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SPC560D40L1C4E0Y

STMicroelectronics

SPC560D40L1C4E0Y by STMicroelectronics

SPC560D40L1C4E0Y by STMicroelectronics is a 32-bit microcontroller with 262144 ROM words and 16384 RAM bytes. Ideal for automotive applications, it features 45 I/O lines, PWM channels, and DMA channels for efficient data transfer. With a max clock frequency of 16 MHz, this low-profile microcontroller operates in a temperature range from -40 to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,944 parts In-Stock

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7,944

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Digiode

USA . 1,317 parts In-Stock

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1,317

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Anansix

USA . 1,039 parts In-Stock

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1,039

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 618 parts In-Stock

1+ parts

$5.000

100+ parts

-

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618

$5.000

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Microchip USA

USA . 2,001 parts In-Stock

1+ parts

$11.932

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-

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2,001

$11.932

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Corohmni

South Africa . 22 parts In-Stock

1+ parts

$14.991

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22

$14.991

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AZTECH Wire

Italy . 507 parts In-Stock

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$18.955

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-

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507

$18.955

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Aztec Data Supply Inc.

USA . 1,590 parts In-Stock

1+ parts

$30.580

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1,590

$30.580

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Semicontronic

India . 1,587 parts In-Stock

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$34.000

100+ parts

$33.150

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$32.980

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1,587

$34.000

$33.150

$32.980

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IDEA Electronic Components Group

UK . 446 parts In-Stock

1+ parts

$73.548

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$66.193

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446

$73.548

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$66.193

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MKK Technologies

India . 569 parts In-Stock

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$138.301

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569

$138.301

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DigiPath Technology Company

USA . 569 parts In-Stock

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$138.301

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569

$138.301

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Perfect Parts

USA . 7,526 parts In-Stock

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Continental Prestige Electronics

USA . 4,591 parts In-Stock

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Corphita

USA . 2,474 parts In-Stock

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Vigor

Singapore . 1,588 parts In-Stock

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1,588

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Parana Technologies

USA . 1,162 parts In-Stock

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$87.937

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$87.937

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Advanced Electronics

New Zealand . 900 parts In-Stock

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900

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Argo Parts USA

USA . 249 parts In-Stock

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249

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Elevate your projects with the SPC560D40L1C4E0Y microcontroller by STMicroelectronics. Designed with precision and reliability, this microcontroller offers cutting-edge technology for a wide range of applications. From automotive to industrial uses, the SPC560D40L1C4E0Y provides unmatched performance and efficiency. With advanced features such as low power mode and fast clock frequency, this microcontroller delivers exceptional value and benefits to customers. Trust STMicroelectronics for top-quality microcontrollers that set new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for automotive applications.

Maximum Supply Voltage: 3.6 V

Allows for a higher voltage supply, providing flexibility in power requirements.

Bit Size: 32

32-bit architecture allows for efficient processing of data and instructions.

ADC Channels: YES

Includes Analog-to-Digital Converter channels for accurate conversion of analog signals.

RAM Bytes: 16384

Ample RAM capacity for storing variables and data during program execution.

Maximum Clock Frequency: 16 MHz

High clock frequency enables fast processing speeds for real-time applications.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature ranges, ensuring reliable performance in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances performance by simplifying instructions and reducing overhead.

Technical Specifications

Microcontrollers SPC560D40L1C4E0Y attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 5 V

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

SPC56

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

45

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

SPC560D40L1C4E0Y Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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