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SPC560B40L1C6E0X

STMicroelectronics

SPC560B40L1C6E0X by STMicroelectronics

SPC560B40L1C6E0X by STMicroelectronics is a 32-bit microcontroller with 262144 ROM words, 64K data EEPROM, and 24576 RAM bytes. Ideal for automotive applications, it features 12 ADC channels, DMA support, and peripherals like PWM and RTC. Operating at up to 16 MHz with CAN, I2C, LIN connectivity options.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,928 parts In-Stock

1+ parts

-

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6,928

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Digiode

USA . 3,776 parts In-Stock

1+ parts

-

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-

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3,776

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Anansix

USA . 2,713 parts In-Stock

1+ parts

-

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2,713

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,149 parts In-Stock

1+ parts

$19.610

100+ parts

-

1k+ parts

-

10k+ parts

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1,149

$19.610

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IDEA Electronic Components Group

UK . 2,130 parts In-Stock

1+ parts

$34.407

100+ parts

-

1k+ parts

$30.966

10k+ parts

-

2,130

$34.407

-

$30.966

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MKK Technologies

India . 1,633 parts In-Stock

1+ parts

$64.700

100+ parts

-

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1,633

$64.700

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DigiPath Technology Company

USA . 1,633 parts In-Stock

1+ parts

$64.700

100+ parts

-

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1,633

$64.700

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Microchip USA

USA . 1,765 parts In-Stock

1+ parts

$91.266

100+ parts

-

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1,765

$91.266

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Component Stockers USA

USA . 554 parts In-Stock

1+ parts

$99.990

100+ parts

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554

$99.990

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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6,500

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Corphita

USA . 4,318 parts In-Stock

1+ parts

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4,318

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Vigor

Singapore . 4,000 parts In-Stock

1+ parts

-

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4,000

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Kepictronics

USA . 1,129 parts In-Stock

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1,129

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Parana Technologies

USA . 64 parts In-Stock

1+ parts

-

100+ parts

$41.139

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64

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$41.139

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Overview

Discover the cutting-edge SPC560B40L1C6E0X microcontroller by STMicroelectronics, a leader in semiconductor technology. This powerful device offers unparalleled performance and reliability for a wide range of automotive applications, with features like 12-channel ADC, 64KB data EEPROM, and 24576 bytes of RAM. Ideal for demanding automotive environments, this microcontroller boasts a maximum clock frequency of 16MHz and a temperature grade suitable for automotive use. Trust STMicroelectronics to deliver quality and innovation, providing you with the tools you need to succeed in today's fast-paced market. Elevate your designs with the SPC560B40L1C6E0X and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the microcontroller, ensuring a longer lifespan and reliability.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while still maintaining safe operating limits.

Bit Size: 32

32-bit architecture allows for higher computational capabilities and performance efficiency.

No. of Terminals: 64

With 64 terminals, this microcontroller offers ample connectivity options for various external devices.

Minimum Operating Temperature: -40 °C

Can operate effectively even in extreme low-temperature environments, making it suitable for a wide range of applications.

ADC Channels: YES

Integrated Analog to Digital Convertors enable precise measurement and control of analog signals.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product is designed for embedded applications where control and processing capabilities are essential.

Maximum Clock Frequency: 16 MHz

High clock frequency allows for faster processing speeds and real-time control tasks.

RAM Bytes: 24576

A generous amount of RAM enables efficient data handling and multitasking capabilities.

Connectivity: CAN(2), I2C, LIN(3), SCI(3), SPI(2)

Multiple connectivity options allow for versatile communication with other devices, networks, and sensors.

Technical Specifications

Microcontrollers SPC560B40L1C6E0X attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES WITH 5 V NOMINAL SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

45

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

24576

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

64 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(2), I2C, LIN(3), SCI(3), SPI(2)

Peripherals:

DMA, POR, PWM(12), RTC, TIMER(12), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

SPC560B40L1C6E0X Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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