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SPC560P40L3BEABR

STMicroelectronics

SPC560P40L3BEABR by STMicroelectronics

STMicroelectronics SPC560P40L3BEABR is a 32-bit microcontroller with 262144 ROM words and 20480 RAM bytes. It operates at a max clock frequency of 40 MHz, suitable for industrial applications requiring CAN, LIN, UART connectivity. With 16 DMA channels and 6 timers, it offers efficient data handling and timekeeping capabilities in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,638 parts In-Stock

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Digiode

USA . 3,292 parts In-Stock

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3,292

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Anansix

USA . 550 parts In-Stock

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550

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,894 parts In-Stock

1+ parts

$6.883

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-

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1,894

$6.883

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AZTECH Wire

Italy . 448 parts In-Stock

1+ parts

$9.960

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-

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448

$9.960

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IDEA Electronic Components Group

UK . 25 parts In-Stock

1+ parts

$42.082

100+ parts

-

1k+ parts

$37.874

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25

$42.082

-

$37.874

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MKK Technologies

India . 732 parts In-Stock

1+ parts

$79.132

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732

$79.132

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DigiPath Technology Company

USA . 732 parts In-Stock

1+ parts

$79.132

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732

$79.132

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Component Stockers USA

USA . 206 parts In-Stock

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$99.990

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206

$99.990

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Vigor

Singapore . 5,936 parts In-Stock

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5,936

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Parana Technologies

USA . 696 parts In-Stock

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$50.315

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$50.315

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Corphita

USA . 72 parts In-Stock

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Overview

Unlock the power of innovation with the SPC560P40L3BEABR microcontroller from industry leader STMicroelectronics. Designed with precision and reliability in mind, this cutting-edge device offers unparalleled performance for a wide range of applications. Whether you're working on automotive systems, industrial automation, or consumer electronics, this microcontroller's advanced features, low power consumption, and high clock frequency will elevate your projects to new heights. Trust STMicroelectronics to deliver quality and value, and let the SPC560P40L3BEABR drive your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Being surface mount allows for easy and convenient integration onto printed circuit boards, saving space and enabling efficient assembly.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle a wide range of power inputs, offering flexibility in different operating conditions.

Address Bus Width: 32

Having a 32-bit address bus width allows for efficient memory addressing and data handling, supporting complex applications that require large memory space.

Package Shape: SQUARE

The square package shape offers easy handling and placement on PCBs, ensuring proper alignment and connection for reliable performance.

Bit Size: 32

With a 32-bit architecture, this microcontroller can process data in large chunks, enabling faster computational speeds and enhanced performance in tasks.

Power Supplies (V): 3.3

Operating at a nominal supply voltage of 3.3V, this microcontroller provides energy efficiency and compatibility with common power sources.

No. of Terminals: 100

The 100 terminals offer ample connectivity options for interfacing with external devices, enabling versatile applications and communication capabilities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style allows for compact and slim design, suitable for space-constrained applications and high-density PCB layouts.

Minimum Supply Voltage: 3 V

With a minimum supply voltage of 3V, this microcontroller can operate reliably even in low-power conditions, ensuring consistent performance in various environments.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105 °C ensures stability and reliability in harsh environmental conditions, making it suitable for industrial applications.

CPU Family: E200Z0H

The E200Z0H CPU family offers efficient processing capabilities and compatibility, enhancing the overall performance and versatility of the microcontroller.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows for reliable operation in cold environments, enhancing the versatility and applicability of this microcontroller.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, allowing the microcontroller to interface with analog sensors and signals, expanding the range of supported applications.

DMA Channels: YES

With DMA channels, data transfer can be handled efficiently in the background, reducing CPU workload and enhancing overall system performance.

Terminal Position: QUAD

The quad terminal position offers easy connectivity and compatibility with standard socket types, ensuring hassle-free integration and setup in various systems.

ROM Words: 262144

With a large ROM size of 262144 words, this microcontroller can store and execute complex programs and instructions, supporting advanced functionalities and applications.

Width: 14 mm

The compact width of 14mm allows for space-efficient placement on PCBs, enabling streamlined design and layout for compact electronic devices.

External Data Bus Width: 32

Having a 32-bit external data bus width allows for high-speed data transfer and processing, enhancing the overall performance and efficiency of the microcontroller.

Peripherals: DMA(16), PWM, TIMER(6)

The presence of multiple peripherals such as DMA, PWM, and timers offers enhanced functionality and flexibility for various applications, enabling diverse control and communication capabilities.

Maximum Clock Frequency: 40 MHz

Operating at a maximum clock frequency of 40MHz, this microcontroller can handle high-speed processing tasks efficiently, ensuring responsive performance in demanding applications.

Length: 14 mm

The compact length of 14mm allows for space-efficient placement on PCBs, enabling flexible design layouts and compact electronic device designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and stability in harsh industrial environments, making this microcontroller suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with RISC architecture, this product offers efficient processing and reduced instruction set complexity, enhancing overall performance and speed.

No. of Timers: 6

Having 6 timers provides timing and scheduling functionalities for various tasks and operations, enhancing control and precision in time-sensitive applications.

RAM Bytes: 20480

With a large RAM size of 20480 bytes, this microcontroller can efficiently store and access data during operation, supporting multitasking and complex computation requirements.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the microcontroller in various operating conditions.

Terminal Form: GULL WING

The gull-wing terminal form provides secure and reliable connections on PCBs, ensuring stable performance and connectivity for the microcontroller in diverse applications.

Maximum Supply Current: 65 mA

Operating at a maximum supply current of 65mA, this microcontroller offers efficient power consumption and heat dissipation, enhancing overall energy efficiency and durability.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3V, this microcontroller supports standard power sources and offers compatibility with common voltage levels in electronic systems.

No. of DMA Channels: 16

The presence of 16 DMA channels allows for efficient data transfer and processing, enabling high-speed communication and reduced CPU workload for enhanced performance.

PWM Channels: YES

Having PWM channels enables pulse width modulation for precise control of output signals, offering flexibility and accuracy in various control and communication applications.

Connectivity: CAN(3), CRC, LIN, UART

The connectivity options including CAN, CRC, LIN, and UART allow for versatile communication interfaces, supporting a wide range of devices and networks in various applications.

ROM Programmability: FLASH

Featuring flash ROM programmability enables easy and quick updates to firmware and software, enhancing flexibility and adaptability for changing application requirements.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this microcontroller offers precise and compact terminal connections, facilitating easy integration and assembly on PCBs with fine pitches.

Speed: 64 rpm

Operating at a speed of 64 rpm, this microcontroller offers efficient processing capabilities for various control and automation tasks, ensuring timely and accurate response in applications.

No. of I/O Lines: 64

With 64 I/O lines, this microcontroller provides ample interface options for connecting and controlling external devices, enabling versatile input/output capabilities for diverse applications.

Technical Specifications

Microcontrollers SPC560P40L3BEABR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

E200Z0H

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of DMA Channels:

16

No. of I/O Lines:

64

No. of Terminals:

100

No. of Timers:

6

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Connectivity:

CAN(3), CRC, LIN, UART,

Peripherals:

DMA(16), PWM, TIMER(6)

Trade Compliance

SPC560P40L3BEABR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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