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M74HC595TTR

STMicroelectronics

M74HC595TTR by STMicroelectronics

M74HC595TTR by STMicroelectronics is an 8-bit digital shift register with a 190 ns propagation delay and operates b/w 2-6 V. It features a compact SOIC package, ideal for space-constrained applications. This CMOS device supports true output polarity and is suitable for military-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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PC Components Company LLC

USA . 7,895 parts In-Stock

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Bristol Electronics

USA . 7,775 parts In-Stock

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Vyrian

USA . 5,311 parts In-Stock

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Digiode

USA . 3,245 parts In-Stock

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Q Components

USA . 2,500 parts In-Stock

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Anansix

USA . 1,611 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1,475 parts In-Stock

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Connector Distribution Corp

USA . 450 parts In-Stock

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450

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Right Parts Inc.

USA . 450 parts In-Stock

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450

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ComSIT Distribution GmbH

Germany . 122 parts In-Stock

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Semi Source

USA . 10 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 214 parts In-Stock

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$3.266

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AZTECH Wire

Italy . 336 parts In-Stock

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$8.010

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IDEA Electronic Components Group

UK . 2,367 parts In-Stock

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MKK Technologies

India . 1,849 parts In-Stock

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DigiPath Technology Company

USA . 1,849 parts In-Stock

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Perfect Parts

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Assy Fe

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,740 parts In-Stock

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Infinite Electronics LLP (Excess)

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Parana Technologies

USA . 1,480 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,160 parts In-Stock

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Corphita

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Kepictronics

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Overview

Unlock the potential of your digital designs with the M74HC595TTR from STMicroelectronics. Renowned for their superior quality and reliability, STMicroelectronics delivers this 8-bit shift register, perfect for applications ranging from consumer electronics to industrial automation. Experience seamless data handling with lower power consumption and enhanced performance. Elevate your projects with a component that offers outstanding durability and efficiency, ensuring you stay ahead in today’s competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly processes, particularly in high-density applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCBs, allowing compact designs while maintaining functionality.

No. of Bits: 8

An 8-bit configuration allows for versatile applications in digital systems, enabling a wide range of data processing.

Nominal Supply Voltage / Vsup: 4.5 V

Operating at a nominal supply voltage enhances compatibility with standard digital circuits, providing reliability.

Power Supplies (V): 2/6

Supports a range of supply voltages, making it adaptable for various applications and increasing its usability.

No. of Terminals: 16

A higher number of terminals allows for more connections, facilitating complex circuit integrations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile save board space and are ideal for portable and space-constrained designs.

Propagation Delay (tpd): 190 ns

A low propagation delay ensures fast signal processing, making it suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

The high temperature rating increases reliability and performance in demanding environments.

Output Characteristics: 3-STATE

3-state output features allow for flexibility in design, enabling shared bus systems without interference.

Trigger Type: POSITIVE EDGE

Positive edge triggering enhances synchronization in digital circuits, facilitating reliable operation.

Minimum Operating Temperature: -55 °C

Extreme low-temperature performance ensures functionality in harsh environments, suitable for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish improves corrosion resistance and ensures reliable electrical connections.

Terminal Position: DUAL

Dual position allows for flexibility in PCB layout, accommodating various design requirements.

Maximum Seated Height: 1.2 mm

A low seated height is beneficial for compact designs, contributing to overall design efficiency.

Width: 4.4 mm

A narrow width allows for more efficient use of space on the PCB, improving layout options.

Output Polarity: TRUE

True output polarity simplifies integration in standard logic levels, enhancing compatibility.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at low voltages increases energy efficiency, making it suitable for battery-powered devices.

Maximum Time At Peak Reflow Temperature: 40 s

A reasonable peak reflow time ensures compatibility with common soldering processes, aiding in manufacturing.

Peak Reflow Temperature: 260 °C

Sustaining high reflow temperatures ensures reliability during assembly, making it suitable for commercial production.

Length: 5 mm

Compact length aids in the miniaturization of electronic devices, supporting modern design trends.

Temperature Grade: MILITARY

Military-grade products ensure toughness and reliability even in the most challenging applications.

Maximum Frequency At Nominal Supply: 4800000 Hz

High maximum frequency capability makes it suitable for fast data applications, improving performance in demanding tasks.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it efficient for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly, improving the overall manufacturing process.

Terminal Pitch: 0.65 mm

A fine terminal pitch allows for compact design, essential for high-density circuit layouts.

Count Direction: RIGHT

A defined count direction enhances usability for specific applications, ensuring accurate data processing.

Minimum fmax: 24 MHz

Supporting operational frequencies as low as 24 MHz ensures versatility across different applications.

Maximum Supply Voltage (Vsup): 6 V

The capability to operate at a maximum supply voltage of 6 V provides flexibility in various power supply scenarios.

Technical Specifications

Digital Shift Registers M74HC595TTR attributes and parameters. Explore more Digital Shift Registers devices from STMicroelectronics

Specs

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

4800000 Hz

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

190 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

24 MHz

Trade Compliance

M74HC595TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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