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M24128T-FCU6T/TF

STMicroelectronics

M24128T-FCU6T/TF by STMicroelectronics

M24128T-FCU6T/TF by STMicroelectronics is a 16Kx8 EEPROM with a compact square package, ideal for space-constrained applications. It operates at a nominal voltage of 1.8V and supports I2C serial communication. With an industrial temperature range of -40 °C to 85 °C, it ensures reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,213 parts In-Stock

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3,213

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Anansix

USA . 2,802 parts In-Stock

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2,802

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Digiode

USA . 979 parts In-Stock

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979

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 567 parts In-Stock

1+ parts

$5.135

100+ parts

-

1k+ parts

$4.621

10k+ parts

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567

$5.135

-

$4.621

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Microchip USA

USA . 267 parts In-Stock

1+ parts

$7.392

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-

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267

$7.392

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MKK Technologies

India . 2,100 parts In-Stock

1+ parts

$9.655

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2,100

$9.655

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DigiPath Technology Company

USA . 2,100 parts In-Stock

1+ parts

$9.655

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2,100

$9.655

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-

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AZTECH Wire

Italy . 107 parts In-Stock

1+ parts

$12.670

100+ parts

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107

$12.670

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Component Stockers USA

USA . 445 parts In-Stock

1+ parts

$99.990

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445

$99.990

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Corphita

USA . 2,400 parts In-Stock

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2,400

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Parana Technologies

USA . 2,039 parts In-Stock

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$6.139

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2,039

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$6.139

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Overview

Unlock the future of reliable data storage with the M24128T-FCU6T/TF EEPROM from STMicroelectronics. Renowned for its innovation and quality, STMicroelectronics delivers a compact solution that thrives in demanding environments, operating smoothly from -40 °C to 85 °C. Ideal for industrial applications, this EEPROM guarantees low power consumption and swift performance, ensuring your designs remain efficient and cutting-edge. Elevate your projects with unmatched reliability and advanced technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures good protection and reliability, enhancing the lifespan of the EEPROM.

Surface Mount: YES

Surface mount capability allows for efficient use of PCB space and enables automated assembly processes, which reduces manufacturing costs.

Package Shape: SQUARE

A square shape optimizes the layout and spacing on the PCB, facilitating easier integration into various devices.

Operating Mode: SYNCHRONOUS

Synchronous operation improves speed and efficiency during data transfers, making it suitable for high-performance applications.

Nominal Supply Voltage / Vsup: 1.8 V

Low operating voltage of 1.8V contributes to lower power consumption, making it ideal for battery-powered and energy-efficient devices.

No. of Terminals: 4

The 4-terminal design simplifies circuit connections, making it easy to integrate into various electronic systems.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array design with a thin profile allows for high-density mounting, which is crucial in compact and space-constrained environments.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures reliability in a range of industrial applications where higher temperatures may be encountered.

Organization: 16KX8

The organization of 16KX8 allows for a considerable amount of data storage, sufficient for various applications needing moderate memory.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C is indicative of its robustness for use in extreme environments, making it a versatile choice for industrial applications.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates efficient heat dissipation and optimizes layout in many PCB designs.

Maximum Seated Height: 0.33 mm

The low seated height allows for better fitting in ultra-thin designs, relevant for modern compact electronics.

Maximum Clock Frequency (fCLK): 1 MHz

With a clock frequency of 1 MHz, the EEPROM can manage moderate data speeds, suitable for many applications without requiring high-speed interfaces.

Width: 0.833 mm

A narrow width allows for high-density placements, which is imperative in contemporary miniaturized devices.

Minimum Supply Voltage (Vsup): 1.7 V

A minimum supply voltage of 1.7V ensures flexibility in power supply design, accommodating various project requirements.

Length: 0.833 mm

The short length is appropriate for compact PCB designs, maintaining a small footprint while maximizing performance.

Temperature Grade: INDUSTRIAL

Industrial-grade components are designed for reliability and longevity in demanding environments, suitable for critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing performance in various electronic applications.

Parallel or Serial: SERIAL

Serial interface simplifies connections and reduces pin count, making it efficient for modern communication needs.

Terminal Form: BALL

Ball terminal design improves connection reliability and reduces the risk of damage during installation, ensuring durability.

No. of Words: 16384 words

With 16384 words of storage, it provides enough capacity for many tasks while maintaining a compact design.

Memory Width: 8

An 8-bit memory width is ideal for handling byte-oriented data operations effectively, catering to a variety of applications.

Terminal Pitch: 0.4 mm

A 0.4 mm pitch allows for high-density packing of components, which is essential for modern electronic circuit design.

No. of Words Code: 16K

The 16K specification ensures sufficient data storage for various applications, striking a balance between complexity and usability.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V provides flexibility for use with different voltage levels in electronic systems.

Serial Bus Type: I2C

The I2C bus type enables easy integration with other devices and simplifies communication within complex systems.

Maximum Write Cycle Time (tWC): 5 ms

At 5 ms per write cycle, this EEPROM is efficient for applications requiring frequent updates without significant delays.

Memory Density: 131072 bit

The high memory density allows for storing a large amount of information in a compact space, increasing design possibilities.

Memory IC Type: EEPROM

As an EEPROM, it supports non-volatile storage, ensuring that data is retained even when power is removed, ideal for saving configuration and calibration data.

Technical Specifications

EEPROM M24128T-FCU6T/TF attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

1 MHz

JESD-30 Code:

S-PBGA-B4

Length:

.833 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

4

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.33 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.833 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

M24128T-FCU6T/TF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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