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PM6670

STMicroelectronics

PM6670 by STMicroelectronics

PM6670 by STMicroelectronics is a compact switching regulator designed for industrial applications, featuring a max output current of 1.4 A and operating temp range from -40 °C to 85 °C. It supports input voltages from 4.5 V to 28 V using pulse width modulation. Its thin profile and quad terminal design make it ideal for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,137 parts In-Stock

1+ parts

-

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1,137

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Anansix

USA . 1,052 parts In-Stock

1+ parts

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1,052

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Digiode

USA . 72 parts In-Stock

1+ parts

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72

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,255 parts In-Stock

1+ parts

$12.216

100+ parts

-

1k+ parts

$10.994

10k+ parts

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2,255

$12.216

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$10.994

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MKK Technologies

India . 138 parts In-Stock

1+ parts

$22.971

100+ parts

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138

$22.971

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DigiPath Technology Company

USA . 138 parts In-Stock

1+ parts

$22.971

100+ parts

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138

$22.971

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Metaverse IC Inc.

Canada . 8,500 parts In-Stock

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8,500

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Kepictronics

USA . 6,500 parts In-Stock

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6,500

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A-Z Elektronik GmbH

Germany . 6,258 parts In-Stock

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6,258

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Corphita

USA . 1,177 parts In-Stock

1+ parts

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1,177

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Parana Technologies

USA . 618 parts In-Stock

1+ parts

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100+ parts

$14.606

1k+ parts

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618

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$14.606

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Overview

Elevate your designs with the PM6670 from STMicroelectronics, a top-tier switching regulator that guarantees exceptional performance and reliability. With its compact, heat-efficient design and robust operating temperature range, this powerhouse is perfect for demanding industrial applications. Count on STMicroelectronics' renowned quality and innovation to enhance energy efficiency, reduce board space, and deliver unmatched value for your projects. Unlock new possibilities today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design ensures a compact footprint, making it ideal for space-constrained applications.

Package Shape: SQUARE

The square package shape helps in efficient layout and cooling, enhancing thermal management in PCB design.

No. of Terminals: 24

With 24 terminals, this component offers significant connectivity options for versatile circuit designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink compatibility allow for better heat dissipation and integration into low-profile designs.

Maximum Operating Temperature: 85 °C

This high maximum operating temperature supports applications in harsh environments, ensuring reliability and longevity.

Minimum Operating Temperature: -40 °C

The capability to operate at low temperatures makes this product suitable for industrial and outdoor applications.

Terminal Position: QUAD

Quad terminal positioning allows for better layout flexibility and efficient soldering on PCB.

Maximum Seated Height: 0.8 mm

A low seated height facilitates integration into compact designs while maintaining performance.

Width: 4 mm

The narrow width allows for effective use in space-limited applications, such as portable devices.

Other IC type: SWITCHING CONTROLLER

Being a switching controller allows for higher efficiency and reduced thermal losses in power management.

Nominal Input Voltage: 5 V

The 5 V nominal input voltage is compatible with a wide range of standard supply voltages, making it versatile.

Length: 4 mm

A compact length measurement results in smaller overall PCB size and allows for innovative design layouts.

Temperature Grade: INDUSTRIAL

This industrial temperature grade signifies reliability in demanding environments and prolonged usage.

Maximum Output Current: 1.4 A

1.4 A maximum output current provides sufficient power for various applications, enhancing performance.

Terminal Form: NO LEAD

No-lead terminals are beneficial for automated assembly processes and reduce the footprint on the PCB.

Control Technique: PULSE WIDTH MODULATION

Using PWM control allows for efficient voltage regulation and minimizes power loss, enhancing efficiency.

Switcher Config: PUSH-PULL

The push-pull configuration improves efficiency in voltage conversion and lessens component stress, extending product life.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch enables dense placement of components on the PCB, maximizing layout efficiency.

Minimum Input Voltage: 4.5 V

The low minimum input voltage ensures operation across a variety of power supply conditions, enhancing flexibility.

Maximum Input Voltage: 28 V

The high maximum input voltage offers broad compatibility with various power systems, making it very adaptable.

Technical Specifications

Switching Regulators & Controllers PM6670 attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Additional Features:

ALSO OPERATES WITH 5 VOLT SUPPLY

Other IC type:

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

28 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

5 V

JESD-30 Code:

S-XQCC-N24

Length:

4 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.4 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

4 mm

Trade Compliance

PM6670 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

6625-14-428-3230, 6625144283230

NIIN

144283230

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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