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SPC560P54L3BEABR

STMicroelectronics

SPC560P54L3BEABR by STMicroelectronics

STMicroelectronics SPC560P54L3BEABR is a 32-bit microcontroller with 100 terminals, 40 MHz clock frequency, and ADC/DMA channels. Ideal for automotive applications due to its low profile flatpack package style and RISC technology.

Median Price

$10.930

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,000 parts In-Stock

1+ parts

$10.930

100+ parts

$7.000

1k+ parts

$5.140

10k+ parts

-

1,000

$10.930

$7.000

$5.140

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$6.484

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$6.484

-

-

-

Digiode

USA . 425 parts In-Stock

1+ parts

$8.873

100+ parts

-

1k+ parts

-

10k+ parts

-

425

$8.873

-

-

-

Vyrian

USA . 3,436 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,436

-

-

-

-

Anansix

USA . 887 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

887

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 7,741 parts In-Stock

1+ parts

$5.690

100+ parts

-

1k+ parts

-

10k+ parts

-

7,741

$5.690

-

-

-

Continental Prestige Electronics

USA . 2,353 parts In-Stock

1+ parts

$6.484

100+ parts

-

1k+ parts

-

10k+ parts

$6.355

2,353

$6.484

-

-

$6.355

Netroflash

USA . 50 parts In-Stock

1+ parts

$6.484

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$6.484

-

-

-

Corohmni

South Africa . 58 parts In-Stock

1+ parts

$6.750

100+ parts

-

1k+ parts

-

10k+ parts

-

58

$6.750

-

-

-

Corphita

USA . 3,820 parts In-Stock

1+ parts

$8.406

100+ parts

-

1k+ parts

-

10k+ parts

-

3,820

$8.406

-

-

-

Semicontronic

India . 893 parts In-Stock

1+ parts

$9.290

100+ parts

$9.058

1k+ parts

$9.011

10k+ parts

-

893

$9.290

$9.058

$9.011

-

Ampacity Inc.

Singapore . 630 parts In-Stock

1+ parts

$9.290

100+ parts

-

1k+ parts

-

10k+ parts

-

630

$9.290

-

-

-

IDEA Electronic Components Group

UK . 2,053 parts In-Stock

1+ parts

$15.532

100+ parts

-

1k+ parts

$13.979

10k+ parts

-

2,053

$15.532

-

$13.979

-

Microchip USA

USA . 3,063 parts In-Stock

1+ parts

$18.157

100+ parts

-

1k+ parts

-

10k+ parts

-

3,063

$18.157

-

-

-

Aztec Data Supply Inc.

USA . 1,289 parts In-Stock

1+ parts

$20.680

100+ parts

-

1k+ parts

-

10k+ parts

-

1,289

$20.680

-

-

-

MKK Technologies

India . 1,954 parts In-Stock

1+ parts

$29.208

100+ parts

-

1k+ parts

-

10k+ parts

-

1,954

$29.208

-

-

-

DigiPath Technology Company

USA . 1,954 parts In-Stock

1+ parts

$29.208

100+ parts

-

1k+ parts

-

10k+ parts

-

1,954

$29.208

-

-

-

Argo Parts USA

USA . 4,573 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,573

-

-

-

-

Parana Technologies

USA . 1,197 parts In-Stock

1+ parts

-

100+ parts

$18.571

1k+ parts

-

10k+ parts

-

1,197

-

$18.571

-

-

Overview

Unleash the power of innovation with the SPC560P54L3BEABR by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics ensures top-quality microcontrollers that deliver outstanding performance and reliability. Ideal for a wide range of applications, this product offers customers unparalleled value, benefits, and advantages. Experience seamless operation, efficient data processing, and enhanced functionality with the SPC560P54L3BEABR. Elevate your projects to new heights with this cutting-edge microcontroller.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Support for a high supply voltage allows for flexibility in powering the device and compatibility with a wide range of power sources.

Address Bus Width: 32

A wide address bus width of 32 bits enables efficient memory addressing and data retrieval, improving overall system performance.

Package Shape: SQUARE

The square package shape offers a compact design that is easy to handle and fits well within a tight layout.

Bit Size: 32

A 32-bit architecture enables processing of large data sets and complex algorithms, making it suitable for advanced computing tasks.

No. of Terminals: 100

With a high number of terminals, this microcontroller can support multiple inputs and outputs, expanding the range of peripherals that can be connected.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch package style allows for a slim and compact design that is easy to mount on a PCB and beneficial for space-constrained applications.

Minimum Supply Voltage: 1.8 V

Support for a low supply voltage enhances energy efficiency and extends battery life, ideal for portable devices or power-sensitive applications.

ADC Channels: YES

Integrated ADC channels enable precise analog-to-digital conversion, facilitating sensor interfacing and data acquisition tasks.

DMA Channels: YES

DMA channels provide efficient data transfer between peripherals and memory, reducing CPU overhead and improving overall system performance.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and routing, enhancing design flexibility and facilitating assembly.

Width: 14 mm

A compact width dimension of 14 mm ensures a small footprint, ideal for space-constrained applications with limited board real estate.

External Data Bus Width: 32

A wide external data bus width of 32 bits supports fast data transfer rates and efficient communication with external devices, improving overall system performance.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency of 40 MHz allows for fast processing speed and efficient execution of instructions, suitable for demanding real-time applications.

Length: 14 mm

A short length dimension of 14 mm complements the compact width, offering a small form factor that is easy to integrate into tight spaces or small enclosures.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture is known for its efficient instruction set and streamlined processing, enabling high-performance and power-efficient operation.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and high integration density, making it well-suited for energy-efficient and compact electronic devices.

Terminal Form: GULL WING

Gull wing terminal form offers robust mechanical strength and reliability, ensuring secure connections and consistent performance in demanding operating environments.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage of 3 V ensures consistent operation and reliable performance, supporting the proper functioning of the microcontroller in various operating conditions.

PWM Channels: YES

Support for PWM channels enables precise control of analog components and devices, allowing for efficient pulse-width modulation and accurate signal generation.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density packaging and compact PCB design, facilitating miniaturization of electronic products and enhancing overall system integration.

Speed: 64 rpm

High speed of 64 rpm ensures rapid data processing and execution of tasks, making the microcontroller suitable for applications requiring quick response times and real-time operation.

No. of I/O Lines: 65

A high number of I/O lines provide ample connectivity options for interfacing with external devices, sensors, and peripherals, enhancing the versatility and functionality of the microcontroller.

Technical Specifications

Microcontrollers SPC560P54L3BEABR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

40 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

14 mm

No. of I/O Lines:

65

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC560P54L3BEABR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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