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SP1ML-868

STMicroelectronics

SP1ML-868 by STMicroelectronics

SP1ML-868 by STMicroelectronics is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.8V to 3.6V. This RECTANGULAR package has 16 terminals and is ideal for INDUSTRIAL applications requiring high performance in a compact MICROELECTRONIC ASSEMBLY form factor.

Median Price

$16.154

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 181 parts In-Stock

1+ parts

$12.530

100+ parts

$10.370

1k+ parts

-

10k+ parts

-

181

$12.530

$10.370

-

-

DigiKey

USA . 2,018 parts In-Stock

1+ parts

$19.230

100+ parts

$15.913

1k+ parts

$13.750

10k+ parts

-

2,018

$19.230

$15.913

$13.750

-

Element14

Singapore . 303 parts In-Stock

1+ parts

$33.220

100+ parts

-

1k+ parts

$25.980

10k+ parts

-

303

$33.220

-

$25.980

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Future Electronics

Canada . 228 parts In-Stock

1+ parts

-

100+ parts

$19.750

1k+ parts

-

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228

-

$19.750

-

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Verical

USA . 25 parts In-Stock

1+ parts

-

100+ parts

$13.077

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-

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-

25

-

$13.077

-

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Newark

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$11.740

1k+ parts

$11.740

10k+ parts

$11.740

1

-

$11.740

$11.740

$11.740

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$9.184

100+ parts

-

1k+ parts

-

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50

$9.184

-

-

-

Vyrian

USA . 437 parts In-Stock

1+ parts

$13.077

100+ parts

-

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-

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437

$13.077

-

-

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Digiode

USA . 3,794 parts In-Stock

1+ parts

$14.810

100+ parts

-

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-

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3,794

$14.810

-

-

-

Chip Stock

USA . 2,564 parts In-Stock

1+ parts

-

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2,564

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Anansix

USA . 1,276 parts In-Stock

1+ parts

-

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1,276

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ComSIT Distribution GmbH

Germany . 388 parts In-Stock

1+ parts

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388

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ComSIT USA

USA . 388 parts In-Stock

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388

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IBS Electronics

USA . 228 parts In-Stock

1+ parts

-

100+ parts

$27.699

1k+ parts

-

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228

-

$27.699

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,169 parts In-Stock

1+ parts

$9.184

100+ parts

-

1k+ parts

-

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1,169

$9.184

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-

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Continental Prestige Electronics

USA . 202 parts In-Stock

1+ parts

$10.950

100+ parts

-

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202

$10.950

-

-

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$10.973

100+ parts

$9.985

1k+ parts

$8.998

10k+ parts

-

200

$10.973

$9.985

$8.998

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Ampacity Inc.

Singapore . 260 parts In-Stock

1+ parts

$11.120

100+ parts

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260

$11.120

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Semicontronic

India . 36 parts In-Stock

1+ parts

$11.120

100+ parts

$10.842

1k+ parts

$10.786

10k+ parts

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36

$11.120

$10.842

$10.786

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IDEA Electronic Components Group

UK . 1,814 parts In-Stock

1+ parts

$13.974

100+ parts

-

1k+ parts

$12.576

10k+ parts

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1,814

$13.974

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$12.576

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Corphita

USA . 3,233 parts In-Stock

1+ parts

$14.031

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3,233

$14.031

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MKK Technologies

India . 1,724 parts In-Stock

1+ parts

$26.277

100+ parts

-

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1,724

$26.277

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DigiPath Technology Company

USA . 1,724 parts In-Stock

1+ parts

$26.277

100+ parts

-

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1,724

$26.277

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A-Z Elektronik GmbH

Germany . 5,522 parts In-Stock

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5,522

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Argo Parts USA

USA . 2,467 parts In-Stock

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2,467

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Kepictronics

USA . 1,064 parts In-Stock

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1,064

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RC Electronics

USA . 1,064 parts In-Stock

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1,064

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Parana Technologies

USA . 827 parts In-Stock

1+ parts

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$16.708

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827

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$16.708

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Assy Fe

Spain . 401 parts In-Stock

1+ parts

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401

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Overview

Elevate your electronics projects with the high-quality SP1ML-868 by STMicroelectronics. Designed with precision and reliability in mind, this product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering endless possibilities for innovation. With a maximum supply voltage of 3.6V and a compact rectangular package style, this versatile microprocessor circuit is ideal for industrial applications. Experience the value and benefits of seamless integration, optimal performance, and unparalleled efficiency that the SP1ML-868 brings to the table. Upgrade your projects today with STMicroelectronics.

Feature Benefit Bullets

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a range of systems.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and provides ease of integration into circuit designs.

No. of Terminals: 16

Having 16 terminals provides adequate connectivity for various functions and interfaces.

Package Style: MICROELECTRONIC ASSEMBLY

Microelectronic assembly allows for compact design and efficient use of space in electronic devices.

Minimum Supply Voltage: 1.8 V

Lower minimum supply voltage enables energy-efficient operation and compatibility with low-power systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range of operation makes this product suitable for industrial applications and harsh environments.

Terminal Position: DUAL

Dual terminal position offers redundancy and flexibility in circuit connections.

Maximum Seated Height: 2.5 mm

Low seated height facilitates compact and slim device designs.

Width: 13.4 mm

Moderate width allows for easy placement on circuit boards and efficient use of space.

Length: 14 mm

Standard length provides compatibility with commonly used board sizes and form factors.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature performance ensures reliability and durability in demanding environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit offers advanced processing capabilities and functionality for various applications.

Technology: CMOS

CMOS technology provides low power consumption, high-speed operation, and compatibility with a wide range of systems.

Terminal Form: NO LEAD

No-lead terminal form allows for reliable soldering connections and reduces the risk of solder joint failures.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Terminal Pitch: 1.5 mm

Fine terminal pitch enables high-density integration and efficient routing of signals in the circuit design.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SP1ML-868 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-XDMA-N16

Length:

14 mm

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.5 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

13.4 mm

Peripheral IC Type:

Trade Compliance

SP1ML-868 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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