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M24C04-FMB5TG

STMicroelectronics

M24C04-FMB5TG by STMicroelectronics

M24C04-FMB5TG from STMicroelectronics is a 4096-bit EEPROM with a synchronous operating mode and I2C interface. It features a wide supply voltage range (1.8-5V), operates at temperatures from -20 °C to 85 °C, and supports up to 1M write/erase cycles. Ideal for compact applications requiring reliable data storage in small electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 13,056 parts In-Stock

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13,056

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Digiode

USA . 1,492 parts In-Stock

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1,492

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Anansix

USA . 572 parts In-Stock

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DF Sales Co.

USA . 360 parts In-Stock

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DF Sales Co.

USA . 360 parts In-Stock

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360

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Prism Electronics

USA . 265 parts In-Stock

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265

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Microchip USA

USA . 302 parts In-Stock

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$3.184

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IDEA Electronic Components Group

UK . 398 parts In-Stock

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$5.100

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$4.590

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398

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$4.590

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MKK Technologies

India . 2,281 parts In-Stock

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$9.589

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$9.589

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DigiPath Technology Company

USA . 2,281 parts In-Stock

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$9.589

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AZTECH Wire

Italy . 982 parts In-Stock

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$20.630

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Corphita

USA . 3,580 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Perfect Parts

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Parana Technologies

USA . 104 parts In-Stock

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$6.097

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Overview

Unlock the potential of your designs with the M24C04-FMB5TG EEPROM from STMicroelectronics, a leader in high-quality semiconductor solutions. This compact, reliable memory chip offers exceptional endurance and write protection, ensuring your data stays secure. Perfect for a wide range of applications—from consumer electronics to industrial automation—the M24C04 enhances performance while optimizing power consumption. Experience innovation and trust in every byte!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures reliable performance and ease of integration into electronic designs.

Surface Mount: YES

Surface mount capability allows for compact designs and simplifies the manufacturing process.

Package Shape: RECTANGULAR

Rectangular package shape enhances space efficiency on PCBs.

Operating Mode: SYNCHRONOUS

Synchronous operation provides faster data access and improved efficiency in communication.

Nominal Supply Voltage / Vsup: 2.5 V

Operating at a nominal supply voltage enhances energy efficiency and is suitable for low-power applications.

Power Supplies: 1.8/5 V

Flexible power supply options allow for versatile applications across different systems.

No. of Terminals: 8

Eight terminals provide necessary connections while enabling compact configurations.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Small outline and thin profile facilitate space-saving designs with potential thermal management benefits.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Organization: 512X8

Efficient memory organization optimizes data storage and retrieval processes.

Minimum Operating Temperature: -20 °C

Ability to operate at low temperatures expands usability in diverse applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish improves conductivity and enhances solderability.

I2C Control Byte: 1010DDMR

I2C compatibility enables easy integration with a wide range of microcontrollers and other devices.

Terminal Position: DUAL

Dual terminal positioning facilitates easier PCB layout options.

Write Protection: HARDWARE

Hardware write protection feature enhances data security and prevents accidental data loss.

Maximum Seated Height: 0.6 mm

Minimal seated height supports low-profile designs and saves vertical space on PCBs.

Maximum Clock Frequency (fCLK): 0.4 MHz

A maximum clock frequency of 0.4 MHz balances speed and power consumption.

Width: 2 mm

Compact width ensures compatibility with space-constrained environments.

Minimum Supply Voltage (Vsup): 1.7 V

Low minimum supply voltage promotes energy efficiency, ideal for battery-powered devices.

Length: 3 mm

Compact length aids in efficient space management on PCB layouts.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Parallel or Serial: SERIAL

Serial communication reduces the number of required connections, saving PCB space.

Terminal Form: NO LEAD

No lead form minimizes footprint on the PCB and contributes to reliable connections.

Maximum Supply Current: 0.8 mA

Low maximum supply current promotes long battery life in portable applications.

No. of Words: 512 words

512 words of storage capacity provide sufficient space for a variety of applications.

Memory Width: 8

An 8-bit memory width is standard in EEPROM applications, compatible with most microcontrollers.

Minimum Data Retention Time: 40 years

Long data retention time ensures reliability and longevity of stored information.

Terminal Pitch: 0.5 mm

Fine terminal pitch supports high-density PCB layouts, enhancing design flexibility.

No. of Words Code: 512

Consistency in word count promotes reliable design and compatibility across products.

Maximum Supply Voltage (Vsup): 5.5 V

Wide maximum supply voltage range allows for use in diverse power supply environments.

Endurance: 1000000 Write/Erase Cycles

High endurance supports extensive usage in applications requiring frequent data updates.

Serial Bus Type: I2C

I2C bus compatibility simplifies connections and communication with multiple devices.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time enhances overall system performance and response times.

Memory Density: 4096 bit

4096 bits of memory density offers adequate storage for various embedded applications.

Memory IC Type: EEPROM

EEPROM type memory ensures non-volatile data storage, critical for preserving information during power loss.

Maximum Standby Current: 0.000001 Amp

Extremely low standby current minimizes power consumption, making it ideal for battery-operated devices.

Technical Specifications

EEPROM M24C04-FMB5TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDMR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

.8 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C04-FMB5TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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