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M95080-MN6P

STMicroelectronics

M95080-MN6P by STMicroelectronics

M95080-MN6P by STMicroelectronics is a 1Kx8 EEPROM with a 5 MHz SPI interface, ideal for industrial applications. It operates b/w -40 °C to 85 °C and features hardware/software write protection. With a compact SOIC-8 package, it ensures efficient space utilization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,240 parts In-Stock

1+ parts

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1k+ parts

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5,240

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Digiode

USA . 4,655 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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4,655

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Anansix

USA . 2,462 parts In-Stock

1+ parts

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10k+ parts

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2,462

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,019 parts In-Stock

1+ parts

$5.317

100+ parts

-

1k+ parts

$4.785

10k+ parts

-

2,019

$5.317

-

$4.785

-

MKK Technologies

India . 519 parts In-Stock

1+ parts

$9.998

100+ parts

-

1k+ parts

-

10k+ parts

-

519

$9.998

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DigiPath Technology Company

USA . 519 parts In-Stock

1+ parts

$9.998

100+ parts

-

1k+ parts

-

10k+ parts

-

519

$9.998

-

-

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Microchip USA

USA . 214 parts In-Stock

1+ parts

$11.420

100+ parts

-

1k+ parts

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10k+ parts

-

214

$11.420

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AZTECH Wire

Italy . 595 parts In-Stock

1+ parts

$15.700

100+ parts

-

1k+ parts

-

10k+ parts

-

595

$15.700

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-

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Component Stockers USA

USA . 450 parts In-Stock

1+ parts

$99.990

100+ parts

-

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450

$99.990

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Parana Technologies

USA . 567 parts In-Stock

1+ parts

-

100+ parts

$6.357

1k+ parts

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10k+ parts

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567

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$6.357

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Corphita

USA . 475 parts In-Stock

1+ parts

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475

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Overview

Unlock exceptional performance with the M95080-MN6P EEPROM from STMicroelectronics, a trusted leader in semiconductor solutions. Designed for reliability in industrial applications, this surface-mount memory delivers swift, synchronous operation while ensuring robust data retention. With superior write protection features and an impressive endurance of up to 1 million cycles, it’s perfect for everything from automotive systems to smart appliances. Elevate your projects with proven quality and unmatched value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection from environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on PCB, making the product ideal for compact electronic designs.

Package Shape: RECTANGULAR

The rectangular shape is conducive to efficient space management on circuit boards.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances data transfer rates, providing faster performance and improved efficiency.

Nominal Supply Voltage / Vsup: 5 V

Operates at a standard supply voltage, ideal for compatibility with most electronic systems.

Power Supplies (V): 5

Designed for 5V systems, ensuring easy integration into existing designs without the need for additional voltage converters.

No. of Terminals: 8

The 8-terminal configuration supports a variety of connection options while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package is suited for applications with limited space, making it versatile for many designs.

Maximum Operating Temperature: 85 °C

The ability to operate at elevated temperatures ensures reliability in challenging environments.

Organization: 1KX8

This memory organization provides 1024 words of storage with an 8-bit width, making it suitable for various data storage applications.

Minimum Operating Temperature: -40 °C

This temperature range allows the product to be used in industrial applications vulnerable to extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent conductivity and corrosion resistance, extending the lifespan of the component.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in PCB layout and design.

Write Protection: HARDWARE/SOFTWARE

The dual write protection mechanisms enhance data integrity and security, making it ideal for critical applications.

Maximum Seated Height: 1.75 mm

A low seated height contributes to a low-profile design, essential for modern compact electronics.

Maximum Clock Frequency (fCLK): 5 MHz

A 5 MHz clock frequency allows for quick data transactions, improving overall system performance.

Width: 3.9 mm

Compact width allows for space-efficient PCB design, accommodating other components easily.

Minimum Supply Voltage (Vsup): 4.5 V

Operates effectively at a minimum voltage as low as 4.5V, supporting a range of power supply configurations.

Length: 4.9 mm

The short length further enhances space conservation in electronic circuit designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and performance under harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high density, making it efficient for various applications.

Parallel or Serial: SERIAL

Serial communication simplifies design and reduces pin count, providing versatility in system integration.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and better mechanical stability on the PCB.

Maximum Supply Current: 5 mA

Low power requirements reduce overall system power consumption, making the device energy efficient.

No. of Words: 1024 words

This capacity accommodates a variety of data storage needs, making it suitable for applications requiring moderate data retention.

Memory Width: 8

An 8-bit memory width allows straightforward integration for standard data processing applications.

Minimum Data Retention Time: 40 years

Long data retention guarantees reliability and longevity of data storage, vital for critical applications.

Terminal Pitch: 1.27 mm

A common terminal pitch makes it compatible with a wide range of PCB layouts.

No. of Words Code: 1K

The 1K word code signifies a balance between storage capacity and ease of use for various applications.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a higher maximum supply voltage, allowing for a wider range of applications and system designs.

Endurance: 1000000 Write/Erase Cycles

High endurance ensures that the EEPROM can handle extensive rewriting, ideal for applications that involve frequent data updates.

Serial Bus Type: SPI

Utilizing SPI for communication allows for fast interface speeds and easy integration with microcontrollers.

Maximum Write Cycle Time (tWC): 5 ms

Short write cycle time leads to better performance in data-intensive applications, reducing system latency.

Memory Density: 8192 bit

This memory density provides a compact solution for applications needing moderate amounts of data storage.

Memory IC Type: EEPROM

As an EEPROM, it offers non-volatile memory storage, retaining data even when power is lost.

Maximum Standby Current: 0.000002 Amp

Ultra-low standby current consumption enhances energy efficiency, making it suitable for battery-powered applications.

Technical Specifications

EEPROM M95080-MN6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

5 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M95080-MN6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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