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M24LR64-RMN6T/2

STMicroelectronics

M24LR64-RMN6T/2 by STMicroelectronics

M24LR64-RMN6T/2 by STMicroelectronics is a 64Kb EEPROM with I2C interface, ideal for industrial applications. It operates at 1.8-5.5V, supports up to 1M write/erase cycles, and features a compact SO package (4.9x3.9mm). Its -40 °C to 85°C temp range ensures reliability in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,123 parts In-Stock

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8,123

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Chip Stock

USA . 4,332 parts In-Stock

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4,332

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Digiode

USA . 4,184 parts In-Stock

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4,184

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Rebound Electronics

UK . 1,524 parts In-Stock

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1,524

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Anansix

USA . 617 parts In-Stock

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617

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Martec Srl

Italy . 200 parts In-Stock

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200

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,298 parts In-Stock

1+ parts

$3.058

100+ parts

-

1k+ parts

$2.752

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1,298

$3.058

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$2.752

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MKK Technologies

India . 1,780 parts In-Stock

1+ parts

$5.751

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1,780

$5.751

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DigiPath Technology Company

USA . 1,780 parts In-Stock

1+ parts

$5.751

100+ parts

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1,780

$5.751

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Ampacity Inc.

Singapore . 334 parts In-Stock

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$10.000

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334

$10.000

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AZTECH Wire

Italy . 49 parts In-Stock

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$17.780

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49

$17.780

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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5,000

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A-Z Elektronik GmbH

Germany . 3,123 parts In-Stock

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Corphita

USA . 2,369 parts In-Stock

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2,369

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Parana Technologies

USA . 818 parts In-Stock

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$3.656

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818

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Perfect Parts

USA . 741 parts In-Stock

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741

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Overview

Unlock unparalleled data reliability with the M24LR64-RMN6T/2 EEPROM from STMicroelectronics, a leader in semiconductor innovation. This compact, surface-mount memory solution is designed for industrial applications where durability and efficiency are paramount. With exceptional endurance and low power consumption, it ensures your projects run smoothly while reducing energy costs. Elevate your designs with a trusted brand committed to quality, performance, and customer satisfaction.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides good durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern circuit boards.

Package Shape: RECTANGULAR

Rectangular shape optimizes layout for PCB design, maximizing space efficiency.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances data transfer rates and improves overall system performance.

Nominal Supply Voltage / Vsup (V): 2.5

Nominal voltage of 2.5V is compatible with low-power applications, making it energy efficient.

Power Supplies (V): 2/5

Supports a range of supply voltages (2V to 5V), offering flexibility in various circuit designs.

No. of Terminals: 8

An 8-terminal configuration simplifies connection and integration with other components.

Package Style (Meter): SMALL OUTLINE

Small outline package style is ideal for space-constrained applications.

Alternate Memory Width: 8

8-bit memory width allows efficient data handling and processing.

Maximum Operating Temperature: 85 °C

High maximum operating temperature suitable for industrial applications where heat can be a factor.

Organization: 2KX32

The 2Kx32 organization allows for efficient data storage and retrieval.

Minimum Operating Temperature: -40 °C

Wide temperature range (-40 °C to 85°C) ensures reliability in extreme environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish provides excellent conductivity and corrosion resistance.

I2C Control Byte: 1010CDDR

I2C protocol support enables seamless communication with microcontrollers and other devices.

Terminal Position: DUAL

Dual terminal position enhances layout flexibility on PCBs.

Write Protection: SOFTWARE

Software-based write protection enhances security against accidental data corruption.

Maximum Seated Height: 1.75 mm

Compact seated height of 1.75 mm allows for low-profile designs.

Maximum Clock Frequency (fCLK): 0.4 MHz

A maximum clock frequency of 0.4 MHz ensures adequate speed for most applications.

Width: 3.9 mm

Narrow width of 3.9 mm facilitates fitting in tight spaces on PCBs.

Minimum Supply Voltage (Vsup): 1.8 V

Supports a minimum supply voltage of 1.8V, further enhancing compatibility with low-voltage systems.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures, ensuring reliability during soldering processes.

Peak Reflow Temperature °C: 260

A high peak reflow temperature of 260 °C ensures compatibility with most soldering techniques.

Length: 4.9 mm

Compact length of 4.9 mm aids in fitting greater density into boards.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring durability under demanding conditions.

Technology: CMOS

CMOS technology enhances performance and minimizes power consumption.

Parallel or Serial: SERIAL

Serial interface simplifies connections and reduces pin count requirements.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and reliability.

Maximum Supply Current: 0.7 mA

Low maximum supply current (0.7 mA) supports battery-operated and energy-sensitive applications.

No. of Words: 2048 words

2048 words of memory provides ample data storage for diverse applications.

Memory Width: 32

32-bit memory width enables efficient handling of larger data sets.

Minimum Data Retention Time: 40

Data retention time of 40 years ensures that stored information remains intact over long periods.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch is a standard size that simplifies manufacturing and assembly.

No. of Words Code: 2K

The designation of 2K words indicates suitable applications in consumer electronics and automotive sectors.

Maximum Supply Voltage (Vsup): 5.5 V

Can operate at up to 5.5V, allowing for greater flexibility in supply choices.

Endurance: 1000000 Write/Erase Cycles

High endurance rating ensures reliability and longevity in data storage applications.

Serial Bus Type: I2C

The I2C serial bus type allows for efficient communication between multiple devices in a system.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time (5 ms) enhances performance in applications needing quick data updates.

Memory Density: 65536 bit

High memory density enables complex data storage requirements in compact designs.

Memory IC Type: EEPROM

The EEPROM memory type allows for non-volatile storage, ensuring data is retained without power.

Maximum Standby Current: 0.00003 Amp

Extremely low standby current (0.00003 Amp) reduces power consumption during idle states.

Technical Specifications

EEPROM M24LR64-RMN6T/2 attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010CDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

32

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX32

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.00003 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

.7 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

SOFTWARE

Trade Compliance

M24LR64-RMN6T/2 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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