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SMM4F12A-TR

STMicroelectronics

SMM4F12A-TR by STMicroelectronics

SMM4F12A-TR by STMicroelectronics is a unidirectional transient voltage suppressor diode designed for robust protection in electronic circuits. It features a max reverse power dissipation of 400 W, breakdown voltage of 14 V, and operates b/w -55 °C to 175°C. Ideal for safeguarding sensitive components from voltage spikes, it ensures reliability in various applications.

Median Price

$0.155

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,730 parts In-Stock

1+ parts

$0.155

100+ parts

-

1k+ parts

-

10k+ parts

-

2,730

$0.155

-

-

-

Mouser Electronics

USA . 9,788 parts In-Stock

1+ parts

$0.520

100+ parts

$0.278

1k+ parts

$0.188

10k+ parts

$0.184

9,788

$0.520

$0.278

$0.188

$0.184

DigiKey

USA . 59 parts In-Stock

1+ parts

$0.910

100+ parts

-

1k+ parts

-

10k+ parts

-

59

$0.910

-

-

-

Avnet

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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12,000

-

-

-

-

Chip1Stop

Japan . 4,759 parts In-Stock

1+ parts

-

100+ parts

$0.148

1k+ parts

$0.147

10k+ parts

-

4,759

-

$0.148

$0.147

-

Verical

USA . 2,730 parts In-Stock

1+ parts

-

100+ parts

$0.155

1k+ parts

-

10k+ parts

-

2,730

-

$0.155

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,089 parts In-Stock

1+ parts

$0.148

100+ parts

-

1k+ parts

-

10k+ parts

-

1,089

$0.148

-

-

-

Digiode

USA . 3,794 parts In-Stock

1+ parts

$0.184

100+ parts

-

1k+ parts

-

10k+ parts

-

3,794

$0.184

-

-

-

ComSIT Distribution GmbH

Germany . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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12,000

-

-

-

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Prism Electronics

USA . 7,968 parts In-Stock

1+ parts

-

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7,968

-

-

-

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Anansix

USA . 1,068 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,068

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,366 parts In-Stock

1+ parts

$0.121

100+ parts

-

1k+ parts

$0.108

10k+ parts

-

1,366

$0.121

-

$0.108

-

Component Stockers USA

USA . 67,499 parts In-Stock

1+ parts

$0.140

100+ parts

$0.130

1k+ parts

$0.130

10k+ parts

$0.180

67,499

$0.140

$0.130

$0.130

$0.180

Corphita

USA . 929 parts In-Stock

1+ parts

$0.175

100+ parts

-

1k+ parts

-

10k+ parts

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929

$0.175

-

-

-

MKK Technologies

India . 260 parts In-Stock

1+ parts

$0.227

100+ parts

-

1k+ parts

-

10k+ parts

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260

$0.227

-

-

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DigiPath Technology Company

USA . 260 parts In-Stock

1+ parts

$0.227

100+ parts

-

1k+ parts

-

10k+ parts

-

260

$0.227

-

-

-

Advanced Electronics

New Zealand . 300 parts In-Stock

1+ parts

$0.230

100+ parts

$0.209

1k+ parts

$0.189

10k+ parts

-

300

$0.230

$0.209

$0.189

-

Perfect Parts

USA . 170,081 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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170,081

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-

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Kepictronics

USA . 85,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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85,000

-

-

-

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Parana Technologies

USA . 49 parts In-Stock

1+ parts

-

100+ parts

$0.144

1k+ parts

-

10k+ parts

-

49

-

$0.144

-

-

Overview

Elevate your circuit protection with the SMM4F12A-TR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality transient suppression device offers unmatched reliability, safeguarding your applications against voltage spikes and ensuring optimal performance in demanding environments. With a robust design that withstands extreme temperatures, it’s perfect for automotive, industrial, and consumer electronics. Experience peace of mind and enhanced system longevity with STMicroelectronics—where quality meets excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability, making the device suitable for various environments.

Config: SINGLE

A single configuration allows for easy integration into circuits, facilitating a more straightforward design process.

Surface Mount: YES

Surface mount technology provides a compact design and enables automated assembly, improving manufacturing efficiency.

Maximum Non Repetitive Peak Reverse Power Dissipation: 400 W

The high power dissipation capability means it can handle significant transients, enhancing circuit protection.

Nominal Breakdown Voltage: 14 V

A nominal breakdown voltage of 14 V ensures effective clamping in most applications, safeguarding sensitive components.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space and optimal layout options.

No. of Terminals: 2

Having only two terminals simplifies the design and integration into various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package is ideal for compact designs, making it suitable for space-constrained applications.

Maximum Operating Temperature: 175 °C

A maximum operating temperature of 175 °C allows for reliable performance in high-temperature environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature expands its usability in extreme conditions, ensuring functionality in all environments.

Terminal Finish: Matte Tin (Sn)

Matte tin terminals provide excellent solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positioning enhances connection flexibility, allowing for easier integration into complex circuitry.

Maximum Power Dissipation: 2.5 W

The capability to dissipate 2.5 W provides reliable operation during transient events, ensuring protection for connected components.

Minimum Breakdown Voltage: 13.3 V

A minimum breakdown voltage of 13.3 V ensures effective protection under varying voltage conditions.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow temperature duration of 30 seconds ensures compatibility with automated assembly processes without damaging the device.

Peak Reflow Temperature °C: 260

The ability to withstand peak reflow temperatures of 260 °C ensures durability during manufacturing processes.

Maximum Breakdown Voltage: 14.7 V

A maximum breakdown voltage of 14.7 V provides an additional safety margin, protecting sensitive components in circuits.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

As a transient voltage suppressor diode, it effectively protects circuits from voltage spikes, ensuring component safety.

Technology: AVALANCHE

Avalanche technology allows for quick response to over-voltage conditions, minimizing damage risks to the circuit.

Terminal Form: FLAT

Flat terminals promote ease of installation and optimal contact for electrical connections.

Maximum Repetitive Peak Reverse Voltage: 12 V

A maximum repetitive peak reverse voltage of 12 V provides adequate surge protection for low-voltage applications.

Polarity: UNIDIRECTIONAL

Being unidirectional simplifies circuit design and improves reliability where reverse voltage isn't an issue.

Maximum Clamping Voltage: 19.9 V

A maximum clamping voltage of 19.9 V ensures that connected components are protected from voltage spikes.

Diode Element Material: SILICON

Silicon material is known for its effective voltage suppression properties, making this product reliable for transient protection.

Technical Specifications

Transient Suppression Devices SMM4F12A-TR attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Maximum Breakdown Voltage:

14.7 V

Minimum Breakdown Voltage:

13.3 V

Nominal Breakdown Voltage:

14 V

Maximum Clamping Voltage:

19.9 V

Config:

SINGLE

Diode Element Material:

SILICON

JEDEC-95 Code:

DO-222AA

JESD-30 Code:

R-PDSO-F2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

400 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Maximum Power Dissipation:

2.5 W

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

12 V

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

SMM4F12A-TR Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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