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M93C56-WBN6P

STMicroelectronics

M93C56-WBN6P by STMicroelectronics

M93C56-WBN6P from STMicroelectronics is a 2048-bit EEPROM with a synchronous operating mode and a max clock frequency of 2 MHz. It operates b/w 2.5V to 5.5V, ensuring reliability in industrial applications with -40 °C to 85°C temp range. With software write protection and endurance of 1M cycles, it's ideal for data storage solutions.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 5,839 parts In-Stock

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Anansix

USA . 2,765 parts In-Stock

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2,765

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Digiode

USA . 2,164 parts In-Stock

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2,164

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IDEA Electronic Components Group

UK . 248 parts In-Stock

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$2.638

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-

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$2.374

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248

$2.638

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$2.374

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MKK Technologies

India . 151 parts In-Stock

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$4.960

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$4.960

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DigiPath Technology Company

USA . 151 parts In-Stock

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$4.960

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151

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Microchip USA

USA . 452 parts In-Stock

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$6.400

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452

$6.400

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AZTECH Wire

Italy . 592 parts In-Stock

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$10.080

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592

$10.080

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Component Stockers USA

USA . 582 parts In-Stock

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$99.990

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 8,164 parts In-Stock

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Corphita

USA . 2,987 parts In-Stock

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Parana Technologies

USA . 615 parts In-Stock

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$3.154

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Overview

Unlock the potential of your designs with the M93C56-WBN6P EEPROM from STMicroelectronics. Renowned for quality and innovation, STMicro delivers a versatile solution perfect for industrial applications. With its robust temperature range and impressive write endurance, this memory chip ensures reliability in demanding environments. Experience seamless integration and enhanced performance, empowering you to create cutting-edge products that stand the test of time. Choose excellence—choose STMicro!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making this EEPROM suitable for industrial applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space, facilitating easier integration into various designs.

Operating Mode: SYNCHRONOUS

Synchronous operation provides faster data transfer rates compared to asynchronous modes, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V is common in many applications, making this EEPROM easy to integrate with standard power supplies.

Power Supplies (V): 3/5

Flexible voltage options (3V or 5V) allow for versatility in various circuit designs, accommodating a wider range of applications.

No. of Terminals: 8

Eight terminals facilitate multiple connections while maintaining a compact form factor, making it suitable for space-constrained applications.

Package Style (Meter): IN-LINE

In-line package style enhances the ease of board layout and assembly processes.

Alternate Memory Width: 8

An alternate memory width of 8 bits increases compatibility with systems utilizing 8-bit data paths.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature rating makes this EEPROM suitable for use in demanding environments.

Organization: 128X16

The organization of 128X16 allows for efficient data storage and retrieval, optimizing memory usage.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this EEPROM is ideal for extreme environmental conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish improves solderability and reliability over time, reducing the risk of connection failures.

Terminal Position: DUAL

Dual terminal positions allow for versatile mounting options in various electronic designs.

Write Protection: SOFTWARE

Software write protection enhances data security by allowing users to prevent accidental writes, safeguarding critical data.

Maximum Seated Height: 5.33 mm

A maximum seated height of 5.33 mm ensures compatibility with shallow mounting spaces.

Maximum Clock Frequency (fCLK): 2 MHz

A maximum clock frequency of 2 MHz supports high-speed data access, improving overall performance in time-sensitive applications.

Width: 7.62 mm

The width of 7.62 mm strikes a good balance between compactness and ease of handling.

Minimum Supply Voltage (Vsup): 2.5 V

A low minimum supply voltage of 2.5V makes this EEPROM suitable for battery-operated devices, extending battery life.

Length: 9.27 mm

The length of 9.27 mm allows for optimized use of space on circuit boards.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability and performance in industrial applications, even under challenging conditions.

Technology: CMOS

CMOS technology provides low power consumption and high speed, making it suitable for modern, energy-efficient designs.

Parallel or Serial: SERIAL

The serial interface simplifies connections and allows for reduced pin counts, which is advantageous in compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide sturdy connections and are preferred for durability in harsh environments.

Maximum Supply Current: 2 mA

Low supply current consumption (2 mA) contributes to energy efficiency, making it ideal for battery-powered applications.

No. of Words: 128 words

A word capacity of 128 allows for storing essential data in space-constrained designs without sacrificing performance.

Memory Width: 16

With a memory width of 16, this EEPROM can efficiently handle larger data sets, improving data processing capabilities.

Minimum Data Retention Time: 40

A minimum data retention time of 40 years ensures that data remains intact for extended periods, enhancing reliability.

Terminal Pitch: 2.54 mm

A standard terminal pitch (2.54 mm) supports compatibility with various PCB designs and simplifies assembly.

No. of Words Code: 128

Providing 128 words makes this EEPROM suitable for applications that require moderate data storage without overwhelming complexity.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V allows flexibility in supply design while ensuring safe operation.

Endurance: 1000000 Write/Erase Cycles

An endurance rating of 1,000,000 write/erase cycles ensures longevity and reliability for data-intensive applications.

Maximum Write Cycle Time (tWC): 5 ms

A maximum write cycle time of 5 ms supports rapid data updates, making it suitable for real-time applications.

Memory Density: 2048 bit

With a memory density of 2048 bits, this EEPROM provides an efficient solution for compact data storage needs.

Memory IC Type: EEPROM

As an EEPROM, this IC enables non-volatile data storage, maintaining data integrity even when powered off.

Maximum Standby Current: 0.000005 Amp

A minimal maximum standby current greatly enhances energy efficiency, making it an excellent choice for low-power applications.

Technical Specifications

EEPROM M93C56-WBN6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.27 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

SOFTWARE

Trade Compliance

M93C56-WBN6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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