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SPC563M60L7CPAR

STMicroelectronics

SPC563M60L7CPAR by STMicroelectronics

SPC563M60L7CPAR from STMicroelectronics is a 32-bit automotive microcontroller with a max supply voltage of 5.25V and operates b/w -40 °C to 125°C. It features 80 I/O lines, ADC, and PWM channels for versatile applications in automotive systems. Its compact flatpack design ensures efficient space utilization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,466 parts In-Stock

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5,466

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Digiode

USA . 3,763 parts In-Stock

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3,763

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Anansix

USA . 676 parts In-Stock

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676

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Distributors (Availability)

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AZTECH Wire

Italy . 495 parts In-Stock

1+ parts

$11.080

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495

$11.080

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Microchip USA

USA . 931 parts In-Stock

1+ parts

$23.397

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931

$23.397

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IDEA Electronic Components Group

UK . 560 parts In-Stock

1+ parts

$47.156

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$42.441

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560

$47.156

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$42.441

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MKK Technologies

India . 1,718 parts In-Stock

1+ parts

$88.675

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1,718

$88.675

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DigiPath Technology Company

USA . 1,718 parts In-Stock

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$88.675

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1,718

$88.675

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Component Stockers USA

USA . 310 parts In-Stock

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$99.990

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310

$99.990

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Vigor

Singapore . 2,424 parts In-Stock

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2,424

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Parana Technologies

USA . 1,944 parts In-Stock

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$56.383

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1,944

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$56.383

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Corphita

USA . 1,332 parts In-Stock

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Overview

Elevate your projects with the SPC563M60L7CPAR microcontroller from STMicroelectronics, renowned for its quality and reliability. Perfectly engineered for automotive applications, this powerhouse offers exceptional performance in extreme conditions, ensuring safety and longevity. With versatile connectivity options and robust processing capabilities, it empowers developers to innovate without limitations, providing unmatched value and flexibility for your next breakthrough design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy materials provide robustness and reliability in various applications, making it suitable for automotive and industrial environments.

Surface Mount: YES

Surface mount technology allows for compact designs, facilitating easier integration into modern electronics while saving valuable board space.

Maximum Supply Voltage: 5.25 V

A higher maximum supply voltage provides flexibility in powering the microcontroller, allowing it to operate in diverse circuit configurations.

Address Bus Width: 32

A 32-bit address bus enhances memory access capabilities, accommodating larger amounts of memory for more complex applications.

Package Shape: SQUARE

The square package shape is beneficial for symmetrical board layout designs which can simplify routing and placement.

Bit Size: 32

The 32-bit architecture enables faster processing speeds and can handle more significant data sizes, ideal for demanding applications.

Power Supplies (V): 1.2, 3.3, 5

Multiple supply voltages increase versatility, allowing the microcontroller to fit into various systems while ensuring optimal performance.

No. of Terminals: 176

A higher number of terminals allows for extensive interfacing options, enabling more I/O connections to peripherals and other modules.

Package Style (Meter): FLATPACK

Flatpack packaging helps in minimizing the footprint, facilitating integration into space-constrained applications.

Minimum Supply Voltage: 4.5 V

The low minimum voltage ensures compatibility with a broader range of power sources, enhancing the design flexibility.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes it suitable for automotive and industrial applications where heat is a challenge.

Minimum Operating Temperature: -40 °C

The extended minimum operating temperature range allows the microcontroller to function reliably in harsh environmental conditions.

ADC Channels: YES

Having ADC channels enables the microcontroller to interface with analog sensors, broadening its application across different fields.

DMA Channels: YES

Direct Memory Access (DMA) channels enhance data transfer efficiency, reducing CPU load and improving system performance.

Terminal Position: QUAD

Quad terminal positions allow for improved signal integrity and easier connections in dense circuit layouts.

ROM Words: 1048576

With ample ROM capacity, the microcontroller can store more comprehensive codebases, enabling complex functionalities.

Maximum Seated Height: 1.6 mm

The low seated height contributes to a sleek design, appealing for compact electronic devices.

Width: 24 mm

A standardized width of 24 mm makes it easy to integrate into various existing designs without modifications.

External Data Bus Width: 64

The 64-bit external data bus increases bandwidth capabilities, supporting more extensive data operations and improving throughput.

Maximum Clock Frequency: 80 MHz

An 80 MHz clock frequency allows for high-speed processing, making it suitable for time-critical applications.

Length: 24 mm

At a uniform length, it standardizes design dimensions which can simplify PCB layout processes.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates reliability and suitability for automotive applications, where environmental conditions are variable.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates multiple functionalities into one chip, reducing component count and enhancing design efficiency.

RAM Bytes: 65536

Sufficient RAM allows for storing temporary data and variables, crucial for the performance of complex applications.

Technology: CMOS

CMOS technology enables low power consumption and high noise immunity, making it energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals facilitate robust connections to PCB pads and enable automated assembly processes.

Maximum Supply Current: 195 mA

A moderate maximum supply current indicates it can support various power needs while maintaining efficiency.

Nominal Supply Voltage: 5 V

A standard nominal voltage eases integration with widely used power sources in electronic designs.

PWM Channels: YES

Having PWM channels enables better control of motors and lights, broadening application scope in embedded systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the code, supporting iterative development and bug fixing.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch enables high-density layouts, making it suitable for compact electronic designs.

Speed: 80 rpm

An 80 rpm speed rating indicates suitability for various applications, particularly in motor control scenarios.

No. of I/O Lines: 80

A large number of I/O lines supports extensive interfacing with peripherals, making it versatile for complex systems.

Technical Specifications

Microcontrollers SPC563M60L7CPAR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

64

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

No. of I/O Lines:

80

No. of Terminals:

176

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3,5

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

195 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Trade Compliance

SPC563M60L7CPAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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