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M24128-BFCS6TP/A

STMicroelectronics

M24128-BFCS6TP/A by STMicroelectronics

M24128-BFCS6TP/A by STMicroelectronics is a 16Kx8 EEPROM with a synchronous operating mode and I2C interface. It operates b/w -40 °C to 85°C, supports up to 5.5V supply, and features hardware write protection for reliable data retention. Ideal for industrial applications requiring compact memory solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,321 parts In-Stock

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3,321

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Digiode

USA . 2,654 parts In-Stock

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2,654

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ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

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2,500

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ComSIT USA

USA . 2,500 parts In-Stock

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2,500

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Anansix

USA . 1,247 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 612 parts In-Stock

1+ parts

$2.664

100+ parts

-

1k+ parts

$2.398

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612

$2.664

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$2.398

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Microchip USA

USA . 110 parts In-Stock

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$4.822

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110

$4.822

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MKK Technologies

India . 2,155 parts In-Stock

1+ parts

$5.010

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2,155

$5.010

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DigiPath Technology Company

USA . 2,155 parts In-Stock

1+ parts

$5.010

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2,155

$5.010

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AZTECH Wire

Italy . 611 parts In-Stock

1+ parts

$21.910

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611

$21.910

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Kepictronics

USA . 12,888 parts In-Stock

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12,888

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A-Z Elektronik GmbH

Germany . 7,197 parts In-Stock

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7,197

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Alle Elektronik GmbH

Germany . 4,798 parts In-Stock

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4,798

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Corphita

USA . 3,569 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 287 parts In-Stock

1+ parts

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$3.186

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287

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$3.186

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Futuretech Components

Singapore . 100 parts In-Stock

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100

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Overview

Unlock unparalleled reliability with the M24128-BFCS6TP/A from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance EEPROM chip seamlessly integrates into diverse applications, from industrial automation to consumer electronics, delivering exceptional endurance and efficiency. With superior data retention and robust write protection, it empowers your designs with both quality and peace of mind, ensuring optimal performance in any environment. Transform your projects with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this EEPROM reliable in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, making this EEPROM suitable for modern electronics.

Package Shape: RECTANGULAR

A rectangular package shape offers excellent space efficiency on PCBs, facilitating better layout flexibility in system design.

Operating Mode: SYNCHRONOUS

Synchronous operation enables faster data transfer, contributing to better overall performance in applications requiring quick memory access.

Nominal Supply Voltage / Vsup: 1.8 V

With a low voltage operation at 1.8 V, this EEPROM is energy-efficient, making it ideal for battery-powered devices.

Power Supplies (V): 2/5

Versatile supply voltage requirements (between 2V and 5V) allow for compatibility with various power systems, enhancing design flexibility.

No. of Terminals: 8

An 8-terminal design supports a wide range of applications and circuit configurations without excessive complexity.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This style enhances the performance of high-density applications, making it suitable for modern electronic devices where space is critical.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this EEPROM is suitable for industrial applications where temperature management is crucial.

Organization: 16KX8

The memory organization provides 128 KB of data storage, adequate for a variety of applications including microcontrollers and sensors.

Minimum Operating Temperature: -40 °C

A wide operating temperature range (-40 °C to 85 °C) ensures reliable performance in extreme conditions, suitable for industrial environments.

I2C Control Byte: 1010DDDR

The I2C control byte allows for easy integration into I2C communication systems, ensuring effective communication with microcontrollers.

Terminal Position: BOTTOM

Bottom terminal positioning can improve soldering quality and connection stability on the PCB, enhancing overall product reliability.

Write Protection: HARDWARE

Hardware write protection safeguards data integrity, making this EEPROM ideal for applications that require security against unintended writes.

Maximum Seated Height: 0.635 mm

A very low profile of 0.635 mm supports high-density designs where space limitation is a concern.

Maximum Clock Frequency (fCLK): 0.4 MHz

A maximum clock frequency of 0.4 MHz supports sufficient speed for many applications, thereby enhancing performance efficiency.

Width: 1.4 mm

A width of 1.4 mm allows for compact designs, making it suitable for applications with strict space requirements.

Minimum Supply Voltage (Vsup): 1.7 V

Working at a minimum supply voltage of 1.7 V allows for compatibility with a wider range of power sources and improves energy efficiency.

Length: 1.805 mm

A small length of 1.805 mm enables use in tight spaces, making this EEPROM ideal for miniaturized electronics.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature conditions, this EEPROM is designed to operate reliably in demanding environments.

Technology: CMOS

CMOS technology supports low power consumption, which is crucial for extending battery life in portable devices.

Parallel or Serial: SERIAL

The serial interface simplifies communication and minimizes pin count, making this EEPROM suitable for space-constrained applications.

Terminal Form: BALL

Ball terminal form allows for better electrical connection and easier soldering, improving assembly reliability.

Maximum Supply Current: 3 mA

A maximum supply current of 3 mA ensures energy efficiency during operation, making it ideal for low-power applications.

No. of Words: 16384 words

The capacity for 16,384 words provides substantial storage for applications like configuration settings in various devices.

Memory Width: 8

An 8-bit memory width can efficiently handle standard data formats, enhancing compatibility with various systems.

Minimum Data Retention Time: 40 years

With a minimum data retention time of 40 years, this EEPROM ensures long-term data integrity, perfect for critical applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for compact PCB layouts, maintaining high density without sacrificing reliability.

No. of Words Code: 16K

The 16K words code supports extensive data storage for diverse applications, ensuring versatility and adaptability.

Maximum Supply Voltage (Vsup): 5.5 V

This EEPROM can operate at a maximum voltage of 5.5 V, ensuring flexibility for designs with varying power supply levels.

Endurance: 1000000 Write/Erase Cycles

An endurance rating of 1 million write/erase cycles provides excellent durability for applications that require frequent updates.

Serial Bus Type: I2C

The I2C serial bus type allows for easy connection and communication with multiple devices, enhancing system integration.

Maximum Write Cycle Time (tWC): 5 ms

A maximum write cycle time of 5 ms ensures quick data updates, making it suitable for real-time data logging applications.

Memory Density: 131072 bit

With a memory density of 131,072 bits, this EEPROM offers robust storage capabilities while maintaining a compact footprint.

Memory IC Type: EEPROM

Being an EEPROM memory IC ensures non-volatile data retention, which is essential for saving settings in consumer electronics.

Maximum Standby Current: 0.000001 Amp

A maximum standby current of just 1 µA minimizes power consumption during idle periods, optimizing battery life in portable applications.

Technical Specifications

EEPROM M24128-BFCS6TP/A attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PBGA-B8

Length:

1.805 mm

Memory Density:

131072 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA8,3X5,17/10

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

.635 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.4 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24128-BFCS6TP/A Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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