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M74HC251RM13TR

STMicroelectronics

M74HC251RM13TR by STMicroelectronics

STMicroelectronics M74HC251RM13TR is an 8-input multiplexer with a propagation delay of 48ns at 4.5V supply voltage. It operates in a temperature range of -55 to 125 °C, suitable for military-grade applications. With a compact small outline package and surface-mount capability, it offers high performance in various electronic systems.

Median Price

$0.400

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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DF Sales Co.

USA . 493 parts In-Stock

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DF Sales Co.

USA . 493 parts In-Stock

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$0.400

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ComSIT Distribution GmbH

Germany . 33,881 parts In-Stock

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Vyrian

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Digiode

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

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Dan-Mar Components

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Anansix

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J2 Sourcing AB

Sweden . 309 parts In-Stock

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Ashlea Components Ltd

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IDEA Electronic Components Group

UK . 1,760 parts In-Stock

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$7.806

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$7.026

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MKK Technologies

India . 1,586 parts In-Stock

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$14.679

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DigiPath Technology Company

USA . 1,586 parts In-Stock

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$14.679

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AZTECH Wire

Italy . 771 parts In-Stock

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$20.910

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Perfect Parts

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A-Z Elektronik GmbH

Germany . 6,506 parts In-Stock

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Microchip USA

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Alle Elektronik GmbH

Germany . 4,337 parts In-Stock

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Corphita

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Metaverse IC Inc.

Canada . 3,547 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Assy Fe

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QUARKTWIN TECHNOLOGY LTD

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Parana Technologies

USA . 1,554 parts In-Stock

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Authorized Procurement Solutions

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Glotronic Ltd.

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Kepictronics

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GreenTree Electronics

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Legend Electronics Inc. (Excess)

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Speed Components Ltd (Excess)

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Overview

Discover the innovative M74HC251RM13TR by STMicroelectronics, a premium multiplexer & demultiplexer designed to deliver exceptional performance and reliability. With a focus on quality and precision, STMicroelectronics ensures that every product meets the highest standards in the industry. Ideal for a wide range of applications, this versatile component offers customers unparalleled value and benefits. Trust in STMicroelectronics to provide cutting-edge solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the multiplexer/demultiplexer, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 48 ns

Low propagation delay ensures fast signal processing and efficient operation of the device.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

No. of Inputs: 8

Having 8 inputs allows for the multiplexing or demultiplexing of multiple signals simultaneously, increasing the versatility of the device.

Nominal Supply Voltage / Vsup (V): 4.5

The specified supply voltage ensures optimal performance of the multiplexer/demultiplexer within safe operating limits.

Load Capacitance (CL): 50 pF

The specified capacitance value helps in maintaining signal integrity and reducing distortion during data transmission.

Power Supplies (V): 2/6

Support for a range of power supply voltages allows for flexibility in different operating environments or applications.

Output Characteristics: 3-STATE

The 3-state output allows for high impedance output state, reducing power consumption and preventing bus contention.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and wide operating voltage range, making the device energy-efficient and reliable.

Technical Specifications

Multiplexer & Demultiplexer M74HC251RM13TR attributes and parameters. Explore more Multiplexer & Demultiplexer devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

48 ns

Propagation Delay (tpd):

195 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

M74HC251RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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