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SPC560D40L1C4E0X

STMicroelectronics

SPC560D40L1C4E0X by STMicroelectronics

STMicroelectronics' SPC560D40L1C4E0X is a 32-bit microcontroller with 262144 ROM words and 16384 RAM bytes. Ideal for automotive applications, it features 45 I/O lines, 16 DMA channels, and PWM support at a max clock frequency of 16 MHz.

Median Price

$3.380

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 255 parts In-Stock

1+ parts

$7.310

100+ parts

$4.400

1k+ parts

$3.030

10k+ parts

-

255

$7.310

$4.400

$3.030

-

EBV Elektronik

Germany . 220,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

220,000

-

-

-

-

Verical

USA . 85,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.380

10k+ parts

$3.304

85,000

-

-

$3.380

$3.304

Future Electronics

Canada . 48,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.750

10k+ parts

-

48,000

-

-

$2.750

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$4.046

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$4.046

-

-

-

Digiode

USA . 2,622 parts In-Stock

1+ parts

$5.567

100+ parts

-

1k+ parts

-

10k+ parts

-

2,622

$5.567

-

-

-

IBS Electronics

USA . 48,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.268

10k+ parts

-

48,000

-

-

$3.268

-

Vyrian

USA . 6,129 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,129

-

-

-

-

TME

Poland . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.730

10k+ parts

-

5,000

-

-

$3.730

-

Chip Stock

USA . 4,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,700

-

-

-

-

Anansix

USA . 2,273 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,273

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 88,258 parts In-Stock

1+ parts

$2.350

100+ parts

-

1k+ parts

-

10k+ parts

-

88,258

$2.350

-

-

-

Vigor

Singapore . 9,000 parts In-Stock

1+ parts

$3.540

100+ parts

-

1k+ parts

-

10k+ parts

-

9,000

$3.540

-

-

-

Continental Prestige Electronics

USA . 6,403 parts In-Stock

1+ parts

$4.046

100+ parts

-

1k+ parts

-

10k+ parts

$3.965

6,403

$4.046

-

-

$3.965

Argo Parts USA

USA . 4,784 parts In-Stock

1+ parts

$4.046

100+ parts

-

1k+ parts

-

10k+ parts

-

4,784

$4.046

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$4.046

100+ parts

-

1k+ parts

$3.844

10k+ parts

$3.763

2,000

$4.046

-

$3.844

$3.763

Aztec Data Supply Inc.

USA . 10 parts In-Stock

1+ parts

$4.230

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$4.230

-

-

-

Corphita

USA . 4,998 parts In-Stock

1+ parts

$5.274

100+ parts

-

1k+ parts

-

10k+ parts

-

4,998

$5.274

-

-

-

Microchip USA

USA . 3,217 parts In-Stock

1+ parts

$26.276

100+ parts

-

1k+ parts

-

10k+ parts

-

3,217

$26.276

-

-

-

IDEA Electronic Components Group

UK . 2,361 parts In-Stock

1+ parts

$39.416

100+ parts

-

1k+ parts

$35.475

10k+ parts

-

2,361

$39.416

-

$35.475

-

MKK Technologies

India . 343 parts In-Stock

1+ parts

$74.120

100+ parts

-

1k+ parts

-

10k+ parts

-

343

$74.120

-

-

-

DigiPath Technology Company

USA . 343 parts In-Stock

1+ parts

$74.120

100+ parts

-

1k+ parts

-

10k+ parts

-

343

$74.120

-

-

-

Eastek

USA . 79,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

79,000

-

-

-

-

Lixinc

USA . 16,623 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,623

-

-

-

-

RC Electronics

USA . 8,358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,358

-

-

-

-

Futuretech Components

Singapore . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

Perfect Parts

USA . 3,360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,360

-

-

-

-

A-Z Elektronik GmbH

Germany . 1,235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,235

-

-

-

-

Parana Technologies

USA . 846 parts In-Stock

1+ parts

-

100+ parts

$47.128

1k+ parts

-

10k+ parts

-

846

-

$47.128

-

-

Kepictronics

USA . 823 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

823

-

-

-

-

Overview

Unleash the power of innovation with the SPC560D40L1C4E0X by STMicroelectronics. As a leader in microcontroller technology, STMicroelectronics delivers top-quality products that exceed expectations. This microcontroller is perfect for automotive applications, providing reliable performance and cutting-edge features. With its advanced capabilities and low power mode, the SPC560D40L1C4E0X offers unmatched value and benefits to customers looking for a high-performance solution. Trust STMicroelectronics to deliver excellence in every aspect of your project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Easy installation and space-saving design for efficient PCB layout.

Maximum Supply Voltage: 3.6 V

Allows for a wide input voltage range, providing flexibility in power supply options.

Package Shape: SQUARE

Square shape allows for easy integration into different systems and compact designs.

Bit Size: 32

32-bit architecture offers enhanced processing power and performance.

No. of Terminals: 64

Sufficient number of terminals for connecting peripherals and external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact package style with low profile for space-constrained applications.

Minimum Supply Voltage: 3 V

Supports operation at low voltages, enabling energy-efficient operation.

Maximum Operating Temperature: 125 °C

High operating temperature range suitable for automotive and industrial applications.

CPU Family: SPC56

Part of a proven and reliable CPU family, ensuring compatibility and support.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold conditions.

ADC Channels: YES

Analog-to-digital converter channels for sensor interfacing and data acquisition.

DMA Channels: YES

Direct memory access channels for efficient data transfer and processing.

Terminal Position: QUAD

Quad terminal position for easy soldering and connection.

ROM Words: 262144

Large ROM capacity for storing program code and data.

Maximum Seated Height: 1.6 mm

Low profile design for compact and thin devices.

Width: 10 mm

Compact width for space-saving PCB layouts.

Boundary Scan: YES

Boundary scan feature for testing and debugging during development.

Maximum Clock Frequency: 16 MHz

High clock frequency for fast processing and response times.

Length: 10 mm

Compact length for space-efficient designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature range for reliable performance in automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with Reduced Instruction Set Computing (RISC) architecture for efficient processing.

RAM Bytes: 16384

Sufficient RAM for data storage and processing in applications.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form factor for secure connections and reliability.

Maximum Supply Current: 100 mA

Low supply current for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent performance.

No. of DMA Channels: 16

Multiple DMA channels for parallel data processing and transfer.

PWM Channels: YES

Pulse-width modulation channels for precise control and signal generation.

ROM Programmability: FLASH

Flash ROM for easy programmability and update of firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density interconnects.

Format: FIXED POINT

Fixed-point format for efficient arithmetic operations and precision.

Speed: 48 rpm

High processing speed of 48 rotations per minute for quick response.

Low Power Mode: YES

Low power mode for energy-saving operation and extended battery life.

On Chip Program ROM Width: 8

8-bit width for on-chip program ROM data storage.

No. of I/O Lines: 45

Sufficient number of input/output lines for interfacing with external devices.

Technical Specifications

Microcontrollers SPC560D40L1C4E0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 5 V

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

SPC56

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

45

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

SPC560D40L1C4E0X Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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