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LIS2DW12

STMicroelectronics

LIS2DW12 by STMicroelectronics

LIS2DW12 by STMicroelectronics is a square-shaped, surface-mountable IC with 12 terminals. It operates b/w -40°C to 85°C and has a supply voltage range of 1.62V to 3.6V. This industrial-grade analog circuit is ideal for applications requiring precise motion sensing in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Sense

UK . 50,000 parts In-Stock

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50,000

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Cyclops Electronics Ltd

UK . 7,170 parts In-Stock

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7,170

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Digiode

USA . 3,901 parts In-Stock

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3,901

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Vyrian

USA . 626 parts In-Stock

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626

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Anansix

USA . 382 parts In-Stock

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382

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 76 parts In-Stock

1+ parts

$1.359

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-

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76

$1.359

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Ampacity Inc.

Singapore . 717 parts In-Stock

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$3.500

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-

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717

$3.500

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Semicontronic

India . 208 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

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$4.365

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208

$4.500

$4.388

$4.365

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Aztec Data Supply Inc.

USA . 720 parts In-Stock

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$7.956

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720

$7.956

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AZTECH Wire

Italy . 753 parts In-Stock

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$7.987

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753

$7.987

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IDEA Electronic Components Group

UK . 639 parts In-Stock

1+ parts

$13.489

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$12.140

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639

$13.489

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$12.140

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MKK Technologies

India . 331 parts In-Stock

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$25.365

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331

$25.365

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DigiPath Technology Company

USA . 331 parts In-Stock

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$25.365

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331

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Component Connect

USA . 2,996,792 parts In-Stock

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S.R.D Solutions

India . 540,000 parts In-Stock

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Lixinc

USA . 5,100 parts In-Stock

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GreenTree Electronics

Israel . 4,141 parts In-Stock

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Continental Prestige Electronics

USA . 3,626 parts In-Stock

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Corphita

USA . 1,440 parts In-Stock

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Parana Technologies

USA . 922 parts In-Stock

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$16.128

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$16.128

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Argo Parts USA

USA . 105 parts In-Stock

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105

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Bastille Electronics

Australia . 82 parts In-Stock

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82

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Advanced Electronics

New Zealand . 50 parts In-Stock

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50

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Overview

Experience superior quality and innovation with the LIS2DW12 by STMicroelectronics. As a leading manufacturer in the semiconductor industry, STMicroelectronics delivers cutting-edge technology in a compact and versatile package. This product opens up a world of possibilities in various applications, providing customers with unbeatable value and performance. Trust in STMicroelectronics to bring you the best in quality and reliability with the LIS2DW12.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes it easy to integrate this semiconductor into various electronic devices, reducing the need for complex wiring and saving space on the PCB.

Package Shape: SQUARE

The square package shape allows for more efficient use of space on the PCB, making it suitable for compact electronic designs.

Nominal Supply Voltage (Vsup): 1.8 V

The nominal supply voltage of 1.8V offers a balance between power consumption and performance, making it suitable for a wide range of applications.

No. of Terminals: 12

Having 12 terminals allows for a greater degree of connectivity and functionality, making this semiconductor versatile in its application.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch enables high-density mounting and enhances reliability in various electronic systems.

Maximum Operating Temperature: 85°C

With a maximum operating temperature of 85°C, this semiconductor can withstand high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40°C

The semiconductor's ability to operate in temperatures as low as -40°C ensures reliable performance in extreme cold conditions.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and enhances thermal performance, contributing to the overall reliability of the semiconductor.

Maximum Seated Height: 0.7 mm

The low maximum seated height of 0.7 mm allows for compact and slim designs, ideal for space-constrained electronic devices.

Width (mm): 2 mm

The width of 2 mm offers compatibility with standard PCB designs and allows for easy integration into various electronic systems.

Other IC type: ANALOG CIRCUIT

Being an analog circuit type, this semiconductor is well-suited for applications requiring accurate signal processing and conversion, making it a versatile choice.

Minimum Supply Voltage (Vsup): 1.62 V

The minimum supply voltage of 1.62V ensures operational stability even with low input voltage levels, making it suitable for battery-powered devices.

Length: 2 mm

With a length of 2 mm, this semiconductor can be easily accommodated in compact electronic designs without sacrificing performance.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designation indicates that this semiconductor is designed to operate reliably in harsh industrial environments, offering high durability and performance.

Terminal Form: BUTT

The butt terminal form simplifies the soldering process and ensures secure connections, contributing to the overall reliability of the semiconductor.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density mounting and precise connectivity, making this semiconductor suitable for advanced electronic systems.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V provides flexibility in power supply options and allows for compatibility with a wide range of electronic devices.

Technical Specifications

Other Function Semiconductors LIS2DW12 attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-XBGA-B12

Length:

2 mm

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.7 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.62 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BUTT

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2 mm

Trade Compliance

LIS2DW12 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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