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SPC560P60L3BEABY

STMicroelectronics

SPC560P60L3BEABY by STMicroelectronics

SPC560P60L3BEABY microcontroller by STMicroelectronics features a 32-bit address and external data bus width, with a max clock frequency of 40 MHz. It is suitable for applications requiring ADC and DMA channels, offering 65 I/O lines in a compact square package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,099 parts In-Stock

1+ parts

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6,099

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Anansix

USA . 2,734 parts In-Stock

1+ parts

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2,734

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Digiode

USA . 1,466 parts In-Stock

1+ parts

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1,466

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 7,500 parts In-Stock

1+ parts

$6.050

100+ parts

-

1k+ parts

-

10k+ parts

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7,500

$6.050

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AZTECH Wire

Italy . 901 parts In-Stock

1+ parts

$16.760

100+ parts

-

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901

$16.760

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IDEA Electronic Components Group

UK . 1,871 parts In-Stock

1+ parts

$72.248

100+ parts

-

1k+ parts

$65.023

10k+ parts

-

1,871

$72.248

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$65.023

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MKK Technologies

India . 1,505 parts In-Stock

1+ parts

$135.857

100+ parts

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1,505

$135.857

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DigiPath Technology Company

USA . 1,505 parts In-Stock

1+ parts

$135.857

100+ parts

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1,505

$135.857

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Corphita

USA . 3,886 parts In-Stock

1+ parts

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3,886

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Microchip USA

USA . 1,573 parts In-Stock

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1,573

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Parana Technologies

USA . 920 parts In-Stock

1+ parts

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$86.383

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920

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$86.383

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Overview

Elevate your embedded system designs with the SPC560P60L3BEABY microcontroller from STMicroelectronics. Renowned for their exceptional quality and reliability, STMicroelectronics brings you a cutting-edge solution for your next project. Perfect for a wide range of applications, this microcontroller offers customers unparalleled value with its advanced features and performance. Say goodbye to limitations and hello to endless possibilities with the SPC560P60L3BEABY microcontroller. Upgrade your projects today and experience the benefits firsthand!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, making this microcontroller a convenient choice for manufacturers.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for versatility in power supply options, making this microcontroller suitable for a variety of applications.

Address Bus Width: 32

The 32-bit address bus width allows for efficient memory addressing and data transfer, enhancing the performance of this microcontroller.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, making this microcontroller ideal for applications where size is a constraint.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex calculations and processes with high precision and speed, making it suitable for advanced applications.

No. of Terminals: 100

The large number of terminals allows for versatile connectivity options, enabling the microcontroller to interface with various external devices and peripherals.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage ensures efficient power consumption and operation, making this microcontroller energy-efficient and suitable for battery-powered applications.

ADC Channels: YES

The presence of analog-to-digital converter (ADC) channels enables the microcontroller to accurately measure and process analog signals, expanding its capabilities for sensor interfacing and data acquisition.

DMA Channels: YES

Direct Memory Access (DMA) channels allow for efficient data transfer without CPU intervention, enhancing the microcontroller's performance in data-intensive tasks and real-time processing.

Terminal Position: QUAD

The quad terminal position provides a secure and stable connection, reducing the risk of signal interference and ensuring reliable operation in demanding environments.

Width: 14 mm

The compact width of 14mm makes this microcontroller suitable for space-constrained applications or designs where a small footprint is required.

External Data Bus Width: 32

With a 32-bit external data bus width, this microcontroller can efficiently communicate with external memory and peripherals, facilitating high-speed data transfer and processing.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency of 40 MHz enables fast and responsive operation, making this microcontroller suitable for applications that require real-time processing and high-speed computation.

Length: 14 mm

The compact length of 14mm complements the square package shape, further enhancing the space-saving design and versatility of this microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

Based on Reduced Instruction Set Computing (RISC) architecture, this microcontroller delivers high performance and efficiency in executing instructions, making it a reliable choice for demanding applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, enhancing the reliability and efficiency of this microcontroller in various operating conditions.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and secure solder joints, ensuring robust connectivity and reliable operation even in harsh environments.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage offers a standard power requirement, compatible with many power sources and making this microcontroller easy to integrate into existing systems.

PWM Channels: YES

Pulse Width Modulation (PWM) channels allow for precise control of analog signals, enabling the microcontroller to generate accurate output signals for applications such as motor control and power management.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this microcontroller provides fine-pitch connections for compact and densely populated PCB layouts, optimizing space utilization and facilitating high-density designs.

Speed: 64 rpm

The 64 rpm speed rating indicates the operational speed of the microcontroller, ensuring efficient performance in processing tasks and data handling, making it suitable for a wide range of applications.

No. of I/O Lines: 65

The 65 I/O lines offer versatile input/output options for connecting to external devices and peripherals, enabling the microcontroller to interface with a wide range of components and expand its functionality.

Technical Specifications

Microcontrollers SPC560P60L3BEABY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

14 mm

No. of I/O Lines:

65

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC560P60L3BEABY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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