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SPC560P54L5CEFAY

STMicroelectronics

SPC560P54L5CEFAY by STMicroelectronics

SPC560P54L5CEFAY microcontroller by STMicroelectronics features a 32-bit address and external data bus width, with a max clock frequency of 40 MHz. It has 106 I/O lines, ADC and DMA channels, suitable for applications requiring high-speed processing such as automotive control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,448 parts In-Stock

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Anansix

USA . 803 parts In-Stock

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803

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Digiode

USA . 283 parts In-Stock

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283

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Distributors (Availability)

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AZTECH Wire

Italy . 964 parts In-Stock

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$15.890

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964

$15.890

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IDEA Electronic Components Group

UK . 2,354 parts In-Stock

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$46.646

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$41.981

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$46.646

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$41.981

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MKK Technologies

India . 2,361 parts In-Stock

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$87.714

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$87.714

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DigiPath Technology Company

USA . 2,361 parts In-Stock

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$87.714

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$87.714

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Component Stockers USA

USA . 552 parts In-Stock

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$99.990

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552

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QUARKTWIN TECHNOLOGY LTD

USA . 7,771 parts In-Stock

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Vigor

Singapore . 4,957 parts In-Stock

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Microchip USA

USA . 4,354 parts In-Stock

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Corphita

USA . 1,401 parts In-Stock

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Parana Technologies

USA . 114 parts In-Stock

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$55.772

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Overview

Discover the cutting-edge SPC560P54L5CEFAY microcontroller by STMicroelectronics, a leading manufacturer known for top-quality products. Designed for a wide range of applications, this powerful device offers unparalleled value with its high performance and reliability. With features like ADC channels, PWM channels, and DMA capabilities, this microcontroller is perfect for creating innovative solutions in automotive, industrial, and consumer electronics. Experience the advantages of advanced technology and seamless integration with the SPC560P54L5CEFAY, setting new standards in efficiency and functionality for your projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, providing flexibility in power supply options.

Address Bus Width: 32

Allows for a larger memory address space, enabling more complex programs and data storage.

Package Shape: SQUARE

Square package shape allows for more efficient use of space on the circuit board.

Bit Size: 32

Utilizing a 32-bit architecture enables faster and more efficient processing of data.

No. of Terminals: 144

Provides ample connectivity options for interfacing with external components and peripherals.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a low-profile design with fine pitch terminals, making it suitable for compact applications.

Minimum Supply Voltage: 4.5 V

Can operate at a lower voltage range, allowing for power-efficient operation.

ADC Channels: YES

Integrated ADC channels enable analog input capabilities for sensor interfacing and data acquisition.

DMA Channels: YES

Supports Direct Memory Access channels for efficient data transfer without CPU intervention, improving overall system performance.

Terminal Position: QUAD

Quad terminal position provides stability and ease of soldering during assembly.

Width: 20 mm

Compact width size allows for integration into space-constrained PCB designs.

External Data Bus Width: 32

A wide external data bus width of 32 bits enables fast data transfer between the microcontroller and external devices.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency of 40 MHz allows for rapid execution of instructions, enhancing overall system performance.

Length: 20 mm

Compact length size facilitates easy integration into small form factor designs.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses RISC architecture which is known for its efficiency and simplicity, offering faster and more streamlined operation.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, ideal for battery-powered devices and noise-sensitive applications.

Terminal Form: GULL WING

Gull wing terminal form allows for easy handling and mounting during assembly.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage of 5V ensures reliable and consistent operation.

PWM Channels: YES

Integrated PWM channels enable precise control of analog signals, ideal for motor control and power management.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and compact layout design.

Speed: 64 rpm

The specified speed could refer to the maximum operating speed of the microcontroller, indicating its processing capabilities.

No. of I/O Lines: 106

With 106 I/O lines, this microcontroller offers extensive input and output capabilities for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers SPC560P54L5CEFAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

20 mm

No. of I/O Lines:

106

No. of Terminals:

144

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Trade Compliance

SPC560P54L5CEFAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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