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M95080-MN6TP

STMicroelectronics

M95080-MN6TP by STMicroelectronics

M95080-MN6TP by STMicroelectronics is a 1Kx8 EEPROM with a 5 MHz SPI interface, ideal for industrial applications. It operates b/w -40 °C to 85 °C and features hardware/software write protection. With a compact SO8 package, it ensures reliable data retention and endurance of 1M cycles.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,674 parts In-Stock

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6,674

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Anansix

USA . 344 parts In-Stock

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344

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Digiode

USA . 202 parts In-Stock

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202

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 565 parts In-Stock

1+ parts

$2.122

100+ parts

-

1k+ parts

$1.910

10k+ parts

-

565

$2.122

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$1.910

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MKK Technologies

India . 2,082 parts In-Stock

1+ parts

$3.991

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-

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2,082

$3.991

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DigiPath Technology Company

USA . 2,082 parts In-Stock

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$3.991

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2,082

$3.991

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Microchip USA

USA . 324 parts In-Stock

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$10.846

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324

$10.846

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AZTECH Wire

Italy . 65 parts In-Stock

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$18.990

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65

$18.990

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A-Z Elektronik GmbH

Germany . 5,637 parts In-Stock

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5,637

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Alle Elektronik GmbH

Germany . 3,758 parts In-Stock

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3,758

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Infinite Electronics LLP (Excess)

. 2,502 parts In-Stock

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2,502

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Parana Technologies

USA . 2,332 parts In-Stock

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$2.538

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2,332

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$2.538

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Corphita

USA . 1,958 parts In-Stock

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1,958

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Kepictronics

USA . 536 parts In-Stock

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536

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Overview

Unlock exceptional reliability and performance with the M95080-MN6TP EEPROM from STMicroelectronics. Renowned for its commitment to quality, STMicroelectronics delivers this compact memory solution designed for industrial applications that demand durability and efficiency. With features like hardware/software write protection and impressive endurance, it ensures your data remains secure while maximizing operational efficiency. Trust in ST's legacy as a leader in innovation to elevate your next electronic project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material offers protection against environmental factors, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for compact design and easier PCB assembly, saving space in electronic applications.

Package Shape: RECTANGULAR

Rectangular package shape fits well into standard PCB layouts, enhancing design flexibility.

Operating Mode: SYNCHRONOUS

Synchronous operation provides efficient data transfer and lower power consumption, optimized for performance.

Nominal Supply Voltage / Vsup: 5V

The standard 5V supply voltage is widely available and makes interfacing with existing systems straightforward.

Power Supplies (V): 5

Consistency in power supply requirements simplifies system design and reduces component selection complexity.

No. of Terminals: 8

With 8 terminals, the device allows for sufficient connectivity for essential communication functions while maintaining compactness.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces board space and is ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

Operating at up to 85 °C makes it suitable for industrial applications that require operation in higher temperature conditions.

Organization: 1KX8

The organization of 1Kx8 allows for structured data storage, making it easier to access and manage the data.

Minimum Operating Temperature: -40 °C

A low minimum temperature rating enables deployment in harsh environments, ensuring reliability across diverse conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish guarantees good solderability and enhanced corrosion resistance for improved longevity.

Terminal Position: DUAL

Dual terminal positioning offers greater layout flexibility and simplifies PCB design.

Write Protection: HARDWARE/SOFTWARE

The availability of both hardware and software write protection helps maintain data integrity and security against unintended writes.

Maximum Seated Height: 1.75 mm

A low seated height is advantageous for designs requiring low-profile components, fitting seamlessly into compact form factors.

Maximum Clock Frequency (fCLK): 5 MHz

A maximum clock frequency of 5 MHz ensures fast data processing, essential for time-sensitive applications.

Width: 3.9 mm

Narrow width contributes to space-efficient designs, optimizing layout options on the PCB.

Minimum Supply Voltage (Vsup): 4.5V

The ability to operate at a minimum voltage of 4.5V helps accommodate a wider range of power sources.

Length: 4.9 mm

Compact length aids in efficient space utilization on printed circuit boards, making it ideal for small devices.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures the device performs reliably in demanding and variable environments.

Technology: CMOS

CMOS technology enables low power consumption, making it suitable for battery-operated devices.

Parallel or Serial: SERIAL

Using serial communication simplifies connections and is usually sufficient for most applications, reducing complexity.

Terminal Form: GULL WING

Gull wing terminals provide easy handling during assembly and reliable solder joint strength.

Maximum Supply Current: 5 mA

Low supply current minimizes power consumption, extending battery life in portable applications.

No. of Words: 1024 words

A capacity of 1024 words meets the moderate storage needs of various consumer and industrial applications.

Memory Width: 8

An 8-bit memory width aligns with common data sizes, facilitating integration in standard digital systems.

Minimum Data Retention Time: 40 years

A data retention time of 40 years guarantees reliability for long-term data storage without risk of loss.

Terminal Pitch: 1.27 mm

A 1.27 mm pitch allows compatibility with a broader range of PCB designs, enhancing versatility.

No. of Words Code: 1K

A code of 1K confirms sufficient capacity for many embedded applications, supporting a variety of use cases.

Maximum Supply Voltage (Vsup): 5.5V

The ability to handle varying voltages up to 5.5V provides flexibility in power supply options.

Endurance: 1,000,000 Write/Erase Cycles

An endurance of 1 million write/erase cycles ensures the product is suitable for applications with frequent data updates.

Serial Bus Type: SPI

Support for the SPI serial bus type offers high-speed communication, making it ideal for performance-critical applications.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time of 5 ms enhances overall system performance by reducing latency during data updates.

Memory Density: 8192 bit

With a density of 8192 bits, it provides a solid balance of storage capacity for various applications.

Memory IC Type: EEPROM

As an EEPROM, it allows data retention without power, making it perfect for storing configuration settings and essential data.

Maximum Standby Current: 0.000002 Amp

Ultra-low standby current ensures minimal power drain when the device is inactive, enhancing energy efficiency.

Technical Specifications

EEPROM M95080-MN6TP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

5 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M95080-MN6TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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