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M93C86-RDW3TP/K

STMicroelectronics

M93C86-RDW3TP/K by STMicroelectronics

M93C86-RDW3TP/K by STMicroelectronics is a 16-bit EEPROM with a 1Kx16 organization, operating b/w -40 °C to 125 °C. It features a synchronous mode with a max clock frequency of 2 MHz and supports automotive applications. Its compact design ensures efficient surface mounting in space-constrained environments.

Median Price

$0.594

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,900 parts In-Stock

1+ parts

$0.478

100+ parts

-

1k+ parts

-

10k+ parts

-

2,900

$0.478

-

-

-

Mouser Electronics

USA . 101 parts In-Stock

1+ parts

$0.710

100+ parts

-

1k+ parts

$0.566

10k+ parts

$0.544

101

$0.710

-

$0.566

$0.544

Chip1Stop

Japan . 2,900 parts In-Stock

1+ parts

$0.936

100+ parts

-

1k+ parts

-

10k+ parts

-

2,900

$0.936

-

-

-

Avnet

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Verical

USA . 2,900 parts In-Stock

1+ parts

-

100+ parts

$0.478

1k+ parts

-

10k+ parts

-

2,900

-

$0.478

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,986 parts In-Stock

1+ parts

$0.447

100+ parts

-

1k+ parts

-

10k+ parts

-

2,986

$0.447

-

-

-

Bristol Electronics

USA . 3,820 parts In-Stock

1+ parts

$1.313

100+ parts

$0.486

1k+ parts

$0.341

10k+ parts

-

3,820

$1.313

$0.486

$0.341

-

Vyrian

USA . 9,136 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,136

-

-

-

-

IBS Electronics

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.484

8,000

-

-

-

$0.484

ACDS - Activité Composants Distribution Service

France . 3,820 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,820

-

-

-

-

Dan-Mar Components

USA . 3,820 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,820

-

-

-

-

Anansix

USA . 2,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,800

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,079 parts In-Stock

1+ parts

$0.424

100+ parts

-

1k+ parts

-

10k+ parts

-

2,079

$0.424

-

-

-

Component Stockers USA

USA . 6,910 parts In-Stock

1+ parts

$0.470

100+ parts

$0.470

1k+ parts

$0.470

10k+ parts

-

6,910

$0.470

$0.470

$0.470

-

Microchip USA

USA . 6,332 parts In-Stock

1+ parts

$3.071

100+ parts

-

1k+ parts

-

10k+ parts

-

6,332

$3.071

-

-

-

IDEA Electronic Components Group

UK . 674 parts In-Stock

1+ parts

$5.260

100+ parts

-

1k+ parts

$4.734

10k+ parts

-

674

$5.260

-

$4.734

-

MKK Technologies

India . 154 parts In-Stock

1+ parts

$9.890

100+ parts

-

1k+ parts

-

10k+ parts

-

154

$9.890

-

-

-

DigiPath Technology Company

USA . 154 parts In-Stock

1+ parts

$9.890

100+ parts

-

1k+ parts

-

10k+ parts

-

154

$9.890

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Parana Technologies

USA . 580 parts In-Stock

1+ parts

-

100+ parts

$6.289

1k+ parts

-

10k+ parts

-

580

-

$6.289

-

-

Overview

Unlock superior data management with the M93C86-RDW3TP/K EEPROM from STMicroelectronics, a leader in innovative solutions. Engineered for automotive excellence and designed to thrive under extreme conditions, this reliable memory chip offers exceptional performance in critical applications. With its compact size and robust reliability, it ensures seamless operation while providing unmatched value, making it the ideal choice for your next project. Experience quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable material enhances the product's reliability and thermal performance.

Surface Mount: YES

The surface mount design allows for easier integration into compact circuit boards, saving space in applications.

Screening Level: AEC-Q100

Meets automotive industry standards, ensuring high reliability for automotive applications.

Package Shape: RECTANGULAR

Rectangular shape optimizes space usage on PCB and facilitates efficient layouts.

Operating Mode: SYNCHRONOUS

Provides high-speed performance, ideal for applications that require fast data access.

Nominal Supply Voltage / Vsup: 2.5 V

Operates at a low voltage, contributing to energy efficiency and lower power consumption.

No. of Terminals: 8

Compact terminal design supports multiple functionalities while conserving board real estate.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Thin profile enables use in space-constrained applications without sacrificing performance.

Alternate Memory Width: 8

Supports versatile applications requiring different memory widths, enhancing compatibility.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliability in extreme conditions found in automotive environments.

Organization: 1KX16

Allows flexibility in data organization, catering to a variety of applications.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures operation in harsh environmental conditions, making it suitable for outdoor use.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and enhances solderability for reliable connections.

Terminal Position: DUAL

Dual terminal position supports more robust connections and efficient assembly.

Maximum Seated Height: 1.2 mm

Low profile allows for reduced overall device height, critical for space-limited designs.

Maximum Clock Frequency (fCLK): 2 MHz

Support for a maximum clock frequency of 2 MHz enables fast data processing for demanding applications.

Width: 3 mm

Compact width ensures compatibility with tight design requirements in various electronic devices.

Minimum Supply Voltage (Vsup): 1.8 V

Low minimum supply voltage further enhances energy efficiency, crucial for battery-powered devices.

Maximum Time At Peak Reflow Temperature: 30 s

Extended time at peak reflow allows for compatibility with common soldering processes.

Peak Reflow Temperature: 260 °C

High reflow temperature tolerance ensures durability during assembly processes, enhancing reliability.

Length: 4.4 mm

Compact length allows for flexibility in PCB design without compromising on performance.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring high performance and reliability in vehicles.

Technology: CMOS

Low power consumption technology enhances battery life in portable applications.

Parallel or Serial: SERIAL

Serial communication provides simpler and more efficient wiring solutions for modern electronics.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and surface mounting, improving manufacturability.

No. of Words: 1024 words

Adequate capacity for many applications, from configuration storage to small data logging.

Memory Width: 16

16-bit memory width allows for efficient data handling in a wide range of applications.

Terminal Pitch: 0.65 mm

Narrow terminal pitch allows for more compact designs, fitting more functionality into smaller areas.

No. of Words Code: 1K

Provides sufficient addressable memory for many embedded systems applications.

Maximum Supply Voltage (Vsup): 5.5 V

Flexibility in supply voltage accommodates various system design requirements.

Serial Bus Type: MICROWIRE

The Microwire serial bus simplifies communication protocols and reduces design complexity.

Maximum Write Cycle Time (tWC): 4 ms

Quick write cycle times make it suitable for real-time data logging and frequent updates.

Memory Density: 16384 bit

High density allows for extensive data storage in compact applications, ideal for advanced electronics.

Memory IC Type: EEPROM

Non-volatile memory type retains data even when power is off, ensuring reliability for critical data storage.

Technical Specifications

EEPROM M93C86-RDW3TP/K attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

2 MHz

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Serial Bus Type:

MICROWIRE

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Maximum Write Cycle Time (tWC):

4 ms

Trade Compliance

M93C86-RDW3TP/K Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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