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SPC560P44L3BEAAY

STMicroelectronics

SPC560P44L3BEAAY by STMicroelectronics

SPC560P44L3BEAAY by STMicroelectronics is a 32-bit microcontroller with 32-bit external data bus width, 393216 ROM words, and 36864 RAM bytes. It is used in industrial applications, featuring 67 I/O lines, PWM channels, and ADC/DMA support for efficient performance at up to 16 MHz clock frequency.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,928 parts In-Stock

1+ parts

-

100+ parts

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8,928

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Digiode

USA . 1,199 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,199

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Anansix

USA . 187 parts In-Stock

1+ parts

-

100+ parts

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187

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 6,002 parts In-Stock

1+ parts

$4.850

100+ parts

-

1k+ parts

-

10k+ parts

-

6,002

$4.850

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-

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AZTECH Wire

Italy . 477 parts In-Stock

1+ parts

$15.900

100+ parts

-

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-

10k+ parts

-

477

$15.900

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Microchip USA

USA . 2,171 parts In-Stock

1+ parts

$16.594

100+ parts

-

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2,171

$16.594

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IDEA Electronic Components Group

UK . 1,488 parts In-Stock

1+ parts

$28.356

100+ parts

-

1k+ parts

$25.521

10k+ parts

-

1,488

$28.356

-

$25.521

-

MKK Technologies

India . 1,680 parts In-Stock

1+ parts

$53.322

100+ parts

-

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-

10k+ parts

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1,680

$53.322

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DigiPath Technology Company

USA . 1,680 parts In-Stock

1+ parts

$53.322

100+ parts

-

1k+ parts

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1,680

$53.322

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RC Electronics

USA . 6,438 parts In-Stock

1+ parts

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6,438

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Corphita

USA . 3,103 parts In-Stock

1+ parts

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3,103

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Parana Technologies

USA . 898 parts In-Stock

1+ parts

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100+ parts

$33.904

1k+ parts

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10k+ parts

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898

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$33.904

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Overview

Unlock the potential of your electronics with the SPC560P44L3BEAAY by STMicroelectronics. Crafted with precision and expertise, this microcontroller offers unparalleled performance and reliability. From automotive to industrial applications, this versatile device excels in delivering optimal functionality and efficiency. Experience seamless integration and enhanced capabilities with this innovative product. Trust STMicroelectronics for cutting-edge solutions that elevate your projects to new heights. Elevate your designs with the SPC560P44L3BEAAY and unleash endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers as it is lightweight, cost-effective, and provides adequate protection for the delicate components inside.

Surface Mount: YES

Surface mount technology allows for smaller PCB sizes and higher component density, making the product suitable for compact designs.

Maximum Supply Voltage: 3.465 V

This relatively high maximum supply voltage allows for flexibility in the power supply design and compatibility with a wide range of applications.

Address Bus Width: 32

The 32-bit address bus width enables access to a larger memory space, allowing for more complex programs to be executed efficiently.

Package Shape: SQUARE

The square package shape makes it easier to mount and secure on a PCB, ensuring stability and reliability in the overall system.

Bit Size: 32

A 32-bit architecture provides higher computational power and allows for handling larger data sets, making the microcontroller suitable for demanding tasks.

Power Supplies (V): 5

Support for 5 power supplies ensures compatibility with a wide range of external components and peripherals, enhancing the versatility of the product.

No. of Terminals: 100

Having a large number of terminals allows for easy connectivity with external devices and sensors, making the product suitable for diverse applications.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact footprint and efficient heat dissipation, contributing to a more reliable and space-saving design.

Minimum Supply Voltage: 2.97 V

The low minimum supply voltage ensures energy efficiency and enables operation in low-power applications without compromising performance.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the microcontroller can withstand harsh environmental conditions and maintain stable performance in demanding applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for reliable operation in extreme cold conditions, making the product suitable for industrial and outdoor applications.

ADC Channels: YES

Built-in ADC channels enable the microcontroller to interface with analog sensors and signals, expanding its capabilities for a wider range of applications.

DMA Channels: YES

Support for DMA channels allows for efficient data transfer between peripherals and memory, enhancing overall system performance and responsiveness.

Terminal Position: QUAD

The quad terminal position offers a balanced distribution of connections, simplifying the PCB layout and ensuring reliable electrical connections.

ROM Words: 393216

With a large ROM capacity, the microcontroller can store a significant amount of program code, allowing for complex algorithms and extensive functionality.

Width: 14 mm

The compact width makes the microcontroller suitable for space-constrained designs, ensuring versatility and flexibility in various application scenarios.

External Data Bus Width: 32

A wide external data bus width facilitates fast data transfer between the microcontroller and external memory devices, optimizing overall system performance.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency allows for fast execution of instructions, enhancing real-time performance and responsiveness of the product.

Length: 14 mm

The compact length complements the overall small footprint of the microcontroller, enabling integration into tight spaces and reducing PCB size.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this temperature grade ensures reliable operation in demanding conditions, making the microcontroller suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture offers high processing efficiency and reduced power consumption, making the microcontroller suitable for energy-efficient and high-performance applications.

RAM Bytes: 36864

With a large RAM capacity, the microcontroller can store and manipulate data during program execution, enabling efficient multitasking and data processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring energy efficiency and reliable operation in various operating conditions.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections during PCB assembly, reducing the risk of electrical failures and ensuring long-term reliability.

Maximum Supply Current: 88 mA

The low maximum supply current consumption ensures energy efficiency and extends battery life in portable and low-power applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is a common standard in electronic systems, ensuring compatibility and ease of integration with existing circuits and components.

PWM Channels: YES

Support for PWM channels enables precise control of connected devices such as motors and LEDs, offering flexibility and customization in various applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and convenient updating of firmware and software, ensuring scalability and adaptability of the product over time.

Terminal Pitch: 0.5 mm

The fine 0.5 mm terminal pitch allows for high-density mounting on the PCB, enabling compact and space-efficient designs that maximize functionality in limited spaces.

Speed: 64 rpm

The high speed of 64 rpm enables rapid data processing and execution of instructions, improving overall system performance and responsiveness.

No. of I/O Lines: 67

Having a high number of I/O lines provides ample connectivity options for interfacing with external devices and peripherals, enhancing the versatility and functionality of the product.

Technical Specifications

Microcontrollers SPC560P44L3BEAAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

67

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

36864

ROM Words:

393216

ROM Programmability:

FLASH

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

88 mA

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SPC560P44L3BEAAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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