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M74HC165RM13TR

STMicroelectronics

M74HC165RM13TR by STMicroelectronics

M74HC165RM13TR by STMicroelectronics is an 8-bit digital shift register with a propagation delay of 225 ns and a max frequency of 30 MHz. It operates at a supply voltage range of 2-6V, making it suitable for military-grade applications requiring fast data transfer and low power consumption. This surface-mount device in a small outline package is ideal for systems where compact size and high-speed performance are essential.

Median Price

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Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

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ComSIT Distribution GmbH

Germany . 12,684 parts In-Stock

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R&J Components

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MISTER SPROCKETS

USA . 5,170 parts In-Stock

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PC Components Company LLC

USA . 4,823 parts In-Stock

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Bristol Electronics

USA . 4,773 parts In-Stock

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Vyrian

USA . 4,462 parts In-Stock

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Digiode

USA . 3,864 parts In-Stock

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Microfarads

USA . 3,114 parts In-Stock

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Velocity Electronics

USA . 2,490 parts In-Stock

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Atlantic Semiconductor

USA . 2,412 parts In-Stock

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Ashlea Components Ltd

UK . 2,086 parts In-Stock

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Anansix

USA . 638 parts In-Stock

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Dan-Mar Components

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A2Z Electronics, Inc.

USA . 75 parts In-Stock

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Microchip USA

USA . 140 parts In-Stock

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$4.025

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Advanced Electronics

New Zealand . 60 parts In-Stock

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$13.451

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$12.240

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$11.030

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IDEA Electronic Components Group

UK . 1,053 parts In-Stock

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$14.918

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$13.426

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AZTECH Wire

Italy . 333 parts In-Stock

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$21.160

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MKK Technologies

India . 986 parts In-Stock

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DigiPath Technology Company

USA . 986 parts In-Stock

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Perfect Parts

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GreenTree Electronics

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Alle Elektronik GmbH

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Cyclops Electronics Ltd (Excess)

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Corphita

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Authorized Procurement Solutions

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Parana Technologies

USA . 509 parts In-Stock

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Overview

Discover the power of seamless data transfer with the M74HC165RM13TR digital shift register by STMicroelectronics. Crafted with precision and expertise, this innovative product offers unparalleled performance and reliability in various applications. With a compact design and advanced technology, this shift register provides customers with value-added benefits such as efficient operation, fast data processing, and high-speed performance. Trust STMicroelectronics to deliver superior quality and unmatched advantages for your digital shift register needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly.

No. of Bits: 8

This product has 8 bits, making it suitable for applications requiring a moderate amount of data storage.

Propagation Delay (tpd): 225 ns

With a low propagation delay, this product ensures quick data transfer within the shift register.

Maximum Frequency At Nominal Supply: 30000000 Hz

The high maximum frequency capability enables fast data processing, making it suitable for high-speed applications.

Technical Specifications

Digital Shift Registers M74HC165RM13TR attributes and parameters. Explore more Digital Shift Registers devices from STMicroelectronics

Specs

Additional Features:

CLOCK INHIBIT

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

30000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

28 MHz

Trade Compliance

M74HC165RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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