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SMM4F28A-TR

STMicroelectronics

SMM4F28A-TR by STMicroelectronics

SMM4F28A-TR by STMicroelectronics is a unidirectional transient voltage suppressor diode designed for robust circuit protection. It features a max reverse power dissipation of 400 W, breakdown voltage of 33 V, and operates b/w -55 °C to 175°C. Ideal for safeguarding sensitive electronics from voltage spikes.

Median Price

$0.765

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 67,582 parts In-Stock

1+ parts

$0.620

100+ parts

$0.320

1k+ parts

$0.193

10k+ parts

$0.191

67,582

$0.620

$0.320

$0.193

$0.191

DigiKey

USA . 207 parts In-Stock

1+ parts

$0.910

100+ parts

$0.368

1k+ parts

-

10k+ parts

-

207

$0.910

$0.368

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,133 parts In-Stock

1+ parts

$0.589

100+ parts

-

1k+ parts

-

10k+ parts

-

1,133

$0.589

-

-

-

Vyrian

USA . 2,329 parts In-Stock

1+ parts

$0.620

100+ parts

-

1k+ parts

-

10k+ parts

-

2,329

$0.620

-

-

-

Microfarads

USA . 8,064 parts In-Stock

1+ parts

-

100+ parts

-

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-

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8,064

-

-

-

-

Bristol Electronics

USA . 5,160 parts In-Stock

1+ parts

-

100+ parts

$0.317

1k+ parts

$0.156

10k+ parts

$0.127

5,160

-

$0.317

$0.156

$0.127

Cyclops Electronics Ltd

UK . 4,478 parts In-Stock

1+ parts

-

100+ parts

-

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4,478

-

-

-

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Anansix

USA . 597 parts In-Stock

1+ parts

-

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597

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$0.027

100+ parts

$0.025

1k+ parts

$0.022

10k+ parts

-

500

$0.027

$0.025

$0.022

-

IDEA Electronic Components Group

UK . 62 parts In-Stock

1+ parts

$0.083

100+ parts

-

1k+ parts

$0.075

10k+ parts

-

62

$0.083

-

$0.075

-

MKK Technologies

India . 1,024 parts In-Stock

1+ parts

$0.156

100+ parts

-

1k+ parts

-

10k+ parts

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1,024

$0.156

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DigiPath Technology Company

USA . 1,024 parts In-Stock

1+ parts

$0.156

100+ parts

-

1k+ parts

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10k+ parts

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1,024

$0.156

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-

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Corphita

USA . 2,857 parts In-Stock

1+ parts

$0.558

100+ parts

-

1k+ parts

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10k+ parts

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2,857

$0.558

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-

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Perfect Parts

USA . 76,167 parts In-Stock

1+ parts

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76,167

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Parana Technologies

USA . 717 parts In-Stock

1+ parts

-

100+ parts

$0.099

1k+ parts

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10k+ parts

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717

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$0.099

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Overview

Elevate your designs with the SMM4F28A-TR from STMicroelectronics, a trusted leader in semiconductor innovation. This robust transient suppression device offers unmatched reliability and superior protection for sensitive components in diverse applications—from automotive to industrial electronics. With exceptional thermal performance and low clamping voltage, it ensures longevity and efficiency, delivering peace of mind that your systems will run smoothly under any conditions. Choose quality, choose STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides good insulation and protection against environmental factors, ensuring reliability in various applications.

Config: SINGLE

A single configuration simplifies the integration into circuits, making it easier for designers to implement transient suppression in their designs.

Surface Mount: YES

Being surface mount allows for compact designs and facilitates automated assembly processes, ideal for modern electronic devices.

Maximum Non Repetitive Peak Reverse Power Dissipation: 400 W

A high power dissipation capability of 400W ensures that the device can withstand significant transient events without failure, enhancing circuit protection.

Nominal Breakdown Voltage: 33 V

A nominal breakdown voltage of 33V provides effective protection for circuits that operate under this voltage, ensuring equipment safety.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space, making it suitable for a variety of circuit layouts.

No. of Terminals: 2

The two-terminal design keeps the device simple, reducing potential points of failure and making connection straightforward in circuit applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style optimizes space on the PCB, accommodating dense circuit designs particularly in portable electronics.

Maximum Operating Temperature: 175 °C

The capability to operate at high temperatures ensures stability and reliability in demanding environments, extending the life of the device.

Minimum Operating Temperature: -55 °C

A wide temperature range of -55 °C allows operation in extreme conditions, making this device versatile for various applications.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides good solderability and corrosion resistance, ensuring long-lasting connections in electronic circuits.

Terminal Position: DUAL

Dual terminal positioning allows for flexible mounting options, accommodating different PCB layouts and design preferences.

Maximum Power Dissipation: 2.5 W

A maximum power dissipation of 2.5W provides adequate handling of typical power levels in transient suppression applications, ensuring effective performance.

Minimum Breakdown Voltage: 31.4 V

A minimum breakdown voltage guarantees reliable protection, ensuring the device activates timely to prevent damage to sensitive components.

Maximum Time At Peak Reflow Temperature: 30 s

Limits on the reflow duration help prevent overheating and damage during soldering processes, ensuring device integrity post-assembly.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C ensures compatibility with high-temperature soldering processes, improving manufacturability.

Maximum Breakdown Voltage: 34.7 V

A maximum breakdown voltage of up to 34.7V provides a wide margin for safe circuit operation, enhancing overall protection.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

As a transient voltage suppressor, this diode effectively protects circuits from voltage spikes, promoting longer device life and reliability.

Technology: AVALANCHE

The avalanche technology enables quick response to transient events, providing immediate suppression and safeguarding components.

Terminal Form: FLAT

Flat terminals provide optimal contact with the PCB, minimizing inductance and improving overall circuit performance.

Maximum Repetitive Peak Reverse Voltage: 28 V

This specification indicates safe limits for continuous operation, ensuring circuits remain protected under typical voltage conditions.

Polarity: UNIDIRECTIONAL

Unidirectional operation is suitable for most applications where reverse polarity protection is needed, enhancing circuit safety.

Maximum Clamping Voltage: 45.4 V

A high maximum clamping voltage ensures that transient events are effectively suppressed, preventing damage to sensitive electronics.

Diode Element Material: SILICON

Utilizing silicon for the diode element provides reliable performance and robust characteristics essential for transient suppression applications.

Technical Specifications

Transient Suppression Devices SMM4F28A-TR attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Maximum Breakdown Voltage:

34.7 V

Minimum Breakdown Voltage:

31.4 V

Nominal Breakdown Voltage:

33 V

Maximum Clamping Voltage:

45.4 V

Config:

SINGLE

Diode Element Material:

SILICON

JEDEC-95 Code:

DO-222AA

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

400 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

2.5 W

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

28 V

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

SMM4F28A-TR Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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