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SPC560P44L5CEFAY

STMicroelectronics

SPC560P44L5CEFAY by STMicroelectronics

SPC560P44L5CEFAY from STMicroelectronics is a 32-bit automotive microcontroller with a max supply voltage of 3.465V and operates b/w -40 °C to 125 °C. It features 144 terminals, supports CAN/LIN/SPI connectivity, and includes ADC/DMA channels for efficient data processing. Ideal for automotive applications, it ensures reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,925 parts In-Stock

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6,925

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Digiode

USA . 4,255 parts In-Stock

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4,255

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Anansix

USA . 79 parts In-Stock

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79

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Distributors (Availability)

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AZTECH Wire

Italy . 692 parts In-Stock

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$9.360

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692

$9.360

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Microchip USA

USA . 1,605 parts In-Stock

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$18.717

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1,605

$18.717

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IDEA Electronic Components Group

UK . 937 parts In-Stock

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$26.889

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$24.200

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937

$26.889

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$24.200

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$39.445

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$39.051

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$37.473

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100

$39.445

$39.051

$37.473

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MKK Technologies

India . 282 parts In-Stock

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$50.563

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282

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DigiPath Technology Company

USA . 282 parts In-Stock

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$50.563

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Vigor

Singapore . 3,241 parts In-Stock

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Parana Technologies

USA . 2,304 parts In-Stock

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$32.150

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Corphita

USA . 448 parts In-Stock

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Overview

Elevate your automotive innovations with the SPC560P44L5CEFAY microcontroller from STMicroelectronics. Renowned for its exceptional quality and reliability, this advanced chip is ideal for demanding applications, offering robust performance in harsh environments. With features like extensive connectivity, multiple ADC channels, and a wide temperature range, it delivers unparalleled benefits, ensuring your projects are efficient, scalable, and future-ready. Experience excellence with STMicroelectronics, where innovation meets performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures that the microcontroller is lightweight and suitable for various applications, reducing manufacturing costs.

Surface Mount: YES

Surface mount technology enables compact designs and higher circuit densities, making this microcontroller ideal for modern electronics.

Maximum Supply Voltage: 3.465 V

This voltage range allows for versatile applications while maintaining compatibility with various power supply systems.

Address Bus Width: 32

A 32-bit address bus provides a larger memory addressing capability, beneficial for applications requiring high processing power.

Package Shape: SQUARE

The square package shape enhances the component's fit on PCB layouts, allowing for better space utilization.

Bit Size: 32

The 32-bit architecture supports complex computations and larger data processing, making it better suited for advanced applications.

No. of Terminals: 144

A higher number of terminals provides more flexibility for peripheral connectivity and I/O options, suitable for multipurpose applications.

Package Style (Meter): FLATPACK

Flatpack design simplifies mounting on PCBs, aiding in assembly processes and improving thermal performance.

Minimum Supply Voltage: 2.97 V

This lower voltage requirement enhances power efficiency, making the microcontroller suitable for battery-operated devices.

Maximum Operating Temperature: 125 °C

Designed for high-temperature environments, this feature is essential for automotive and industrial applications.

CPU Family: SPC56

The SPC56 family provides robust performance characteristics, catering specifically to automotive and real-time applications.

No. of External Interrupts: 32

With 32 external interrupts, the microcontroller can effectively respond to multiple external events, enhancing its responsiveness.

Minimum Operating Temperature: -40 °C

Its wide temperature range allows for reliable operation in harsh environments, ideal for automotive and industrial applications.

ADC Channels: YES

The presence of ADC channels enables analog data processing, which is essential for sensor integration in various applications.

DMA Channels: YES

Direct Memory Access capability improves data throughput and efficiency, relieving the CPU from data transfer tasks.

Terminal Position: QUAD

The quad terminal position provides better routing options on PCBs, which facilitates easier designs and connections.

ROM Words: 393216

A large ROM capacity allows for extensive program storage, suitable for complex applications requiring significant firmware.

Width: 22 mm

A compact size enables easy integration into various designs, particularly in space-constrained applications.

Data EEPROM Size: 64K

A sizeable EEPROM provides ample storage for user data and settings, enhancing application flexibility.

Boundary Scan: YES

Boundary scan support simplifies testing and debugging processes, crucial for developers and manufacturers.

External Data Bus Width: 32

Supports high-speed data transfers, making it optimal for memory-intensive applications.

Peripherals: DMA(16), PWM(8), TEMPERATURE SENSOR, TIMER(14), WDT

An extensive range of peripherals enhances functionality for various applications, from motor control to temperature monitoring.

Maximum Clock Frequency: 16 MHz

A clock frequency of 16 MHz supports real-time processing for applications requiring immediate response.

Length: 22 mm

The standardized length ensures compatibility with various PCB designs, facilitating ease of use.

Temperature Grade: AUTOMOTIVE

Specific automotive grading ensures reliability and compliance in tough automotive conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture leads to efficient processing and reduced instruction set, enhancing performance.

RAM Bytes: 32768

32KB of RAM allows for effective data manipulation and storage during program execution.

Technology: CMOS

CMOS technology offers lower power consumption, which is ideal for energy-efficient applications.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and better mechanical stability during mounting.

Analog To Digital Converters: 13-Ch 10-Bit (2)

Two 10-bit ADCs enhance sensor interfacing capabilities, making it advantageous for precision measurement in varied environments.

Nominal Supply Voltage: 3.3 V

Operating at a nominal voltage ensures compatibility with common digital components and ensures energy efficiency.

No. of DMA Channels: 16

With 16 DMA channels, the microcontroller can handle multiple data paths simultaneously, improving processing efficiency.

PWM Channels: YES

PWM capability facilitates control of analog devices, making it suitable for motor speed regulation and dimming applications.

Connectivity: CAN, LIN(2), SPI(4)

Diverse connectivity options support reliable communication with other devices and networks, essential for embedded systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming of the microcontroller, providing flexibility over its lifecycle.

Terminal Pitch: 0.5 mm

A tight terminal pitch enables high-density component layouts, facilitating designs that save space on PCBs.

Format: FIXED POINT

Fixed point format allows for specific numerical processing suitable for embedded applications, enhancing performance.

Speed: 64 rpm

A controlled speed of 64 rpm indicates compatibility with slow-speed motor applications, particularly in automotive sectors.

On Chip Program ROM Width: 8

An 8-bit ROM width simplifies programming requirements and enhances execution speed, beneficial for efficient performance.

No. of I/O Lines: 108

With 108 I/O lines, the microcontroller can interface with a large number of external peripherals and devices, enhancing functionality.

Technical Specifications

Microcontrollers SPC560P44L5CEFAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

CPU Family:

SPC56

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

Length:

22 mm

Low Power Mode:

NO

No. of DMA Channels:

16

No. of External Interrupts:

32

No. of I/O Lines:

108

No. of Serial I/Os:

0

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144(UNSPEC)

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

393216

ROM Programmability:

FLASH

Speed:

64 rpm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

22 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN, LIN(2), SPI(4)

Peripherals:

DMA(16), PWM(8), TEMPERATURE SENSOR, TIMER(14), WDT

Analog To Digital Convertors:

13-Ch 10-Bit (2)

Trade Compliance

SPC560P44L5CEFAY Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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