of Terminals: 144

The abundance of terminals allows for extensive interfacing options, enabling connectivity with numerous peripherals and sensors.

Package Style (Meter): FLATPACK

Flatpack design enhances thermal performance and allows for easy soldering on PCBs.

Minimum Supply Voltage: 4.5 V

A relatively low minimum supply voltage allows for efficient use in battery-operated devices.

Maximum Operating Temperature: 125 °C

High temperature tolerance makes this microcontroller ideal for automotive and industrial applications where heat management is crucial.

Minimum Operating Temperature: -40 °C

Cold temperature operational capability ensures functionality in harsh environments such as outdoor or aerospace applications.

ADC Channels: YES

Inclusion of ADC channels enables the microcontroller to interact with analog signals, broadening its application scope in sensor interfacing.

DMA Channels: YES

DMA support allows for more efficient data transfer between peripherals and memory without CPU intervention, improving overall performance.

Terminal Position: QUAD

Quad terminal position maximizes PCB space and enables easier soldering for high-density applications.

ROM Words: 1572864

A large ROM capacity with 1.57 million words of storage allows for extensive program code, ideal for complex applications.

Maximum Seated Height: 1.6 mm

Low seated height is beneficial for space-constrained designs, contributing to slimmer electronic devices.

Width: 19.9 mm

Compact width helps to maintain a smaller footprint on printed circuit boards.

External Data Bus Width: 64

Wider external data bus enhances data transfer rates, improving the performance of data-intensive applications.

Maximum Clock Frequency: 80 MHz

A high clock frequency enables faster processing and execution of complex algorithms, making it suitable for real-time applications.

Length: 19.9 mm

Compact length contributes to a reduced overall PCB area, allowing for more design flexibility.

Temperature Grade: AUTOMOTIVE

Designed with automotive standards, ensuring reliability and performance in critical automotive applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing and control capabilities, making it ideal for embedded systems.

RAM Bytes: 96256

Adequate RAM size supports complex computations and data handling for sophisticated applications.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high speed, perfect for energy-efficient designs.

Terminal Form: GULL WING

Gull wing terminals provide effective soldering and mechanical stability, ensuring reliable connections.

Maximum Supply Current: 195 mA

The maximum supply current rating allows for robust performance under demanding operational conditions.

Nominal Supply Voltage: 5 V

Standard 5V nominal voltage is widely compatible with existing systems and devices.

PWM Channels: YES

Presence of PWM channels facilitates motor control and other signal modulation applications, enhancing versatility.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to the program without needing to replace the chip.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables higher density designs, allowing for the integration of more components into smaller spaces.

Speed: 64 rpm

The 64 rpm speed rating indicates capability for operational tasks requiring moderate speed, suitable for various applications.

No. of I/O Lines: 80

The 80 I/O lines offer extensive interfacing options, allowing for interaction with multiple sensors and other peripherals.

Technical Specifications

Microcontrollers SPC563M64L5COBY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PQFP-G144

Length:

19.9 mm

No. of I/O Lines:

80

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3,5

Qualification:

Not Qualified

RAM Bytes:

96256

ROM Words:

1572864

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

195 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

19.9 mm

Peripheral IC Type:

Trade Compliance

SPC563M64L5COBY Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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