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SPC560D40L1C3E0X

STMicroelectronics

SPC560D40L1C3E0X by STMicroelectronics

STMicroelectronics SPC560D40L1C3E0X is a 32-bit microcontroller with 262144 ROM words and 16384 RAM bytes. Ideal for automotive applications, it features 45 I/O lines, 16 DMA channels, and operates at temperatures ranging from -40 to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,148 parts In-Stock

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4,148

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Vyrian

USA . 1,455 parts In-Stock

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1,455

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Anansix

USA . 1,290 parts In-Stock

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1,290

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,385 parts In-Stock

1+ parts

$3.807

100+ parts

-

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-

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1,385

$3.807

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AZTECH Wire

Italy . 745 parts In-Stock

1+ parts

$13.387

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745

$13.387

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IDEA Electronic Components Group

UK . 1,914 parts In-Stock

1+ parts

$17.821

100+ parts

-

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$16.039

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1,914

$17.821

-

$16.039

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Ampacity Inc.

Singapore . 809 parts In-Stock

1+ parts

$23.000

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809

$23.000

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MKK Technologies

India . 869 parts In-Stock

1+ parts

$33.512

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869

$33.512

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DigiPath Technology Company

USA . 869 parts In-Stock

1+ parts

$33.512

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869

$33.512

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Argo Parts USA

USA . 4,626 parts In-Stock

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4,626

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Continental Prestige Electronics

USA . 4,247 parts In-Stock

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Vigor

Singapore . 3,741 parts In-Stock

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Corphita

USA . 1,203 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Parana Technologies

USA . 208 parts In-Stock

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$21.308

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208

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$21.308

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Overview

Elevate your projects to new heights with the SPC560D40L1C3E0X microcontroller from STMicroelectronics. As a trusted leader in the industry, STMicroelectronics delivers top-quality products that meet the highest standards. This microcontroller offers unparalleled performance and reliability, making it ideal for a wide range of applications. From automotive systems to industrial automation, this versatile device provides the power and efficiency you need to bring your ideas to life. Experience the value and benefits of choosing STMicroelectronics for your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy body material provides durability and reliability for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into electronic circuits.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage ensures compatibility with a wide range of power sources.

Bit Size: 32

32-bit processing capability offers enhanced performance and efficiency for tasks and computations.

No. of Terminals: 64

64 terminals provide ample connectivity options for interfacing with external components and peripherals.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance allows for reliable operation in harsh environments.

Minimum Operating Temperature: -40 °C

Wide temperature range support enables the microcontroller to function in extreme cold conditions.

ADC Channels: YES

Analog-to-digital converter channels allow for precise conversion of analog signals into digital data.

DMA Channels: YES

Direct memory access channels enhance data transfer efficiency and reduce CPU workload.

ROM Words: 262144

Large ROM capacity provides ample storage space for program instructions and data.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers streamlined and efficient data processing capabilities.

RAM Bytes: 16384

Sufficient RAM capacity for data storage and manipulation during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for improved performance.

Maximum Clock Frequency: 16 MHz

High clock frequency enables fast execution of instructions and operations.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable operation in automotive applications.

PWM Channels: YES

Pulse-width modulation channels enable precise control of analog outputs such as motor speed and LED brightness.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating and modification of firmware and software.

Low Power Mode: YES

Low power mode capability conserves energy and extends battery life in portable devices.

Technical Specifications

Microcontrollers SPC560D40L1C3E0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 5 V

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

SPC56

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of I/O Lines:

45

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

SPC560D40L1C3E0X Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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