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SPC560P50L5CEFAY

STMicroelectronics

SPC560P50L5CEFAY by STMicroelectronics

SPC560P50L5CEFAY by STMicroelectronics is a 32-bit automotive microcontroller with a max supply voltage of 3.465V and operates b/w -40 °C to 125 °C. It features 144 terminals, supports CAN/LIN/SPI connectivity, and includes ADC/DMA capabilities for efficient data processing in automotive applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,862 parts In-Stock

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Digiode

USA . 1,083 parts In-Stock

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1,083

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Anansix

USA . 441 parts In-Stock

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441

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ComSIT Distribution GmbH

Germany . 407 parts In-Stock

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407

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ComSIT USA

USA . 407 parts In-Stock

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407

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Chip Stock

USA . 193 parts In-Stock

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Vigor

Singapore . 7,870 parts In-Stock

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$7.120

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7,870

$7.120

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AZTECH Wire

Italy . 970 parts In-Stock

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$18.880

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970

$18.880

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IDEA Electronic Components Group

UK . 364 parts In-Stock

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$73.379

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$66.041

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364

$73.379

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$66.041

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Component Stockers USA

USA . 547 parts In-Stock

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$103.200

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547

$103.200

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MKK Technologies

India . 144 parts In-Stock

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$137.985

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144

$137.985

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DigiPath Technology Company

USA . 144 parts In-Stock

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$137.985

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144

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RC Electronics

USA . 9,478 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 3,489 parts In-Stock

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Parana Technologies

USA . 2,338 parts In-Stock

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$87.736

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2,338

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Microchip USA

USA . 1,309 parts In-Stock

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Perfect Parts

USA . 67 parts In-Stock

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Overview

Elevate your automotive designs with the SPC560P50L5CEFAY microcontroller from STMicroelectronics, a leader in innovation and quality. Engineered for reliability under extreme conditions, this versatile chip empowers applications in advanced driver assistance and electric vehicles. With integrated peripherals and robust connectivity options, it streamlines development while enhancing performance. Choose STMicroelectronics for unparalleled support and cutting-edge technology that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body enhances durability and resistance to environmental factors, making this microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology provides a compact design, allowing for efficient space utilization on PCBs, which is essential for modern electronic devices.

Maximum Supply Voltage: 3.465 V

Supports a maximum supply voltage of 3.465 V, offering flexibility and compatibility with a variety of power sources.

Address Bus Width: 32

A 32-bit address bus width ensures a larger addressable memory space, enabling more complex applications and higher performance.

Package Shape: SQUARE

The square package shape optimizes layout and thermal management on the PCB, contributing to better performance.

Bit Size: 32

A 32-bit architecture allows for processing of large data types and enhances computational capabilities, making it suitable for intensive applications.

No. of Terminals: 144

With 144 terminals, this microcontroller offers a high level of connectivity and integration with other components in complex designs.

Package Style (Meter): FLATPACK

Flatpack style ensures efficient space-saving design while providing effective heat dissipation during operation.

Minimum Supply Voltage: 2.97 V

The ability to operate at a minimum supply voltage of 2.97 V broadens usability in battery-powered and low-voltage applications.

Maximum Operating Temperature: 125 °C

An operating temperature up to 125 °C makes this microcontroller suitable for automotive and industrial applications where high temperatures are prevalent.

CPU Family: SPC56

Part of the SPC56 family, this microcontroller is optimized for automotive applications, ensuring reliability and performance.

No. of External Interrupts: 32

32 external interrupts allow for responsive real-time applications, enabling quick reactions to events in dynamic environments.

Minimum Operating Temperature: -40 °C

Operating safely down to -40 °C, this component is ideal for harsh environmental conditions, like in automotive or outdoor applications.

ADC Channels: YES

Integration of ADC channels enables the microcontroller to process analog signals effectively, enhancing its versatility in various applications.

DMA Channels: YES

With DMA capability, this microcontroller can transfer data without CPU intervention, improving efficiency in multitasking scenarios.

Terminal Position: QUAD

Quad terminal position allows for easier connections and better layout flexibility on circuit boards.

ROM Words: 524288

A substantial ROM size provides ample storage for firmware, supporting complex applications and functionalities.

Width: 22 mm

A compact width ensures that this microcontroller can be easily integrated into space-constrained designs.

Data EEPROM Size: 64K

Having 64K of EEPROM allows for data retention even when the power is off, making it suitable for applications requiring non-volatile memory.

Boundary Scan: YES

Boundary scan capabilities facilitate testing and debugging of integrated circuits, enhancing reliability during development.

External Data Bus Width: 32

The 32-bit external data bus width allows for high-speed data transfers, improving performance in data-intensive applications.

Peripherals: DMA(16), PWM(8), TEMPERATURE SENSOR, TIMER(14), WDT

Diverse peripherals enhance the microcontroller’s utility in various applications, from motor control to sensor management.

Maximum Clock Frequency: 16 MHz

Executing instructions at up to 16 MHz ensures that this microcontroller can handle demanding tasks efficiently.

Length: 22 mm

The compact length ensures effective integration into tight spaces while still offering a range of functionality.

Temperature Grade: AUTOMOTIVE

Classified as automotive grade, this microcontroller is designed to meet the stringent requirements of automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture allows for efficient and high-speed processing, making this microcontroller ideal for performance-sensitive tasks.

RAM Bytes: 40960

With 40960 bytes of RAM, it supports more complex algorithms and data processing tasks, making it suitable for advanced applications.

Technology: CMOS

CMOS technology offers lower power consumption and higher integration density, making it preferable for battery-powered devices.

Terminal Form: GULL WING

Gull wing leads provide ease of soldering and better mechanical strength, enhancing product reliability during assembly.

Analog To Digital Converters: 13-Ch 10-Bit (2)

Equipped with dual 10-bit, 13-channel ADCs, it can process multiple analog signals, enhancing its versatility in various applications.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V ensures compatibility with a wide range of electronic systems and components.

No. of DMA Channels: 16

Having 16 DMA channels increases the efficiency of data transfers, allowing the CPU to focus on other tasks simultaneously.

PWM Channels: YES

The inclusion of PWM channels allows for effective control of motors and other variable devices, making it versatile for automation.

Connectivity: CAN, LIN(2), SPI(4)

A range of connectivity options such as CAN, LIN, and SPI makes this microcontroller capable of communicating effectively with various systems.

ROM Programmability: FLASH

FLASH memory programmability provides flexibility for firmware updates, enhancing longevity and adaptability in deployed applications.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high-density designs, making better use of PCB real estate.

Format: FIXED POINT

Fixed point format processing supports efficient calculation in control applications, improving performance in real-time processing tasks.

Speed: 64 rpm

With a rotational speed of 64 rpm, it can handle high-speed applications effectively, providing responsiveness in control tasks.

On Chip Program ROM Width: 8

An 8-bit program ROM width supports a variety of instruction sets suitable for multiple applications.

No. of I/O Lines: 108

The presence of 108 I/O lines allows for connection to numerous devices and sensors, enhancing the microcontroller's capabilities in complex systems.

Technical Specifications

Microcontrollers SPC560P50L5CEFAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

CPU Family:

SPC56

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

Length:

22 mm

Low Power Mode:

NO

No. of DMA Channels:

16

No. of External Interrupts:

32

No. of I/O Lines:

108

No. of Serial I/Os:

0

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144(UNSPEC)

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

RAM Bytes:

40960

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

64 rpm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

22 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN, LIN(2), SPI(4)

Peripherals:

DMA(16), PWM(8), TEMPERATURE SENSOR, TIMER(14), WDT

Analog To Digital Convertors:

13-Ch 10-Bit (2)

Trade Compliance

SPC560P50L5CEFAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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