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PM6652TR

STMicroelectronics

PM6652TR by STMicroelectronics

PM6652TR by STMicroelectronics is a versatile switching regulator designed for industrial applications, operating b/w -40 °C to 85 °C. It features a voltage-mode control with a max input of 36V and a switching frequency of 600kHz. Its compact 5mm x 5mm size makes it ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,066 parts In-Stock

1+ parts

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8,066

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Digiode

USA . 453 parts In-Stock

1+ parts

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453

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Anansix

USA . 135 parts In-Stock

1+ parts

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135

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 439 parts In-Stock

1+ parts

$6.470

100+ parts

-

1k+ parts

-

10k+ parts

-

439

$6.470

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IDEA Electronic Components Group

UK . 842 parts In-Stock

1+ parts

$17.976

100+ parts

-

1k+ parts

$16.178

10k+ parts

-

842

$17.976

-

$16.178

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AZTECH Wire

Italy . 475 parts In-Stock

1+ parts

$19.950

100+ parts

-

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475

$19.950

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-

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MKK Technologies

India . 464 parts In-Stock

1+ parts

$33.802

100+ parts

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464

$33.802

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DigiPath Technology Company

USA . 464 parts In-Stock

1+ parts

$33.802

100+ parts

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464

$33.802

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Perfect Parts

USA . 6,035 parts In-Stock

1+ parts

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6,035

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A-Z Elektronik GmbH

Germany . 5,586 parts In-Stock

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5,586

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Corphita

USA . 3,529 parts In-Stock

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3,529

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Kepictronics

USA . 2,288 parts In-Stock

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2,288

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Parana Technologies

USA . 878 parts In-Stock

1+ parts

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100+ parts

$21.493

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878

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$21.493

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Overview

Elevate your designs with the PM6652TR from STMicroelectronics, a trusted leader in innovation and quality. This advanced switching regulator ensures optimal performance across diverse industrial applications, from automation to telecommunications. With its sleek, space-saving design and robust temperature range, it delivers efficiency and reliability that enhance your product's value. Choose PM6652TR for superior control and peace of mind in every project.

Feature Benefit Bullets

Surface Mount: YES

This surface mount design allows for easier integration into compact PCB layouts, making it ideal for modern electronic applications.

Package Shape: SQUARE

The square package shape enhances thermal performance and can improve layout efficiency on circuit boards.

No. of Terminals: 32

With 32 terminals, this device provides ample connections for various functionalities, enabling more complex circuit designs.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The very thin profile with heat sink capabilities allows for effective heat dissipation, ensuring reliable operation in demanding environments.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures reliability in higher-temperature applications, making it suitable for industrial use.

Control Mode: VOLTAGE-MODE

Voltage-mode control allows for stable and precise voltage regulation, enhancing overall system performance.

Minimum Operating Temperature: -40 °C

This wide temperature range (-40 °C to 85 °C) makes the device suitable for extreme conditions and diverse applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and improves the longevity of electrical connections.

Terminal Position: QUAD

The quad terminal position provides a versatile mounting layout, accommodating various circuit board designs.

Maximum Seated Height: 1 mm

A low seated height allows for a more compact design in devices where space is a premium.

Width: 5 mm

Compact width of 5 mm enables the integration into smaller devices, preserving valuable space on circuit boards.

Other IC Type: SWITCHING CONTROLLER

As a switching controller, it efficiently regulates output voltage and current, optimizing energy usage.

Nominal Input Voltage: 12 V

Operating at a common nominal incoming voltage of 12 V makes it convenient for various applications.

Maximum Time At Peak Reflow Temperature: 30 s

This specification ensures compatibility with manufacturing processes, allowing for more efficient production.

Peak Reflow Temperature: 260 °C

Ability to withstand high peak reflow temperatures is crucial for reliable solder joint formation during assembly.

Length: 5 mm

The compact length complements its width, ensuring easy integration into tight spaces without sacrificing performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grade guarantees robustness and reliability under challenging environmental conditions.

Maximum Switching Frequency: 600 kHz

A high switching frequency enhances efficiency and reduces output ripple, resulting in better performance in power applications.

Terminal Form: NO LEAD

No-lead terminals facilitate a more compact design and align with modern environmental standards for soldering.

Control Technique: PULSE WIDTH MODULATION

Using PWM for control provides effective regulation of output voltage, enhancing power supply design flexibility.

Switcher Config: PUSH-PULL

The push-pull configuration allows for better handling of varying loads, contributing to greater efficiency.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is ideal for high-density designs, ensuring compact and efficient layouts while maintaining signal integrity.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates medium sensitivity to moisture, suitable for standard manufacturing practices with proper handling.

Minimum Input Voltage: 4.5 V

With a minimum input voltage of 4.5 V, the device is versatile and can be used in a variety of low-voltage applications.

Maximum Input Voltage: 36 V

The ability to handle up to 36 V ensures compatibility with a wide range of power sources, increasing versatility.

Technical Specifications

Switching Regulators & Controllers PM6652TR attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Additional Features:

ALSO OPERATES IN ADJUSTABLE MODE FROM 0.3 TO 1.5 V

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

36 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

12 V

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

600 kHz

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

PM6652TR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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