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M93C76-MN6P

STMicroelectronics

M93C76-MN6P by STMicroelectronics

M93C76-MN6P by STMicroelectronics is a 512x16 EEPROM with a 5V supply, ideal for industrial applications. It features software write protection, operates at up to 2 MHz, and endures 1M write/erase cycles. Its compact SO8 package ensures efficient space utilization.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,500 parts In-Stock

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8,500

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Anansix

USA . 2,802 parts In-Stock

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2,802

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Digiode

USA . 768 parts In-Stock

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768

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PC Components Company LLC

USA . 50 parts In-Stock

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50

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Bristol Electronics

USA . 50 parts In-Stock

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50

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 69 parts In-Stock

1+ parts

$3.583

100+ parts

-

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$3.225

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69

$3.583

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$3.225

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MKK Technologies

India . 820 parts In-Stock

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$6.738

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820

$6.738

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DigiPath Technology Company

USA . 820 parts In-Stock

1+ parts

$6.738

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820

$6.738

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AZTECH Wire

Italy . 213 parts In-Stock

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$16.610

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213

$16.610

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Microchip USA

USA . 203 parts In-Stock

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$54.721

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203

$54.721

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QUARKTWIN TECHNOLOGY LTD

USA . 5,831 parts In-Stock

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5,831

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Corphita

USA . 4,972 parts In-Stock

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4,972

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Parana Technologies

USA . 1,306 parts In-Stock

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$4.284

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$4.284

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Kepictronics

USA . 303 parts In-Stock

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Overview

Unlock limitless possibilities with the M93C76-MN6P EEPROM from STMicroelectronics, renowned for its commitment to quality and innovation. This compact, reliable memory solution excels in industrial applications, ensuring data integrity even in extreme conditions. With features like software write protection and high endurance, it empowers designers to create robust systems while benefiting from ST's proven expertise and support. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures reliability and longevity in various environmental conditions.

Surface Mount: YES

Facilitates compact design and makes integration into modern circuit boards easier.

Package Shape: RECTANGULAR

Standard rectangular shape allows for efficient use of board space.

Operating Mode: SYNCHRONOUS

Provides higher speed data transfer while ensuring data integrity.

Nominal Supply Voltage / Vsup (V): 5

Common voltage level simplifies compatibility with existing systems.

Power Supplies (V): 5

Single supply operation keeps design straightforward and cost-effective.

No. of Terminals: 8

Compact 8-terminal design aids in easier soldering and reduces board space usage.

Package Style (Meter): SMALL OUTLINE

Slim profile is suitable for space-constrained applications.

Alternate Memory Width: 8

Flexible memory width accommodates different data size requirements.

Maximum Operating Temperature: 85 °C

High temperature tolerance makes it suitable for industrial applications.

Organization: 512X16

Versatile data organization supports a wide range of applications.

Minimum Operating Temperature: -40 °C

Wide temperature range allows operation in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality finish enhances conductivity and prevents oxidation.

Terminal Position: DUAL

Dual terminal positioning facilitates easier mounting and assembly.

Write Protection: SOFTWARE

Software-based write protection adds a layer of security for data integrity.

Maximum Seated Height: 1.75 mm

Low height profile is ideal for designs with tight space constraints.

Maximum Clock Frequency (fCLK): 2 MHz

High clock frequency allows for faster data read and write operations.

Width: 3.9 mm

Narrow width enables efficient board layout and component density.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum voltage enhances flexibility in power supply designs.

Length: 4.9 mm

Compact length aids in fitting into tight spaces within device designs.

Temperature Grade: INDUSTRIAL

Meets industrial-grade specifications ensuring reliability in demanding applications.

Technology: CMOS

CMOS technology provides low power consumption and high integration density.

Parallel or Serial: SERIAL

Serial interface simplifies design while reducing pin count.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and ease of assembly.

Maximum Supply Current: 1.5 mA

Low current draw makes it energy-efficient for battery-operated devices.

No. of Words: 512 words

Adequate word count for many applications, making it versatile.

Memory Width: 16

A wide memory width supports complex data handling.

Minimum Data Retention Time: 40 years

Long data retention period ensures reliability for long-term storage applications.

Terminal Pitch: 1.27 mm

Standard pitch improves compatibility with various PCB layouts.

No. of Words Code: 512

Consistent coding allows for straightforward integration into existing systems.

Maximum Supply Voltage (Vsup): 5.5 V

Generous maximum voltage ensures compatibility with different power supply designs.

Endurance: 1000000 Write/Erase Cycles

High endurance rating supports intensive write cycles, ideal for data logging applications.

Serial Bus Type: MICROWIRE

MICROWIRE bus type offers a simple interface for communication with microcontrollers.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time enhances performance in dynamic data environments.

Memory Density: 8192 bit

Adequate memory density supports diverse applications ranging from simple to complex.

Memory IC Type: EEPROM

EEPROM technology allows for non-volatile data storage, perfect for applications requiring data retention.

Maximum Standby Current: 0.00005 Amp

Extremely low standby current contributes to overall energy efficiency.

Technical Specifications

EEPROM M93C76-MN6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.00005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

1.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

SOFTWARE

Trade Compliance

M93C76-MN6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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