Loading...

SPC560B40L5B6E0X

STMicroelectronics

SPC560B40L5B6E0X by STMicroelectronics

SPC560B40L5B6E0X by STMicroelectronics is a 32-bit microcontroller with 36-Ch 10-Bit ADC, 64K Data EEPROM, and 24576 Bytes RAM. It is ideal for industrial applications requiring CAN, I2C, LIN, SCI, and SPI connectivity with a max clock frequency of 16 MHz. The microcontroller operates in temperatures ranging from -40 to 105 °C and has a low profile flatpack package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,650

-

-

-

-

Digiode

USA . 3,702 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,702

-

-

-

-

Anansix

USA . 2,835 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,835

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 862 parts In-Stock

1+ parts

$9.210

100+ parts

-

1k+ parts

-

10k+ parts

-

862

$9.210

-

-

-

Microchip USA

USA . 2,416 parts In-Stock

1+ parts

$9.720

100+ parts

-

1k+ parts

-

10k+ parts

-

2,416

$9.720

-

-

-

IDEA Electronic Components Group

UK . 1,804 parts In-Stock

1+ parts

$37.632

100+ parts

-

1k+ parts

$33.869

10k+ parts

-

1,804

$37.632

-

$33.869

-

MKK Technologies

India . 1,476 parts In-Stock

1+ parts

$70.764

100+ parts

-

1k+ parts

-

10k+ parts

-

1,476

$70.764

-

-

-

DigiPath Technology Company

USA . 1,476 parts In-Stock

1+ parts

$70.764

100+ parts

-

1k+ parts

-

10k+ parts

-

1,476

$70.764

-

-

-

Component Stockers USA

USA . 389 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

389

$99.990

-

-

-

Corphita

USA . 3,456 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,456

-

-

-

-

Vigor

Singapore . 2,158 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,158

-

-

-

-

Parana Technologies

USA . 179 parts In-Stock

1+ parts

-

100+ parts

$44.994

1k+ parts

-

10k+ parts

-

179

-

$44.994

-

-

Overview

Unlock the power of innovation with the SPC560B40L5B6E0X by STMicroelectronics. As a leader in microcontroller technology, STMicroelectronics delivers top-notch quality and reliability for a wide range of applications. This versatile microcontroller offers customers unmatched value, benefits, and advantages, providing seamless integration and exceptional performance. With its advanced features and cutting-edge design, the SPC560B40L5B6E0X is the perfect solution for your next project. Elevate your designs with STMicroelectronics today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good mechanical strength and durability for the microcontroller, making it suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options while ensuring safe operation within specified voltage limits.

Package Shape: SQUARE

Provides a compact form factor which can help in space-constrained designs.

Bit Size: 32

Offers a good balance between computational power and resource efficiency for various applications.

Power Supplies (V): 3.3/5

Supports a wide range of power supply voltages, making it versatile for different power requirements.

No. of Terminals: 144

Provides ample connectivity options for various peripherals and external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables compact and low-profile PCB designs, suitable for applications where space is limited.

Minimum Supply Voltage: 3 V

Allows operation at lower voltage levels for power-saving applications or when a lower voltage source is available.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

Ensures reliable operation in cold environments or during temperature fluctuations.

Terminal Finish: MATTE TIN

Provides good solderability and corrosion resistance for reliable connections during assembly.

ADC Channels: YES

Allows for analog signal acquisition and conversion, enabling sensor interfacing and data acquisition.

DMA Channels: YES

Enables efficient data transfer between peripherals and memory without CPU intervention, improving system performance.

Terminal Position: QUAD

Offers a balanced arrangement of terminals for efficient routing and layout on the PCB.

ROM Words: 262144

Provides ample memory for program storage, data logging, and firmware updates.

Maximum Seated Height: 1.6 mm

Low profile design facilitates compact and space-saving PCB layouts.

Width: 20 mm

Compact width enables smaller PCB footprint and efficient space utilization.

Data EEPROM Size: 64K

Offers non-volatile memory for storing configuration settings, calibration data, and critical information.

Peripherals: DMA, POR, PWM(50), RTC, TIMER(56), WDT

A rich set of peripherals provides various functions such as data transfer, timing, watchdog, and real-time clock for diverse application requirements.

Maximum Clock Frequency: 16 MHz

Provides fast processing capabilities for real-time applications and time-critical tasks.

Peak Reflow Temperature °C: 260

Allows for reliable and robust soldering during manufacturing processes.

Length: 20 mm

Compact length contributes to overall space-saving design considerations.

Temperature Grade: INDUSTRIAL

Designed to meet the rigorous temperature requirements of industrial applications for reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER

Integrates a microcontroller core with a variety of peripherals, offering a complete solution for embedded system designs.

RAM Bytes: 24576

Sufficient RAM for data storage and processing, supporting multitasking and data manipulation operations.

Technology: CMOS

Low power consumption and high noise immunity characteristics make it suitable for portable and battery-operated devices.

Terminal Form: GULL WING

Facilitates easy and reliable soldering connections during PCB assembly.

Analog To Digital Convertors: 36-Ch 10-Bit

Offers a high number of ADC channels for acquiring analog signals with good resolution for accurate data conversion.

Maximum Supply Current: 140 mA

Indicates the maximum current consumption under specified operating conditions for power budgeting and supply design.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for stable and efficient operation in most applications.

PWM Channels: YES

Allows for hardware-based pulse-width modulation output for controlling motors, LEDs, and other devices requiring variable voltage levels.

Connectivity: CAN(2), I2C, LIN(3), SCI(3), SPI(3)

Supports various communication interfaces for connecting to sensors, actuators, and other devices in a networked environment.

ROM Programmability: FLASH

Enables easy and efficient programming of the ROM for firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine pitch terminals allow for high-density packaging and miniaturization of PCB designs.

Moisture Sensitivity Level (MSL): 3

Indicates the level of moisture sensitivity for proper handling and storage during assembly and rework processes.

Speed: 64 rpm

Specifies the clock speed or performance capability of the microcontroller for efficient execution of instructions and tasks.

On Chip Program ROM Width: 8

The width of the on-chip ROM data bus, which determines the amount of data that can be transferred in a single cycle for efficient program execution.

No. of I/O Lines: 123

High number of I/O lines for connecting to external peripherals and devices, enabling versatile functionality and interfacing capabilities.

Technical Specifications

Microcontrollers SPC560B40L5B6E0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES WITH 5 V NOMINAL SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

123

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

24576

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

140 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(2), I2C, LIN(3), SCI(3), SPI(3)

Peripherals:

DMA, POR, PWM(50), RTC, TIMER(56), WDT

Analog To Digital Convertors:

36-Ch 10-Bit

Trade Compliance

SPC560B40L5B6E0X Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20