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M74HC165TTR

STMicroelectronics

M74HC165TTR by STMicroelectronics

M74HC165TTR by STMicroelectronics is an 8-bit digital shift register with a propagation delay of 225 ns. It operates at a max frequency of 30 MHz and has a supply voltage range of 2-6 V. Ideal for military-grade applications, this CMOS technology-based IC features positive edge trigger and complementary output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,590 parts In-Stock

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11,590

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Digiode

USA . 2,431 parts In-Stock

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2,431

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Anansix

USA . 2,229 parts In-Stock

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2,229

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Distributors (Availability)

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Microchip USA

USA . 239 parts In-Stock

1+ parts

$13.869

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239

$13.869

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AZTECH Wire

Italy . 1,068 parts In-Stock

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$18.630

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1,068

$18.630

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$27.024

100+ parts

$24.592

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$22.160

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5,000

$27.024

$24.592

$22.160

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IDEA Electronic Components Group

UK . 1,744 parts In-Stock

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$28.485

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$25.637

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1,744

$28.485

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$25.637

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MKK Technologies

India . 463 parts In-Stock

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$53.564

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463

$53.564

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DigiPath Technology Company

USA . 463 parts In-Stock

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$53.564

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463

$53.564

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Component Stockers USA

USA . 206 parts In-Stock

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$99.990

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Perfect Parts

USA . 64,790 parts In-Stock

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64,790

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RC Electronics

USA . 21,900 parts In-Stock

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Kepictronics

USA . 5,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,250 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,500 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Corphita

USA . 728 parts In-Stock

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Parana Technologies

USA . 667 parts In-Stock

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$34.058

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667

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$34.058

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Overview

Unleash the power of innovation with the M74HC165TTR by STMicroelectronics. Crafted with precision and expertise, this digital shift register offers unparalleled quality and reliability. Ideal for a wide range of applications, this product is designed to enhance efficiency and performance. With a compact package body and advanced technology, it delivers exceptional value to customers seeking top-notch solutions. Elevate your projects with the M74HC165TTR and experience the difference that excellence makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package body material offers durability and protection for the internal components of the shift register.

Surface Mount: YES

Being surface mountable makes installation and soldering of the shift register onto PCBs easier and more efficient.

No. of Bits: 8

8 bits allows for a wide range of data storage and manipulation capabilities.

Nominal Supply Voltage / Vsup (V): 4.5

Low nominal supply voltage of 4.5V offers energy efficiency and compatibility with a variety of power sources.

Propagation Delay (tpd): 225 ns

Low propagation delay of 225 ns ensures fast and efficient data transfer within the shift register.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125 °C allows the shift register to operate in a wide range of environmental conditions.

Trigger Type: POSITIVE EDGE

Positive edge trigger type ensures precise data capturing and processing at the rising edge of input signals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the shift register reliable and efficient.

Technical Specifications

Digital Shift Registers M74HC165TTR attributes and parameters. Explore more Digital Shift Registers devices from STMicroelectronics

Specs

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

30000000 Hz

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

28 MHz

Trade Compliance

M74HC165TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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