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M24C01-RDS6TG

STMicroelectronics

M24C01-RDS6TG by STMicroelectronics

M24C01-RDS6TG from STMicroelectronics is a 1024-bit EEPROM with I2C interface, ideal for industrial applications. It operates at 1.8V to 5.5V and supports up to 1M write/erase cycles. With a compact size of 3mm x 3mm, it ensures efficient space utilization in designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,191 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,191

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-

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Digiode

USA . 3,683 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,683

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Anansix

USA . 1,642 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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1,642

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 752 parts In-Stock

1+ parts

$4.115

100+ parts

-

1k+ parts

$3.704

10k+ parts

-

752

$4.115

-

$3.704

-

MKK Technologies

India . 1,406 parts In-Stock

1+ parts

$7.738

100+ parts

-

1k+ parts

-

10k+ parts

-

1,406

$7.738

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-

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DigiPath Technology Company

USA . 1,406 parts In-Stock

1+ parts

$7.738

100+ parts

-

1k+ parts

-

10k+ parts

-

1,406

$7.738

-

-

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AZTECH Wire

Italy . 162 parts In-Stock

1+ parts

$14.090

100+ parts

-

1k+ parts

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10k+ parts

-

162

$14.090

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-

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Microchip USA

USA . 263 parts In-Stock

1+ parts

$68.294

100+ parts

-

1k+ parts

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10k+ parts

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263

$68.294

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Corphita

USA . 2,529 parts In-Stock

1+ parts

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2,529

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Parana Technologies

USA . 413 parts In-Stock

1+ parts

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100+ parts

$4.920

1k+ parts

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10k+ parts

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413

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$4.920

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Overview

Unlock the power of reliable data storage with STMicroelectronics' M24C01-RDS6TG EEPROM. This compact, high-quality solution is designed for a wide range of applications, from industrial automation to consumer electronics. Benefit from its robust performance, including low power consumption and exceptional endurance, ensuring your devices operate smoothly in any environment. Trust STMicroelectronics—where innovation meets quality—to enhance your designs and deliver lasting value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures reliability and longevity in various applications.

Surface Mount: YES

Surface mount design allows for compact PCB layouts, making it ideal for space-constrained applications.

Package Shape: SQUARE

Square package shape optimizes the use of board space and enhances integration into devices.

Operating Mode: SYNCHRONOUS

Synchronous operation improves speed and efficiency during data transactions.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage simplifies integration into existing systems.

Power Supplies (V): 2/5

Provides flexibility in power supply options, accommodating a variety of designs.

No. of Terminals: 8

Compact 8-terminal design minimizes space usage while providing necessary connections.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Small outline and thin profile facilitate easy placement in dense environments.

Maximum Operating Temperature: 85 °C

Able to function effectively in high temperature environments, ensuring stability.

Organization: 128X8

Memory organization supports efficient data storage and access patterns.

Minimum Operating Temperature: -40 °C

Operational in extreme cold ensures reliability in varied environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish improves solderability and prevents oxidation.

I2C Control Byte: 1010DDDR

Provides compatibility with I2C protocol, facilitating easy integration with microcontrollers.

Terminal Position: DUAL

DUAL terminal position enhances wiring flexibility and simplifies PCB layout.

Write Protection: HARDWARE

Hardware write protection ensures data integrity and security against accidental writes.

Maximum Seated Height: 1.1 mm

Low profile design allows for slim device profiles and fits into tight spaces.

Maximum Clock Frequency (fCLK): 0.4 MHz

Moderate clock frequency balances speed and power consumption for efficient operations.

Width: 3 mm

Compact width makes it a versatile choice for miniature designs.

Minimum Supply Voltage (Vsup): 1.8 V

Supports low voltage systems, enhancing power efficiency in portable applications.

Length: 3 mm

Short length complements its compact design, ideal for small form-factor devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability in demanding industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Parallel or Serial: SERIAL

Serial interface reduces pin count, simplifying connections and saving board space.

Terminal Form: GULL WING

Gull wing terminals provide ease of handling and improve soldering reliability.

Maximum Supply Current: 0.8 mA

Low supply current enables extended battery life in portable applications.

No. of Words: 128 words

Generous word count allows for substantial data storage in compact devices.

Memory Width: 8

8-bit memory width allows for efficient data transfer and manipulation.

Minimum Data Retention Time: 40 years

Long data retention time ensures that stored data remains intact for extended periods.

Terminal Pitch: 0.65 mm

Tight terminal pitch maximizes connectivity in high-density applications.

No. of Words Code: 128

Sufficiently accommodates a variety of applications needing data storage.

Maximum Supply Voltage (Vsup): 5.5 V

Flexibility in supply voltage range supports diverse system designs.

Endurance: 1,000,000 Write/Erase Cycles

High endurance rating ensures long-term usage in frequently updated systems.

Serial Bus Type: I2C

I2C support facilitates easy communication with various devices in most applications.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle time enhances performance for applications requiring quick data updates.

Memory Density: 1024 bit

Provides a balanced memory density ideal for many embedded applications.

Memory IC Type: EEPROM

EEPROM technology allows for non-volatile storage, perfect for retaining data after power loss.

Maximum Standby Current: 0.000001 Amp

Ultra-low standby current prolongs battery life, making it suitable for battery-powered applications.

Technical Specifications

EEPROM M24C01-RDS6TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

.8 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C01-RDS6TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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