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SPC560P60L3CEFAR

STMicroelectronics

SPC560P60L3CEFAR by STMicroelectronics

STMicroelectronics SPC560P60L3CEFAR is a 32-bit microcontroller with 5.5V max supply voltage, 40MHz clock frequency, and 65 I/O lines. Ideal for applications requiring ADC and DMA channels, it features a flatpack package style with low profile and fine pitch terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,344 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,344

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-

-

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Digiode

USA . 1,919 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,919

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Anansix

USA . 1,465 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,465

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 8,000 parts In-Stock

1+ parts

$6.230

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

$6.230

-

-

-

AZTECH Wire

Italy . 1,117 parts In-Stock

1+ parts

$13.680

100+ parts

-

1k+ parts

-

10k+ parts

-

1,117

$13.680

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-

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Microchip USA

USA . 2,569 parts In-Stock

1+ parts

$19.912

100+ parts

-

1k+ parts

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10k+ parts

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2,569

$19.912

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IDEA Electronic Components Group

UK . 691 parts In-Stock

1+ parts

$24.282

100+ parts

-

1k+ parts

$21.853

10k+ parts

-

691

$24.282

-

$21.853

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MKK Technologies

India . 1,604 parts In-Stock

1+ parts

$45.660

100+ parts

-

1k+ parts

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10k+ parts

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1,604

$45.660

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-

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DigiPath Technology Company

USA . 1,604 parts In-Stock

1+ parts

$45.660

100+ parts

-

1k+ parts

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10k+ parts

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1,604

$45.660

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-

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Component Stockers USA

USA . 625 parts In-Stock

1+ parts

$84.040

100+ parts

-

1k+ parts

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10k+ parts

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625

$84.040

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Corphita

USA . 2,076 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,076

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Parana Technologies

USA . 914 parts In-Stock

1+ parts

-

100+ parts

$29.032

1k+ parts

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10k+ parts

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914

-

$29.032

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Overview

Elevate your design with the SPC560P60L3CEFAR by STMicroelectronics, a top-of-the-line microcontroller that promises unmatched quality and reliability. As a leading manufacturer in the industry, STMicroelectronics delivers cutting-edge technology, making this microcontroller perfect for a wide range of applications. From automotive systems to industrial automation, this product offers exceptional value, benefits, and advantages to customers looking for superior performance and efficiency. Upgrade your project today with the SPC560P60L3CEFAR and experience the difference that only STMicroelectronics can provide.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable allows for easy automated assembly processes, saving time and effort during production.

Maximum Supply Voltage: 5.5 V

Can handle higher supply voltages, providing flexibility in power supply design.

Address Bus Width: 32

Having a wide address bus width allows for addressing large amounts of memory and peripherals.

Package Shape: SQUARE

Square packages are easier to handle and mount on PCBs compared to irregular shapes.

Bit Size: 32

A 32-bit architecture provides higher computational capabilities compared to lower bit sizes.

No. of Terminals: 100

Having a higher number of terminals allows for more connectivity options and interface possibilities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style saves space on the PCB and enables efficient heat dissipation.

Minimum Supply Voltage: 4.5 V

A lower minimum supply voltage ensures compatibility with a wide range of power sources.

ADC Channels: YES

Integrated ADC channels enable direct conversion of analog signals, reducing external components required.

DMA Channels: YES

Integrated DMA channels allow for efficient data transfer between peripherals and memory without CPU intervention.

Terminal Position: QUAD

Quad terminal position provides better mechanical stability on the PCB.

Width: 14 mm

Compact width saves space on the PCB, ideal for applications with limited board real estate.

External Data Bus Width: 32

Having a wide external data bus width allows for faster data transfer between the microcontroller and external devices.

Maximum Clock Frequency: 40 MHz

Higher clock frequency enables faster processing and response times in real-time applications.

Length: 14 mm

Compact length saves space on the PCB, ideal for applications with limited board real estate.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient instruction execution and improves performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals provide robust mechanical connections to the PCB, ensuring reliability under various operating conditions.

Nominal Supply Voltage: 5 V

The nominal supply voltage provides stable power supply operation within the specified range.

PWM Channels: YES

Integrated PWM channels enable precise control of analog outputs, essential for motor control and power management.

Terminal Pitch: 0.5 mm

Having a fine terminal pitch allows for denser packaging on the PCB, saving space and enabling high pin count designs.

Speed: 64 rpm

Operating at 64 revolutions per minute, this microcontroller offers decent processing speed for a variety of applications.

No. of I/O Lines: 65

With a considerable number of I/O lines, this microcontroller supports versatile connectivity options for interfacing with external devices.

Technical Specifications

Microcontrollers SPC560P60L3CEFAR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

14 mm

No. of I/O Lines:

65

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC560P60L3CEFAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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