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M95256-RCS6TP/K

STMicroelectronics

M95256-RCS6TP/K by STMicroelectronics

M95256-RCS6TP/K by STMicroelectronics is a 32Kx8 EEPROM with a synchronous operating mode and SPI serial bus type. It operates b/w 1.8V to 5.5V, supports up to 1M write/erase cycles, and functions in industrial applications with a max temp of 85 °C. Its compact design features an ultra-thin profile for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,208 parts In-Stock

1+ parts

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7,208

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Anansix

USA . 2,430 parts In-Stock

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2,430

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Digiode

USA . 1,911 parts In-Stock

1+ parts

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1,911

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,657 parts In-Stock

1+ parts

$2.386

100+ parts

-

1k+ parts

$2.148

10k+ parts

-

1,657

$2.386

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$2.148

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MKK Technologies

India . 1,107 parts In-Stock

1+ parts

$4.488

100+ parts

-

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1,107

$4.488

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DigiPath Technology Company

USA . 1,107 parts In-Stock

1+ parts

$4.488

100+ parts

-

1k+ parts

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10k+ parts

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1,107

$4.488

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Microchip USA

USA . 438 parts In-Stock

1+ parts

$4.691

100+ parts

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438

$4.691

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AZTECH Wire

Italy . 197 parts In-Stock

1+ parts

$20.940

100+ parts

-

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197

$20.940

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Corphita

USA . 1,495 parts In-Stock

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1,495

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Parana Technologies

USA . 638 parts In-Stock

1+ parts

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100+ parts

$2.853

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638

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$2.853

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Overview

Unlock limitless possibilities with the M95256-RCS6TP/K EEPROM from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This cutting-edge memory chip offers unparalleled reliability and performance, perfect for industrial applications that demand durability and efficiency. With robust write protection and impressive endurance, it ensures your data stays secure, while its compact design fits effortlessly into your projects. Elevate your designs with ST's quality commitment and experience the benefits of enhanced functionality today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the product lightweight and resistant to environmental factors, ensuring durability in various applications.

Surface Mount: YES

Surface mounting allows for easier integration into compact designs, saving board space and improving assembly efficiency.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, making it suitable for high-density applications.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances data transfer rates and overall performance, making it ideal for applications requiring fast access.

Nominal Supply Voltage / Vsup: 5V

The 5V nominal supply voltage is widely compatible with standard logic levels, ensuring versatility in a variety of electronic systems.

Power Supplies: 2/5V

Dual voltage operation (2V/5V) allows for flexibility in different applications and power requirements.

No. of Terminals: 8

An 8-terminal configuration provides sufficient connections for versatile functionality while maintaining a compact footprint.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The very thin profile and fine pitch design are suited for space-constrained applications, optimizing PCB design.

Maximum Operating Temperature: 85 °C

An operating temperature of 85 °C ensures reliability in moderate to high-temperature environments.

Organization: 32KX8

A 32KX8 organization allows for efficient data storage and retrieval, combining adequate capacity with manageable address space.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C makes the product suitable for industrial applications and harsh environments.

Terminal Position: BOTTOM

Bottom terminals facilitate low-profile mounting and thermal management, enhancing device performance.

Write Protection: HARDWARE/SOFTWARE

Dual write protection options ensure data integrity and security, making it ideal for critical applications.

Maximum Seated Height: 0.65 mm

The low seated height helps in achieving compact PCB designs, accommodating modern slim devices.

Maximum Clock Frequency (fCLK): 5 MHz

A maximum clock frequency of 5 MHz allows fast data transfer rates, improving application performance.

Width: 1.785 mm

A narrower width supports tighter layouts in compact electronics, enhancing design flexibility.

Minimum Supply Voltage (Vsup): 1.8 V

A minimum supply voltage of 1.8 V ensures compatibility with low-power applications, optimizing energy efficiency.

Length: 1.97 mm

Compact length facilitates the integration of the EEPROM into small form-factor devices.

Temperature Grade: INDUSTRIAL

Industrial temperature rating guarantees reliability and performance in demanding industrial environments.

Technology: CMOS

CMOS technology ensures low power consumption while maintaining high speeds, providing efficiency in modern applications.

Parallel or Serial: SERIAL

Serial interface reduces pin count and simplifies PCB layouts while maintaining robust communication.

Terminal Form: BALL

Ball terminals provide reliable connections with excellent soldering capabilities, increasing durability.

Maximum Supply Current: 3 mA

Low maximum supply current of 3 mA enhances energy efficiency, making it suitable for battery-powered devices.

No. of Words: 32768 words

With 32,768 words of storage, it offers substantial memory capacity for storing diverse datasets.

Memory Width: 8

An 8-bit memory width allows for efficient data storage and retrieval, catering to various applications.

Minimum Data Retention Time: 40 years

A long data retention time of 40 years ensures reliability in long-term storage applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch enables high-density packaging, ideal for space-constrained designs.

No. of Words Code: 32K

32K word code delivers a good balance between performance and memory capacity for various applications.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to withstand a maximum supply voltage of 5.5 V provides additional tolerance against natural voltage fluctuations.

Endurance: 1,000,000 Write/Erase Cycles

High endurance of 1 million write/erase cycles ensures longevity and reliability in frequent use scenarios.

Serial Bus Type: SPI

SPI interface offers simple and fast communication protocols, facilitating easy integration into various systems.

Maximum Write Cycle Time (tWC): 5 ms

A maximum write cycle time of 5 ms supports efficient data writing processes, important for real-time applications.

Memory Density: 262,144 bit

With a memory density of 262,144 bits, the product meets demanding memory requirements in compact designs.

Memory IC Type: EEPROM

EEPROM technology allows for non-volatile data storage, which retains data without power, essential for numerous applications.

Maximum Standby Current: 0.000003 Amp

Ultra-low standby current minimizes power consumption, making it ideal for battery-operated devices.

Technical Specifications

EEPROM M95256-RCS6TP/K attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

5 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B8

Length:

1.97 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA8,3X5,17/10

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

.65 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000003 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.785 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M95256-RCS6TP/K Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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