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SPC560P40L3BEAAY

STMicroelectronics

SPC560P40L3BEAAY by STMicroelectronics

STMicroelectronics SPC560P40L3BEAAY is a 32-bit microcontroller with 262144 ROM words, 20480 RAM bytes, and 64 I/O lines. It operates at up to 40 MHz clock frequency and features DMA(16), PWM, TIMER(6) peripherals. Ideal for industrial applications requiring CAN(3), CRC, LIN, UART connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,183 parts In-Stock

1+ parts

-

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3,183

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Digiode

USA . 2,574 parts In-Stock

1+ parts

-

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2,574

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Anansix

USA . 394 parts In-Stock

1+ parts

-

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-

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394

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 7,862 parts In-Stock

1+ parts

$4.970

100+ parts

-

1k+ parts

-

10k+ parts

-

7,862

$4.970

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-

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AZTECH Wire

Italy . 814 parts In-Stock

1+ parts

$11.250

100+ parts

-

1k+ parts

-

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-

814

$11.250

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-

Microchip USA

USA . 2,671 parts In-Stock

1+ parts

$16.962

100+ parts

-

1k+ parts

-

10k+ parts

-

2,671

$16.962

-

-

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IDEA Electronic Components Group

UK . 1,813 parts In-Stock

1+ parts

$58.649

100+ parts

-

1k+ parts

$52.784

10k+ parts

-

1,813

$58.649

-

$52.784

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MKK Technologies

India . 1,740 parts In-Stock

1+ parts

$110.286

100+ parts

-

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10k+ parts

-

1,740

$110.286

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DigiPath Technology Company

USA . 1,740 parts In-Stock

1+ parts

$110.286

100+ parts

-

1k+ parts

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1,740

$110.286

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Kepictronics

USA . 8,155 parts In-Stock

1+ parts

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8,155

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A-Z Elektronik GmbH

Germany . 7,217 parts In-Stock

1+ parts

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7,217

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Corphita

USA . 1,295 parts In-Stock

1+ parts

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1,295

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Futuretech Components

Singapore . 1,049 parts In-Stock

1+ parts

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1,049

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Parana Technologies

USA . 48 parts In-Stock

1+ parts

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100+ parts

$70.124

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48

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$70.124

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Overview

Discover the cutting-edge SPC560P40L3BEAAY microcontroller by STMicroelectronics, a leader in innovative technology. Designed for a wide range of applications, this high-quality product offers unparalleled value and benefits to customers. With advanced features like ADC channels, DMA capabilities, and a maximum clock frequency of 40 MHz, this microcontroller provides optimal performance and efficiency. Whether you're working on automotive, industrial, or consumer electronics projects, the SPC560P40L3BEAAY delivers superior results and reliability. Choose STMicroelectronics for excellence in microcontrollers that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability makes it easy to integrate into compact PCB designs.

Maximum Supply Voltage: 3.6 V

Operates efficiently within a safe voltage range, ensuring reliability.

Address Bus Width: 32

High address bus width allows for large memory access capabilities, suitable for data-intensive tasks.

Package Shape: SQUARE

Square shape facilitates easy placement on the PCB and efficient use of space.

Bit Size: 32

32-bit architecture provides enhanced processing power and support for complex algorithms.

Power Supplies (V): 5

Supports a variety of power supply options, offering flexibility in system design.

No. of Terminals: 100

High number of terminals allows for versatile connectivity options and peripheral integration.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style enables easy PCB mounting and efficient use of board space.

Minimum Supply Voltage: 3 V

Wide operating voltage range accommodates different power sources and provides flexibility.

Maximum Operating Temperature: 105 °C

High operating temperature range makes it suitable for industrial environments with varying heat levels.

CPU Family: E200Z0H

Part of a reliable and well-established CPU family known for performance and stability.

Minimum Operating Temperature: -40 °C

Capable of functioning in low temperature environments, ensuring reliability in harsh conditions.

ADC Channels: YES

Built-in ADC channels provide analog input processing capabilities, expanding the range of applications.

DMA Channels: YES

DMA channels enable efficient data transfer without CPU intervention, improving overall system performance.

Terminal Position: QUAD

Quad terminal position makes installation and connection straightforward, reducing assembly complexity.

ROM Words: 262144

Large ROM capacity allows for storage of extensive program code and data, supporting advanced applications.

Width: 14 mm

Compact width size enables space-saving integration into various electronic devices.

External Data Bus Width: 32

High external data bus width supports fast data transfer speeds and efficient communication with peripherals.

Peripherals: DMA(16), PWM, TIMER(6)

Multiple peripherals such as DMA, PWM, and timers enhance functionality and enable complex system control.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for fast processing speeds, suitable for time-critical applications.

Length: 14 mm

Compact length size accommodates space-constrained designs and compact electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in harsh operating environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers efficient and streamlined processing capabilities for high-performance applications.

No. of Timers: 6

Multiple timers provide precise timing control for various functions, enhancing system versatility and performance.

RAM Bytes: 20480

Large RAM capacity allows for efficient data storage and processing, supporting multitasking and data-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable performance, ideal for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and mounting on PCBs, ensuring secure connections and ease of assembly.

Maximum Supply Current: 65 mA

Operates within a low supply current range, enabling energy-efficient operation and reducing power consumption.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation of the device.

No. of DMA Channels: 16

Multiple DMA channels provide efficient data transfer and processing capabilities, enhancing system performance.

PWM Channels: YES

PWM channels enable precise control of analog signals, facilitating tasks such as motor control and power management.

Connectivity: CAN(3), CRC, LIN, UART

Multiple connectivity options such as CAN, CRC, LIN, and UART enhance communication flexibility and compatibility with various systems.

ROM Programmability: FLASH

Flash programmability allows for easy and flexible firmware updates and customization for specific application requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on PCBs, optimizing space utilization and overall system design.

Speed: 64 rpm

High processing speed of 64 rpm enables quick data processing and system response times.

No. of I/O Lines: 64

Plenty of I/O lines provide versatility in connectivity and interface options, allowing for seamless integration with external devices and components.

Technical Specifications

Microcontrollers SPC560P40L3BEAAY attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

32

Bit Size:

32

CPU Family:

E200Z0H

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of DMA Channels:

16

No. of I/O Lines:

64

No. of Terminals:

100

No. of Timers:

6

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

20480

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

65 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Connectivity:

CAN(3), CRC, LIN, UART,

Peripherals:

DMA(16), PWM, TIMER(6)

Trade Compliance

SPC560P40L3BEAAY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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