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PM6670AS

STMicroelectronics

PM6670AS by STMicroelectronics

PM6670AS by STMicroelectronics is a compact switching regulator designed for automotive applications, featuring a voltage-mode control technique and supporting input voltages from 4.5V to 36V. It operates efficiently at temperatures b/w -40 °C and 125°C, delivering up to 3A output current. With its thin profile and quad terminal design, it’s ideal for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,480 parts In-Stock

1+ parts

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2,480

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Anansix

USA . 1,276 parts In-Stock

1+ parts

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1,276

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Digiode

USA . 286 parts In-Stock

1+ parts

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286

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,220 parts In-Stock

1+ parts

$12.500

100+ parts

-

1k+ parts

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1,220

$12.500

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IDEA Electronic Components Group

UK . 1,695 parts In-Stock

1+ parts

$21.971

100+ parts

-

1k+ parts

$19.774

10k+ parts

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1,695

$21.971

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$19.774

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MKK Technologies

India . 494 parts In-Stock

1+ parts

$41.316

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494

$41.316

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DigiPath Technology Company

USA . 494 parts In-Stock

1+ parts

$41.316

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494

$41.316

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Microchip USA

USA . 5,407 parts In-Stock

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5,407

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Corphita

USA . 2,414 parts In-Stock

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2,414

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Parana Technologies

USA . 2,312 parts In-Stock

1+ parts

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100+ parts

$26.270

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2,312

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$26.270

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Overview

Unlock unparalleled power efficiency with the PM6670AS from STMicroelectronics! Engineered for automotive excellence, this compact switching regulator delivers unmatched reliability across an impressive temperature range. With its sleek surface-mount design and robust performance, it's ideal for diverse applications, ensuring your projects thrive. Choose STMicroelectronics for quality you can trust, and elevate your designs with the PM6670AS—where innovation meets exceptional value!

Feature Benefit Bullets

Surface Mount: YES

This surface mount capability allows for compact and efficient PCB designs, making it suitable for space-constrained applications.

Package Shape: SQUARE

The square package shape simplifies placement on PCBs and provides consistent thermal performance.

No. of Terminals: 24

With 24 terminals, this product offers versatile connectivity options, enabling integration into complex circuits.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The very thin profile helps reduce the overall height of the assembly, while the heat sink/slug design enhances thermal management.

Maximum Operating Temperature: 125 °C

High temperature tolerance ensures reliable operation in demanding environments, making it a great choice for automotive applications.

Control Mode: VOLTAGE-MODE

Voltage-mode control allows for stable output with improved transient response, which is crucial for sensitive loads.

Minimum Operating Temperature: -40 °C

Operating in extreme cold conditions makes this product suitable for harsh environments and automotive use.

Terminal Position: QUAD

The quad terminal position enhances layout flexibility and reduces parasitic inductance in high-frequency applications.

Maximum Seated Height: 1 mm

A maximum seated height of just 1 mm supports low-profile designs, ideal for modern compact electronic devices.

Width: 4 mm

The narrow width of 4 mm makes it suitable for applications where board space is at a premium.

Other IC Type: SWITCHING CONTROLLER

As a switching controller, this IC provides high efficiency and reduced heat generation, extending the life of your application.

Nominal Input Voltage: 12 V

The nominal input voltage is common for automotive applications, ensuring compatibility with standard systems.

Length: 4 mm

At 4 mm in length, this switching regulator is compact, making it easy to integrate into various designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive environments, this product meets stringent reliability standards, suitable for vehicles.

Maximum Output Current: 3 A

With a maximum output current of 3 A, it can power a wide range of devices, offering flexibility in design.

Terminal Form: NO LEAD

The no-lead terminal form minimizes space and enhances electrical performance, ideal for advanced designs.

Control Technique: PULSE WIDTH MODULATION

Using pulse width modulation provides precise control of output voltage, increasing efficiency and stability.

Switcher Config: PUSH-PULL

The push-pull configuration ensures high efficiency, making it suitable for applications with varying load conditions.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for higher density layouts, accommodating more components in a smaller area.

Minimum Input Voltage: 4.5 V

The low minimum input voltage extends the range of applications this device can support, enhancing flexibility.

Maximum Input Voltage: 36 V

A maximum input voltage of 36 V provides broad compatibility with various power supply voltages in industrial and automotive sectors.

Technical Specifications

Switching Regulators & Controllers PM6670AS attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

36 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

12 V

JESD-30 Code:

S-XQCC-N24

Length:

4 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

3 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4 mm

Trade Compliance

PM6670AS Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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