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SPC560P50L5BEFAR

STMicroelectronics

SPC560P50L5BEFAR by STMicroelectronics

STMicroelectronics SPC560P50L5BEFAR microcontroller features 32-bit address and external data bus width, with 144 terminals. Operating at a max clock frequency of 16 MHz, it offers ADC and DMA channels for versatile applications in automotive systems requiring high-speed processing and control capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,950 parts In-Stock

1+ parts

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8,950

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Digiode

USA . 4,858 parts In-Stock

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4,858

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Anansix

USA . 1,894 parts In-Stock

1+ parts

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1,894

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,135 parts In-Stock

1+ parts

$6.180

100+ parts

-

1k+ parts

-

10k+ parts

-

1,135

$6.180

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AZTECH Wire

Italy . 925 parts In-Stock

1+ parts

$9.500

100+ parts

-

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-

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-

925

$9.500

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Microchip USA

USA . 1,949 parts In-Stock

1+ parts

$21.163

100+ parts

-

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1,949

$21.163

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Advanced Electronics

New Zealand . 84 parts In-Stock

1+ parts

$21.601

100+ parts

$21.385

1k+ parts

$20.521

10k+ parts

-

84

$21.601

$21.385

$20.521

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IDEA Electronic Components Group

UK . 1,478 parts In-Stock

1+ parts

$56.887

100+ parts

-

1k+ parts

$51.199

10k+ parts

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1,478

$56.887

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$51.199

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MKK Technologies

India . 1,885 parts In-Stock

1+ parts

$106.973

100+ parts

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1,885

$106.973

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DigiPath Technology Company

USA . 1,885 parts In-Stock

1+ parts

$106.973

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1,885

$106.973

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Component Stockers USA

USA . 659 parts In-Stock

1+ parts

$107.320

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659

$107.320

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Corphita

USA . 1,422 parts In-Stock

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1,422

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Parana Technologies

USA . 670 parts In-Stock

1+ parts

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100+ parts

$68.017

1k+ parts

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670

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$68.017

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Overview

Unlock the potential of your electronic designs with the SPC560P50L5BEFAR by STMicroelectronics. This high-quality microcontroller offers unmatched performance and reliability, thanks to its advanced technology and precision manufacturing. Perfect for a wide range of applications, this versatile device features ADC and DMA channels, PWM capabilities, and a generous number of I/O lines. With a maximum clock frequency of 16 MHz and a nominal supply voltage of 3.3 V, the SPC560P50L5BEFAR delivers exceptional value and benefits to customers seeking cutting-edge solutions for their projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes the product easier to assemble onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 3.465 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating a wide range of applications.

Address Bus Width: 32

A wide address bus width of 32 allows for larger memory addressability, enabling the microcontroller to handle complex tasks and data efficiently.

Package Shape: SQUARE

The square package shape provides a compact footprint and efficient use of space on the circuit board.

Bit Size: 32

With a 32-bit architecture, the microcontroller can process data in larger chunks, resulting in faster and more efficient operations.

No. of Terminals: 144

The high number of terminals allows for a wide range of connectivity options, enabling the microcontroller to interface with various external components and peripherals.

Package Style (Meter): FLATPACK

The flatpack package style offers ease of handling and installation, making the microcontroller suitable for automated assembly processes.

Minimum Supply Voltage: 2.97 V

The low minimum supply voltage ensures reliable operation even under low power conditions, enhancing the product's versatility.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals to digital data, making it suitable for applications that require analog signal processing.

DMA Channels: YES

Direct Memory Access (DMA) channels allow for efficient data transfer between peripherals and memory without CPU intervention, enhancing overall system performance.

Terminal Position: QUAD

The quad terminal position offers better stability and connection reliability, reducing the risk of signal interference or disconnection.

Width: 22 mm

The compact width of 22mm makes the microcontroller suitable for space-constrained applications where size is a critical factor.

External Data Bus Width: 32

A wide external data bus width of 32 facilitates faster data transfer rates and smoother communication between the microcontroller and external devices.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency of 16 MHz allows for speedy operation and quick response times, making the microcontroller suitable for real-time applications.

Length: 22 mm

The short length of 22mm complements the compact width, contributing to a small form factor that is ideal for applications with limited space.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers simplified instruction set architecture, enhancing processing speed and efficiency.

Technology: CMOS

CMOS technology ensures low power consumption, high noise immunity, and reliable operation, making the microcontroller suitable for battery-operated devices and power-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and easy soldering, ensuring secure connections and reliable performance.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is a common standard in many electronic devices, ensuring compatibility with a wide range of power sources.

PWM Channels: YES

The availability of Pulse-Width Modulation (PWM) channels allows for precise control over analog output signals, making the microcontroller suitable for applications that require accurate signal modulation.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm supports high-density mounting, allowing for more terminals in a limited space and enabling compact circuit board designs.

Speed: 64 rpm

The speed of 64 rpm indicates the operational speed of the microcontroller, which is suitable for applications with moderate processing requirements.

No. of I/O Lines: 108

With a high number of Input/Output lines, the microcontroller can interface with a variety of external devices, sensors, and peripherals, enabling versatile connectivity options.

Technical Specifications

Microcontrollers SPC560P50L5BEFAR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

22 mm

No. of I/O Lines:

108

No. of Terminals:

144

PWM Channels:

YES

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

22 mm

Peripheral IC Type:

Trade Compliance

SPC560P50L5BEFAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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