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M74HC164M1

STMicroelectronics

M74HC164M1 by STMicroelectronics

M74HC164M1 by STMicroelectronics is an 8-bit digital shift register with a propagation delay of 44 ns. Operating at a max frequency of 22 MHz, it has a supply voltage range of 2-6V and is suitable for industrial applications requiring positive edge triggering in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,505 parts In-Stock

1+ parts

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3,505

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Anansix

USA . 2,832 parts In-Stock

1+ parts

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2,832

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Digiode

USA . 1,137 parts In-Stock

1+ parts

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1,137

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,984 parts In-Stock

1+ parts

$10.048

100+ parts

-

1k+ parts

$9.043

10k+ parts

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1,984

$10.048

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$9.043

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MKK Technologies

India . 1,806 parts In-Stock

1+ parts

$18.895

100+ parts

-

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1,806

$18.895

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DigiPath Technology Company

USA . 1,806 parts In-Stock

1+ parts

$18.895

100+ parts

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1,806

$18.895

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Corphita

USA . 3,573 parts In-Stock

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3,573

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Parana Technologies

USA . 303 parts In-Stock

1+ parts

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100+ parts

$12.014

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303

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$12.014

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Overview

Upgrade your digital shift register experience with the M74HC164M1 from STMicroelectronics. Crafted with high-quality materials and advanced technology, this product offers a seamless solution for various applications. With a small outline package style and positive edge trigger type, it's perfect for industrial-grade projects that require precision and reliability. Boasting a maximum frequency of 22 MHz and a propagation delay of just 44 ns, this shift register ensures optimal performance at all times. Trust STMicroelectronics to deliver top-notch components that bring value, efficiency, and innovation to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy, the package body material ensures durability and protection for the internal components of the shift register.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Bits: 8

With 8 bits, this shift register can handle a range of data processing tasks with precision and efficiency.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures stable and consistent power delivery to the shift register, reducing the risk of malfunctions.

Propagation Delay (tpd): 44 ns

The low propagation delay of 44 ns ensures quick data transfer within the shift register, improving overall performance and speed.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this shift register can withstand high levels of heat, making it suitable for industrial applications.

Technology: CMOS

Using CMOS technology, this shift register offers low power consumption and high noise immunity, making it an energy-efficient and reliable choice.

Maximum Frequency At Nominal Supply: 22000000 Hz

With a maximum frequency of 22 MHz at nominal supply, this shift register can process data at high speeds, making it ideal for applications requiring quick data processing.

Technical Specifications

Digital Shift Registers M74HC164M1 attributes and parameters. Explore more Digital Shift Registers devices from STMicroelectronics

Specs

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

22000000 Hz

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2/6

Propagation Delay (tpd):

44 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

22 MHz

Trade Compliance

M74HC164M1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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