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SPC560B40L3B3E0X

STMicroelectronics

SPC560B40L3B3E0X by STMicroelectronics

SPC560B40L3B3E0X by STMicroelectronics is a 32-bit microcontroller with 262K ROM words, 64K data EEPROM size, and 28 ADC channels. Ideal for industrial applications, it offers peripherals like POR, PWM(25), RTC, TIMER(28), WDT and connectivity options including CAN(2), I2C, LIN(3), SCI(3), SPI(3).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,909 parts In-Stock

1+ parts

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9,909

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Digiode

USA . 2,559 parts In-Stock

1+ parts

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2,559

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Anansix

USA . 744 parts In-Stock

1+ parts

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744

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 1,242 parts In-Stock

1+ parts

$8.462

100+ parts

-

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1,242

$8.462

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AZTECH Wire

Italy . 306 parts In-Stock

1+ parts

$16.720

100+ parts

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306

$16.720

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IDEA Electronic Components Group

UK . 382 parts In-Stock

1+ parts

$76.365

100+ parts

-

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$68.728

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382

$76.365

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$68.728

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MKK Technologies

India . 1,850 parts In-Stock

1+ parts

$143.599

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1,850

$143.599

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DigiPath Technology Company

USA . 1,850 parts In-Stock

1+ parts

$143.599

100+ parts

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1,850

$143.599

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QUARKTWIN TECHNOLOGY LTD

USA . 5,479 parts In-Stock

1+ parts

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5,479

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Corphita

USA . 1,683 parts In-Stock

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1,683

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Parana Technologies

USA . 1,366 parts In-Stock

1+ parts

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100+ parts

$91.306

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1,366

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$91.306

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Vigor

Singapore . 1,250 parts In-Stock

1+ parts

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1,250

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Overview

Unlock the power of innovation with the SPC560B40L3B3E0X microcontroller by STMicroelectronics. Known for their high quality and reliability, STMicroelectronics offers a wide range of applications for this versatile product. From automotive to industrial control systems, this microcontroller provides customers with unparalleled value and benefits. With advanced features such as ADC channels, PWM capabilities, and a maximum clock frequency of 16 MHz, the SPC560B40L3B3E0X is the perfect choice for your next project. Experience the advantages of STMicroelectronics today and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easier and compact PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6V allows for flexibility in power supply options.

Bit Size: 32

The 32-bit architecture provides high processing power and performance for demanding applications.

No. of Terminals: 100

Having 100 terminals enables numerous connection possibilities and interfaces for peripherals.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the microcontroller to function reliably in extreme conditions.

ADC Channels: YES

Analog to Digital Convertors (ADC) enable accurate conversion of analog signals for precise control and measurement.

ROM Words: 262144

The large ROM size allows for storing a significant amount of program instructions and data.

Maximum Clock Frequency: 16 MHz

The high clock frequency of 16MHz enables fast processing and real-time operation.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates various peripherals and processing capabilities into a single chip for efficient system design.

Technical Specifications

Microcontrollers SPC560B40L3B3E0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES WITH 5 V NOMINAL SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

79

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

24576

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(2), I2C, LIN(3), SCI(3), SPI(3)

Peripherals:

POR, PWM(25), RTC, TIMER(28), WDT

Analog To Digital Convertors:

28-Ch 10-Bit

Trade Compliance

SPC560B40L3B3E0X Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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