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SPC563M64L5COBR

STMicroelectronics

SPC563M64L5COBR by STMicroelectronics

SPC563M64L5COBR by STMicroelectronics is a 32-bit automotive microcontroller with a max supply voltage of 5.25V and operates b/w -40 °C to 125°C. It features 144 terminals, supports ADC and PWM channels, making it ideal for automotive applications. Its robust design ensures reliability in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,262 parts In-Stock

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7,262

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Digiode

USA . 2,617 parts In-Stock

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2,617

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Anansix

USA . 2,240 parts In-Stock

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2,240

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 63 parts In-Stock

1+ parts

$9.510

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-

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63

$9.510

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Microchip USA

USA . 1,037 parts In-Stock

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$11.595

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1,037

$11.595

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IDEA Electronic Components Group

UK . 1,989 parts In-Stock

1+ parts

$30.413

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$27.372

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1,989

$30.413

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$27.372

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MKK Technologies

India . 2,198 parts In-Stock

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$57.190

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2,198

$57.190

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DigiPath Technology Company

USA . 2,198 parts In-Stock

1+ parts

$57.190

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2,198

$57.190

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Component Stockers USA

USA . 300 parts In-Stock

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$99.990

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300

$99.990

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Corphita

USA . 3,572 parts In-Stock

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3,572

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Vigor

Singapore . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 973 parts In-Stock

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$36.364

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973

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$36.364

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Overview

Unlock the potential of your next automotive project with the SPC563M64L5COBR microcontroller from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers this robust solution, designed to excel in demanding environments. With versatile applications ranging from advanced driver-assistance systems to efficient power management, this microcontroller guarantees superior performance, reliability, and energy efficiency—making it an invaluable asset in your design toolkit. Elevate your creations with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for compact and efficient PCB design, saving space and enhancing the overall performance of the device.

Maximum Supply Voltage: 5.25 V

A maximum supply voltage of 5.25 V offers flexibility in power supply options, accommodating various design requirements.

Address Bus Width: 32

A 32-bit address bus width enables access to larger memory spaces, enhancing the device's capability to handle complex tasks.

Package Shape: SQUARE

The square package shape allows for better thermal management and compatibility with various mounting systems.

Bit Size: 32

With a 32-bit bit size, this microcontroller can process data more efficiently and handle larger integers, which is advantageous for advanced applications.

Power Supplies (V): 1.2, 3.3, 5

Supporting multiple supply voltages increases versatility and allows integration into a wide range of existing systems.

No. of Terminals: 144

With 144 terminals, this microcontroller offers extensive connectivity options for peripherals and I/O devices, making it highly versatile.

Package Style (Meter): FLATPACK

The flatpack style contributes to better heat dissipation and can be easier to manage in automated assembly processes.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage ensures stable operation even under varying power conditions, enhancing reliability.

Maximum Operating Temperature: 125 °C

A high operating temperature threshold makes this microcontroller suitable for automotive and industrial applications, where extreme conditions are common.

Minimum Operating Temperature: -40 °C

Able to function in very low temperatures ensures reliability in harsh environments, such as automotive applications.

ADC Channels: YES

Incorporating ADC channels allows for direct interfacing with sensors, broadening its application range.

DMA Channels: YES

DMA channels enhance data handling efficiency by allowing data transfers without CPU intervention, improving overall system performance.

Terminal Position: QUAD

Quad terminal positioning provides stable connections and facilitates effective signal integrity, which is essential for high-speed operations.

ROM Words: 1572864

Large ROM capacity enables extensive firmware storage, allowing for complex application development.

Maximum Seated Height: 1.6 mm

A low seated height allows for compatibility with compact designs and helps to reduce overall device footprint.

Width: 19.9 mm

Moderate width offers a balanced size for integration into various designs without compromising performance.

External Data Bus Width: 64

A 64-bit external data bus width increases data throughput, allowing for faster processing and communication with other components.

Maximum Clock Frequency: 80 MHz

High clock frequency ensures rapid processing capabilities, making it well-suited for demanding applications.

Length: 19.9 mm

A compact length aids in fitting the microcontroller into tight spaces, enhancing design flexibility.

Temperature Grade: AUTOMOTIVE

Designed for automotive standards, it ensures reliability and performance in critical applications, such as engine management or safety systems.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it is tailored for control applications providing optimized performance for embedded systems.

RAM Bytes: 96256

Ample RAM supports complex data processing and multiple concurrent tasks, catering to modern application demands.

Technology: CMOS

CMOS technology ensures low power consumption while providing high-speed performance, making it suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals provide stable connections and are widely compatible with standard PCB assembly processes.

Maximum Supply Current: 195 mA

A maximum supply current of 195 mA ensures it can handle various peripherals and operational demands efficiently.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard, making it easy to integrate into existing designs.

PWM Channels: YES

The inclusion of PWM channels enhances control features, useful for applications like motor control and signal modulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications, providing flexibility in application development.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for higher component density on PCBs, enabling more complex designs.

Speed: 64 rpm

A speed rating of 64 rpm indicates compatibility with motion control applications, enhancing its versatility across multiple domains.

No. of I/O Lines: 80

Having 80 I/O lines allows for extensive interfacing with various devices, making it suitable for complex projects.

Technical Specifications

Microcontrollers SPC563M64L5COBR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PQFP-G144

Length:

19.9 mm

No. of I/O Lines:

80

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3,5

Qualification:

Not Qualified

RAM Bytes:

96256

ROM Words:

1572864

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

195 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

19.9 mm

Peripheral IC Type:

Trade Compliance

SPC563M64L5COBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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