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SPC560P50L5BEFBY

STMicroelectronics

SPC560P50L5BEFBY by STMicroelectronics

STMicroelectronics SPC560P50L5BEFBY is a 32-bit microcontroller with 144 terminals, operating at -40 to 105 °C. It features 524288 ROM words, 40960 RAM bytes, and supports ADC and DMA channels. Ideal for industrial applications requiring a max clock frequency of 16 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,198 parts In-Stock

1+ parts

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6,198

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Digiode

USA . 4,246 parts In-Stock

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4,246

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Anansix

USA . 2,168 parts In-Stock

1+ parts

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2,168

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 2,687 parts In-Stock

1+ parts

$10.812

100+ parts

-

1k+ parts

-

10k+ parts

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2,687

$10.812

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AZTECH Wire

Italy . 250 parts In-Stock

1+ parts

$15.700

100+ parts

-

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-

10k+ parts

-

250

$15.700

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IDEA Electronic Components Group

UK . 1,863 parts In-Stock

1+ parts

$45.142

100+ parts

-

1k+ parts

$40.627

10k+ parts

-

1,863

$45.142

-

$40.627

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MKK Technologies

India . 304 parts In-Stock

1+ parts

$84.886

100+ parts

-

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304

$84.886

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DigiPath Technology Company

USA . 304 parts In-Stock

1+ parts

$84.886

100+ parts

-

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10k+ parts

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304

$84.886

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Component Stockers USA

USA . 793 parts In-Stock

1+ parts

$99.990

100+ parts

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793

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 15,665 parts In-Stock

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15,665

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Vigor

Singapore . 8,000 parts In-Stock

1+ parts

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8,000

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Corphita

USA . 4,163 parts In-Stock

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4,163

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Parana Technologies

USA . 607 parts In-Stock

1+ parts

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100+ parts

$53.974

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607

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$53.974

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Overview

The SPC560P50L5BEFBY by STMicroelectronics is a top-of-the-line microcontroller designed to deliver unmatched performance and reliability. With a focus on quality and innovation, STMicroelectronics ensures that their products meet the highest industry standards. This powerful microcontroller is perfect for a wide range of applications, offering customers seamless integration and exceptional value. Whether you're working on automotive, industrial, or consumer electronics projects, the SPC560P50L5BEFBY provides the speed, precision, and efficiency you need to bring your ideas to life. Trust STMicroelectronics for cutting-edge technology that will take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Allows for a lightweight and durable package, making it suitable for various applications.

Surface Mount: YES

Enables easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.465 V

Provides a wide range of operating voltage, allowing flexibility in power supply options.

Address Bus Width: 32

Allows for efficient memory addressing and data transfer within the system.

Package Shape: SQUARE

Optimizes space utilization on the circuit board and facilitates uniform heat dissipation.

Bit Size: 32

Offers high processing capability and data handling capacity for complex applications.

Power Supplies (V): 3.3

Provides a stable power source for the microcontroller, ensuring reliable performance.

No. of Terminals: 144

Allows for multiple connections and interfaces, expanding the connectivity options for peripherals.

Package Style (Meter): FLATPACK

Facilitates easy installation and maintenance of the microcontroller in electronic systems.

Minimum Supply Voltage: 2.97 V

Ensures operational reliability even under low voltage conditions, enhancing system robustness.

Maximum Operating Temperature: 105 °C

Supports operation in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Maintains functionality in extreme cold conditions, increasing the product's versatility.

Terminal Finish: MATTE TIN

Provides corrosion resistance and good solderability, ensuring long-term reliability in various operating environments.

ADC Channels: YES

Enables analog-to-digital conversion, allowing the microcontroller to interface with analog sensors and devices.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer, reducing the burden on the CPU and improving overall system performance.

Terminal Position: QUAD

Facilitates easy connections and ensures secure mounting on the circuit board.

ROM Words: 524288

Offers ample memory for program storage and data manipulation, supporting complex algorithms and applications.

Width: 22 mm

Compact size allows for integration into space-constrained designs without compromising functionality.

External Data Bus Width: 32

Enables efficient data transfer between the microcontroller and external devices, enhancing system performance.

Maximum Clock Frequency: 16 MHz

Provides high-speed processing capabilities for quick execution of instructions and real-time data processing.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures reliable soldering during assembly, reducing the likelihood of solder joint failure.

Peak Reflow Temperature °C: 260

Supports high-temperature soldering processes, ensuring proper bonding and long-term reliability.

Length: 22 mm

Compact form factor facilitates space-saving installation in electronic systems.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature and humidity conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Features a Reduced Instruction Set Computing architecture for efficient processing and optimized performance.

RAM Bytes: 40960

Provides sufficient high-speed memory for data storage and manipulation, supporting multitasking and complex computations.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Enables easy soldering and secure connection to the circuit board, ensuring reliability in operation.

Maximum Supply Current: 89 mA

Efficient power consumption minimizes energy usage and reduces heat generation for improved reliability.

Nominal Supply Voltage: 3.3 V

Standard voltage supply for compatibility with common power sources and peripherals.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of analog outputs, enhancing system flexibility.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the ROM, enabling firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine pitch design enables high-density mounting on the circuit board, reducing footprint and enhancing scalability.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate moisture exposure during handling and assembly processes.

Speed: 64 rpm

Supports high-speed operation for quick response and efficient performance in real-time applications.

No. of I/O Lines: 108

Multiple input/output lines provide versatile connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers SPC560P50L5BEFBY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

22 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

108

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

40960

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

89 mA

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

22 mm

Peripheral IC Type:

Trade Compliance

SPC560P50L5BEFBY Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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