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SPC560P50L3BEFAR

STMicroelectronics

SPC560P50L3BEFAR by STMicroelectronics

SPC560P50L3BEFAR by STMicroelectronics is a 32-bit microcontroller with 32-bit external data bus width, 16 MHz max clock frequency, and 67 I/O lines. It is used in applications requiring high-speed processing and control, such as automotive engine management systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,697 parts In-Stock

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6,697

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Anansix

USA . 2,731 parts In-Stock

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2,731

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Digiode

USA . 216 parts In-Stock

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216

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,270 parts In-Stock

1+ parts

$4.810

100+ parts

-

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2,270

$4.810

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AZTECH Wire

Italy . 51 parts In-Stock

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$12.750

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51

$12.750

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Microchip USA

USA . 2,103 parts In-Stock

1+ parts

$15.385

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2,103

$15.385

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IDEA Electronic Components Group

UK . 267 parts In-Stock

1+ parts

$48.584

100+ parts

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$43.726

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267

$48.584

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$43.726

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MKK Technologies

India . 2,168 parts In-Stock

1+ parts

$91.360

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2,168

$91.360

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DigiPath Technology Company

USA . 2,168 parts In-Stock

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$91.360

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2,168

$91.360

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Parana Technologies

USA . 1,760 parts In-Stock

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$58.090

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1,760

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$58.090

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Corphita

USA . 714 parts In-Stock

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714

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Overview

Unlock the potential of your next project with the high-quality SPC560P50L3BEFAR microcontroller by STMicroelectronics. Designed for a wide range of applications, this versatile device offers unmatched performance and reliability. With innovative features such as ADC channels, DMA channels, and PWM channels, this microcontroller is perfect for tasks that require precision and efficiency. Experience the benefits of cutting-edge technology and seamless integration in a compact package. Upgrade your design with the SPC560P50L3BEFAR and take your project to the next level.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making it suitable for applications with limited space.

Maximum Supply Voltage: 3.465 V

Support for a higher supply voltage allows for a wider range of power sources to be used, increasing flexibility in design.

Address Bus Width: 32

A wider address bus allows for access to a larger memory range, enabling more complex data processing tasks.

Package Shape: SQUARE

Square packages are easier to handle and align during assembly, ensuring proper connections and reliability.

Bit Size: 32

A 32-bit architecture provides enhanced processing power and capability, suitable for demanding applications.

No. of Terminals: 100

Having a high number of terminals allows for connection to a wide range of external devices and peripherals, enhancing versatility.

Package Style (Meter): FLATPACK

Flatpack packages are known for their low profile and compact size, making them ideal for space-constrained designs.

Minimum Supply Voltage: 2.97 V

Support for a lower minimum supply voltage ensures compatibility with a variety of power sources, enhancing flexibility in applications.

ADC Channels: YES

Integrated ADC channels allow for analog signal conversion, enabling the microcontroller to interface with sensors and other analog devices.

DMA Channels: YES

DMA channels help offload data transfer tasks from the CPU, improving system efficiency and performance.

Terminal Position: QUAD

Quad terminal positions provide secure connections and alignment during assembly, ensuring reliability in operation.

Width: 14 mm

A compact width makes the microcontroller suitable for small form-factor designs, saving space in applications.

External Data Bus Width: 32

A 32-bit external data bus allows for high-speed data transfer between the microcontroller and external devices, improving overall system performance.

Maximum Clock Frequency: 16 MHz

A high maximum clock frequency enables fast processing speeds, suitable for real-time applications and high-performance tasks.

Length: 14 mm

A compact length makes the microcontroller suitable for small form-factor designs, saving space in applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture offers efficient and streamlined processing, allowing for high performance with low power consumption.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and are suitable for automated assembly processes, ensuring reliability in manufacturing.

Nominal Supply Voltage: 3.3 V

A standard nominal supply voltage of 3.3V ensures compatibility with common power sources, simplifying system design and integration.

PWM Channels: YES

Support for PWM channels enables precise control of output signals, suitable for applications such as motor control and LED dimming.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5mm allows for high-density mounting, suitable for applications requiring a large number of connections in a small area.

Speed: 64 rpm

A speed rating of 64 rpm indicates the performance capabilities of the microcontroller, making it suitable for applications requiring fast data processing.

No. of I/O Lines: 67

Having a high number of I/O lines allows for connection to a wide range of external devices and peripherals, enhancing flexibility in system design.

Technical Specifications

Microcontrollers SPC560P50L3BEFAR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

32

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

100

PWM Channels:

YES

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

64 rpm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC560P50L3BEFAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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